IT1231457B - Procedimento per la realizzazione della messa a massa di isolamenti multistrato (coperte termiche) per applicazioni spaziali - Google Patents

Procedimento per la realizzazione della messa a massa di isolamenti multistrato (coperte termiche) per applicazioni spaziali

Info

Publication number
IT1231457B
IT1231457B IT8947808A IT4780889A IT1231457B IT 1231457 B IT1231457 B IT 1231457B IT 8947808 A IT8947808 A IT 8947808A IT 4780889 A IT4780889 A IT 4780889A IT 1231457 B IT1231457 B IT 1231457B
Authority
IT
Italy
Prior art keywords
layer
insulations
layers
procedure
massing
Prior art date
Application number
IT8947808A
Other languages
English (en)
Other versions
IT8947808A0 (it
Inventor
Danilo Marzi
Roger A Stonier
Original Assignee
Selenia Spazio Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Selenia Spazio Spa filed Critical Selenia Spazio Spa
Priority to IT8947808A priority Critical patent/IT1231457B/it
Publication of IT8947808A0 publication Critical patent/IT8947808A0/it
Priority to US07/502,434 priority patent/US5111354A/en
Priority to CA002013682A priority patent/CA2013682A1/en
Priority to EP90106327A priority patent/EP0391327B1/en
Priority to AT90106327T priority patent/ATE110925T1/de
Priority to DE69011920T priority patent/DE69011920T2/de
Application granted granted Critical
Publication of IT1231457B publication Critical patent/IT1231457B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Building Environments (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Aiming, Guidance, Guns With A Light Source, Armor, Camouflage, And Targets (AREA)
  • Insulating Bodies (AREA)
  • Paper (AREA)
IT8947808A 1989-04-03 1989-04-03 Procedimento per la realizzazione della messa a massa di isolamenti multistrato (coperte termiche) per applicazioni spaziali IT1231457B (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IT8947808A IT1231457B (it) 1989-04-03 1989-04-03 Procedimento per la realizzazione della messa a massa di isolamenti multistrato (coperte termiche) per applicazioni spaziali
US07/502,434 US5111354A (en) 1989-04-03 1990-03-30 Process for the perfecting of the grounding of multi-layer insulations (thermal blankets) for space applications
CA002013682A CA2013682A1 (en) 1989-04-03 1990-04-03 Process for the perfecting of the grounding of multi-layer insulations (thermal blankets)
EP90106327A EP0391327B1 (en) 1989-04-03 1990-04-03 Method and apparatus for grounding multi-layer insulations, especially for space structures
AT90106327T ATE110925T1 (de) 1989-04-03 1990-04-03 Verfahren und gerät, das die isolierungen einer mehrebenenschaltung mit der masse verbindet, insbesondere für räumliche strukturen.
DE69011920T DE69011920T2 (de) 1989-04-03 1990-04-03 Verfahren und Gerät, das die Isolierungen einer Mehrebenenschaltung mit der Masse verbindet, insbesondere für räumliche Strukturen.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8947808A IT1231457B (it) 1989-04-03 1989-04-03 Procedimento per la realizzazione della messa a massa di isolamenti multistrato (coperte termiche) per applicazioni spaziali

Publications (2)

Publication Number Publication Date
IT8947808A0 IT8947808A0 (it) 1989-04-03
IT1231457B true IT1231457B (it) 1991-12-07

Family

ID=11262645

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8947808A IT1231457B (it) 1989-04-03 1989-04-03 Procedimento per la realizzazione della messa a massa di isolamenti multistrato (coperte termiche) per applicazioni spaziali

Country Status (6)

Country Link
US (1) US5111354A (it)
EP (1) EP0391327B1 (it)
AT (1) ATE110925T1 (it)
CA (1) CA2013682A1 (it)
DE (1) DE69011920T2 (it)
IT (1) IT1231457B (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4228665C1 (de) * 1992-08-28 1994-04-21 Dornier Gmbh Clip
FR2695290A1 (fr) * 1992-09-02 1994-03-04 Philips Electronics Nv Circuit pour des fréquences élevées, et procédé pour le réaliser.
US5457610A (en) * 1993-06-01 1995-10-10 Motorola, Inc. Low profile mechanical interconnect system having metalized loop and hoop area
US5494755A (en) * 1994-06-08 1996-02-27 Lockheed Missiles & Space Co., Inc. Passive intermodulation products (PIM) free tape
US6981671B1 (en) * 2001-03-28 2006-01-03 The United States Of America As Represented By The Secretary Of The Air Force Airframe structure-integrated capacitor
US7014143B2 (en) * 2002-10-11 2006-03-21 The Boeing Company Aircraft lightning strike protection and grounding technique
US9944445B2 (en) 2015-05-14 2018-04-17 Gerald C Altomare Apparatus and method of embedding articles within reclosable fastener systems
EP3339189B1 (en) * 2016-12-23 2020-06-17 Airbus Defence and Space GmbH Electrically connecting multi-layer insulation blankets

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3857994A (en) * 1973-04-09 1974-12-31 Nat Telephone Supply Co Non-corrosive cable shield bond
DE7705759U1 (de) * 1977-02-25 1977-06-02 Robert Bosch Gmbh, 7000 Stuttgart Gehäuse für elektronische Geräte
DE2833480C3 (de) * 1978-07-31 1982-02-18 Siemens AG, 1000 Berlin und 8000 München Schaltungsplatte für die elektrische Nachrichtentechnik
US4329731A (en) * 1980-04-30 1982-05-11 Communications Satellite Corporation Discharge suppressing dielectric film for use on spacecraft surfaces
US4623951A (en) * 1982-05-24 1986-11-18 Hughes Aircraft Company Electrically conductive composite structure
JPH0627995Y2 (ja) * 1986-03-20 1994-07-27 株式会社東芝 シ−ルド構造
US4768286A (en) * 1986-10-01 1988-09-06 Eastman Christensen Co. Printed circuit packaging for high vibration and temperature environments

Also Published As

Publication number Publication date
EP0391327B1 (en) 1994-08-31
US5111354A (en) 1992-05-05
EP0391327A1 (en) 1990-10-10
ATE110925T1 (de) 1994-09-15
DE69011920D1 (de) 1994-10-06
CA2013682A1 (en) 1990-10-03
IT8947808A0 (it) 1989-04-03
DE69011920T2 (de) 1995-05-04

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19940428