IT1215268B - APPARATUS AND METHOD FOR THE PERFECT PACKAGING OF SEMICONDUCTIVE DEVICES. - Google Patents

APPARATUS AND METHOD FOR THE PERFECT PACKAGING OF SEMICONDUCTIVE DEVICES.

Info

Publication number
IT1215268B
IT1215268B IT8520504A IT2050485A IT1215268B IT 1215268 B IT1215268 B IT 1215268B IT 8520504 A IT8520504 A IT 8520504A IT 2050485 A IT2050485 A IT 2050485A IT 1215268 B IT1215268 B IT 1215268B
Authority
IT
Italy
Prior art keywords
semiconductive devices
perfect packaging
perfect
packaging
semiconductive
Prior art date
Application number
IT8520504A
Other languages
Italian (it)
Other versions
IT8520504A0 (en
Inventor
Carlo Cognetti De Martiis
Original Assignee
Ates Componenti Elettron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ates Componenti Elettron filed Critical Ates Componenti Elettron
Priority to IT8520504A priority Critical patent/IT1215268B/en
Publication of IT8520504A0 publication Critical patent/IT8520504A0/en
Priority to GB08609260A priority patent/GB2174543B/en
Priority to DE3614087A priority patent/DE3614087C2/en
Priority to NL8601073A priority patent/NL193513C/en
Priority to FR868606060A priority patent/FR2581247B1/en
Priority to JP61097803A priority patent/JPH0658924B2/en
Application granted granted Critical
Publication of IT1215268B publication Critical patent/IT1215268B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0101—Neon [Ne]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0106—Neodymium [Nd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01094—Plutonium [Pu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
IT8520504A 1985-04-26 1985-04-26 APPARATUS AND METHOD FOR THE PERFECT PACKAGING OF SEMICONDUCTIVE DEVICES. IT1215268B (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IT8520504A IT1215268B (en) 1985-04-26 1985-04-26 APPARATUS AND METHOD FOR THE PERFECT PACKAGING OF SEMICONDUCTIVE DEVICES.
GB08609260A GB2174543B (en) 1985-04-26 1986-04-16 Apparatus and method for improved packaging of semiconductor devices
DE3614087A DE3614087C2 (en) 1985-04-26 1986-04-25 Semiconductor device assembly and method for electrically connecting an IC chip
NL8601073A NL193513C (en) 1985-04-26 1986-04-25 Method of connecting conductors, mounted in the frame of an electrical chain package, to a first group of electrodes.
FR868606060A FR2581247B1 (en) 1985-04-26 1986-04-25 PACKAGE AND METHOD FOR CONNECTING A CONDUCTOR ASSEMBLY OF A PACKAGE TO A SEMICONDUCTOR PELLET
JP61097803A JPH0658924B2 (en) 1985-04-26 1986-04-26 Semiconductor device package and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8520504A IT1215268B (en) 1985-04-26 1985-04-26 APPARATUS AND METHOD FOR THE PERFECT PACKAGING OF SEMICONDUCTIVE DEVICES.

Publications (2)

Publication Number Publication Date
IT8520504A0 IT8520504A0 (en) 1985-04-26
IT1215268B true IT1215268B (en) 1990-01-31

Family

ID=11167929

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8520504A IT1215268B (en) 1985-04-26 1985-04-26 APPARATUS AND METHOD FOR THE PERFECT PACKAGING OF SEMICONDUCTIVE DEVICES.

Country Status (6)

Country Link
JP (1) JPH0658924B2 (en)
DE (1) DE3614087C2 (en)
FR (1) FR2581247B1 (en)
GB (1) GB2174543B (en)
IT (1) IT1215268B (en)
NL (1) NL193513C (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4959706A (en) * 1988-05-23 1990-09-25 United Technologies Corporation Integrated circuit having an improved bond pad
DE69426293T2 (en) * 1994-07-13 2001-04-05 United Microelectronics Corp., Hsinchu Method of reducing the antenna effect during manufacturing
EP0693783B1 (en) * 1994-07-13 1999-09-22 United Microelectronics Corporation Method for eliminating process antenna effect
US6894399B2 (en) 2001-04-30 2005-05-17 Intel Corporation Microelectronic device having signal distribution functionality on an interfacial layer thereof
US6888240B2 (en) 2001-04-30 2005-05-03 Intel Corporation High performance, low cost microelectronic circuit package with interposer
US7071024B2 (en) * 2001-05-21 2006-07-04 Intel Corporation Method for packaging a microelectronic device using on-die bond pad expansion
US7183658B2 (en) 2001-09-05 2007-02-27 Intel Corporation Low cost microelectronic circuit package
DE50212872D1 (en) * 2002-11-29 2008-11-20 Infineon Technologies Ag Semiconductor chip with terminal pads and arrangement of such a semiconductor chip on a support

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3458925A (en) * 1966-01-20 1969-08-05 Ibm Method of forming solder mounds on substrates
FR1569479A (en) * 1967-07-13 1969-05-30
US3684931A (en) * 1970-02-26 1972-08-15 Toyo Electronics Ind Corp Semiconductor device with coplanar electrodes also overlying lateral surfaces thereof
JPS5420120B2 (en) * 1971-12-23 1979-07-20
CA954635A (en) * 1972-06-06 1974-09-10 Microsystems International Limited Mounting leads and method of fabrication
JPS5091269A (en) * 1973-12-12 1975-07-21
JPS5851425B2 (en) * 1975-08-22 1983-11-16 株式会社日立製作所 Hand tie souchi
JPS5445574A (en) * 1977-09-17 1979-04-10 Tdk Corp Connection method of integrated circuit

Also Published As

Publication number Publication date
NL193513C (en) 1999-12-03
GB2174543B (en) 1988-11-16
NL8601073A (en) 1986-11-17
DE3614087C2 (en) 1999-05-06
DE3614087A1 (en) 1986-10-30
GB8609260D0 (en) 1986-05-21
FR2581247B1 (en) 1991-03-29
FR2581247A1 (en) 1986-10-31
JPS61251047A (en) 1986-11-08
IT8520504A0 (en) 1985-04-26
GB2174543A (en) 1986-11-05
NL193513B (en) 1999-08-02
JPH0658924B2 (en) 1994-08-03

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Effective date: 19970429