IT1174485B - ELECTRIC CIRCUIT PROVISION WITH INA CONDUCTIVE PLATE - Google Patents

ELECTRIC CIRCUIT PROVISION WITH INA CONDUCTIVE PLATE

Info

Publication number
IT1174485B
IT1174485B IT19603/84A IT1960384A IT1174485B IT 1174485 B IT1174485 B IT 1174485B IT 19603/84 A IT19603/84 A IT 19603/84A IT 1960384 A IT1960384 A IT 1960384A IT 1174485 B IT1174485 B IT 1174485B
Authority
IT
Italy
Prior art keywords
ina
electric circuit
conductive plate
circuit provision
provision
Prior art date
Application number
IT19603/84A
Other languages
Italian (it)
Other versions
IT8419603A0 (en
Inventor
Georg Haubner
Karl Wutz
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of IT8419603A0 publication Critical patent/IT8419603A0/en
Application granted granted Critical
Publication of IT1174485B publication Critical patent/IT1174485B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
IT19603/84A 1983-02-15 1984-02-14 ELECTRIC CIRCUIT PROVISION WITH INA CONDUCTIVE PLATE IT1174485B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3305167A DE3305167C2 (en) 1983-02-15 1983-02-15 Electrical circuit arrangement with a circuit board

Publications (2)

Publication Number Publication Date
IT8419603A0 IT8419603A0 (en) 1984-02-14
IT1174485B true IT1174485B (en) 1987-07-01

Family

ID=6190881

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19603/84A IT1174485B (en) 1983-02-15 1984-02-14 ELECTRIC CIRCUIT PROVISION WITH INA CONDUCTIVE PLATE

Country Status (2)

Country Link
DE (1) DE3305167C2 (en)
IT (1) IT1174485B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4941067A (en) * 1989-04-07 1990-07-10 Motorola Inc. Thermal shunt for electronic circuits
US5031071A (en) * 1990-04-30 1991-07-09 Motorola, Inc. Heat spreading device for component leads
US5119174A (en) * 1990-10-26 1992-06-02 Chen Der Jong Light emitting diode display with PCB base
US5175668A (en) * 1990-12-03 1992-12-29 Motorola, Inc. Circuit board for a component requiring heat sinkage
DE4107312A1 (en) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Mounting system for power semiconductor device - has heat conductive coupling between heat conductive layer beneath semiconductor device and insulating layer supporting circuit board
JP2971637B2 (en) * 1991-06-17 1999-11-08 富士通株式会社 Semiconductor device
ES2095486T5 (en) 1991-09-21 2010-07-09 Robert Bosch Gmbh ELECTRICAL DEVICE, IN SPECIAL SWITCHING AND CONTROL DEVICE FOR MOTOR VEHICLES.
DE4335946C2 (en) * 1993-10-21 1997-09-11 Bosch Gmbh Robert Arrangement consisting of a printed circuit board
US6377462B1 (en) 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking
DE10109083B4 (en) * 2001-02-24 2006-07-13 Conti Temic Microelectronic Gmbh Electronic module
CN102316667A (en) * 2010-11-04 2012-01-11 深圳松维电子股份有限公司 LED (light emitting diode) printed circuit board and production method thereof
FR3025061B1 (en) * 2014-08-20 2018-02-09 Wen-Sung Hu CMS LED THERMAL DISSIPATION STRUCTURE
DE102019215503A1 (en) * 2019-10-10 2021-04-15 Vitesco Technologies GmbH Power semiconductor component and method for manufacturing a power semiconductor component

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1104576B (en) * 1960-07-20 1961-04-13 Visomat Geraete G M B H Printed circuit with heat sink
DE2226395A1 (en) * 1972-05-31 1973-12-13 Bosch Gmbh Robert ELECTRICAL CIRCUIT ARRANGEMENT
DE2530157A1 (en) * 1975-07-05 1977-02-03 Bosch Gmbh Robert ELECTRONIC CONTROL UNIT
DE2601035A1 (en) * 1976-01-13 1977-07-21 Bosch Gmbh Robert ELECTRICAL CIRCUIT ARRANGEMENT
DE3115017A1 (en) * 1981-04-14 1982-11-04 Blaupunkt-Werke Gmbh, 3200 Hildesheim Electronic components
DE8114325U1 (en) * 1981-05-14 1982-09-30 Siemens AG, 1000 Berlin und 8000 München Heat dissipation device

Also Published As

Publication number Publication date
IT8419603A0 (en) 1984-02-14
DE3305167A1 (en) 1984-08-16
DE3305167C2 (en) 1994-05-05

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970227