IT1183552B - MULTI-LAYER FLEXIBLE CIRCUIT WITH LINES BETWEEN LAYER AND LAYER ULTRASONICALLY WELDED - Google Patents

MULTI-LAYER FLEXIBLE CIRCUIT WITH LINES BETWEEN LAYER AND LAYER ULTRASONICALLY WELDED

Info

Publication number
IT1183552B
IT1183552B IT20190/85A IT2019085A IT1183552B IT 1183552 B IT1183552 B IT 1183552B IT 20190/85 A IT20190/85 A IT 20190/85A IT 2019085 A IT2019085 A IT 2019085A IT 1183552 B IT1183552 B IT 1183552B
Authority
IT
Italy
Prior art keywords
layer
lines
flexible circuit
ultrasonically welded
layer flexible
Prior art date
Application number
IT20190/85A
Other languages
Italian (it)
Other versions
IT8520190A0 (en
Inventor
Mary T Caton
Frederich A Balash
Roger Meleard
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of IT8520190A0 publication Critical patent/IT8520190A0/en
Application granted granted Critical
Publication of IT1183552B publication Critical patent/IT1183552B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
IT20190/85A 1984-04-03 1985-04-02 MULTI-LAYER FLEXIBLE CIRCUIT WITH LINES BETWEEN LAYER AND LAYER ULTRASONICALLY WELDED IT1183552B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8405220A FR2562335B1 (en) 1984-04-03 1984-04-03 FLEXIBLE MULTILAYER CIRCUIT WITH CONNECTIONS BETWEEN ULTRASONIC WELDED LAYERS

Publications (2)

Publication Number Publication Date
IT8520190A0 IT8520190A0 (en) 1985-04-02
IT1183552B true IT1183552B (en) 1987-10-22

Family

ID=9302775

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20190/85A IT1183552B (en) 1984-04-03 1985-04-02 MULTI-LAYER FLEXIBLE CIRCUIT WITH LINES BETWEEN LAYER AND LAYER ULTRASONICALLY WELDED

Country Status (7)

Country Link
JP (1) JPS60227497A (en)
DE (1) DE3512237A1 (en)
ES (1) ES295813Y (en)
FR (1) FR2562335B1 (en)
GB (1) GB2157085B (en)
IT (1) IT1183552B (en)
SE (1) SE459832B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3535008C2 (en) * 1985-10-01 1994-09-29 Telefunken Microelectron Foil circuit with two overlapping cable carriers
DE3704498A1 (en) * 1987-02-13 1988-08-25 Aristo Graphic Systeme METHOD FOR PRODUCING A DIGITALIZED TABLET
DE3704497A1 (en) * 1987-02-13 1988-08-25 Aristo Graphic Systeme METHOD FOR PRODUCING A DIGITALIZED TABLET
GB2227887A (en) * 1988-12-24 1990-08-08 Technology Applic Company Limi Making printed circuits
GB2233157B (en) * 1989-06-13 1992-10-21 British Aerospace Printed circuit board
JPH03196691A (en) * 1989-12-26 1991-08-28 Cmk Corp Formation of insulating layer of printed wiring board
US5347710A (en) * 1993-07-27 1994-09-20 International Business Machines Corporation Parallel processor and method of fabrication
EP0995235B1 (en) 1997-07-16 2002-04-03 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Contact for very small liaison contacts and method for producing a contact
JP3587748B2 (en) * 1999-10-18 2004-11-10 ソニーケミカル株式会社 Multilayer flexible wiring board and method for manufacturing multilayer flexible wiring board
DE10035175C1 (en) 2000-07-19 2002-01-03 Fraunhofer Ges Forschung Making electrical/mechanical connection between flexible thin film substrates involves positioning substrates so openings coincide, positioning bonding elements, pressing together
DE102005033218A1 (en) * 2005-07-15 2007-01-18 Printed Systems Gmbh Three-dimensional circuit
DE102011109992A1 (en) 2011-08-11 2013-02-14 Eppendorf Ag Circuit board cable device for a laboratory sample device and laboratory sample device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1456994A (en) * 1973-06-28 1976-12-01 Marconi Co Ltd Methods for forming electrical internconnection between metal layers for printed circuit assembly
IL53957A0 (en) * 1977-02-15 1978-04-30 Bogardus Lomerson R A method for establishing an electrically conductive path through an insulating

Also Published As

Publication number Publication date
GB8508567D0 (en) 1985-05-09
JPS60227497A (en) 1985-11-12
FR2562335B1 (en) 1988-11-25
SE8501635D0 (en) 1985-04-02
GB2157085B (en) 1987-06-24
FR2562335A1 (en) 1985-10-04
ES295813Y (en) 1987-12-16
GB2157085A (en) 1985-10-16
ES295813U (en) 1987-06-16
DE3512237A1 (en) 1985-12-12
SE459832B (en) 1989-08-07
JPH0564880B2 (en) 1993-09-16
IT8520190A0 (en) 1985-04-02
SE8501635L (en) 1985-10-04

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