IT1171790B - Copper clad laminate for printed circuit - Google Patents
Copper clad laminate for printed circuitInfo
- Publication number
- IT1171790B IT1171790B IT23544/83A IT2354483A IT1171790B IT 1171790 B IT1171790 B IT 1171790B IT 23544/83 A IT23544/83 A IT 23544/83A IT 2354483 A IT2354483 A IT 2354483A IT 1171790 B IT1171790 B IT 1171790B
- Authority
- IT
- Italy
- Prior art keywords
- clad laminate
- printed circuit
- layer
- copper clad
- metal
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract 1
- 239000005751 Copper oxide Substances 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 229910000431 copper oxide Inorganic materials 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 239000007822 coupling agent Substances 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Metal clad laminate comprises an interacted coupling agent layer (16) bonded to the surface of a substrate (17) and a layer (13) of ultra-thin copper connected to the coupling layer (16) by a composite bonding layer (14). The bonding layer (14) is free of copper oxide and comprises regions of copper alloyed with a second metal and oxide of the second metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT23544/83A IT1171790B (en) | 1983-10-31 | 1983-10-31 | Copper clad laminate for printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT23544/83A IT1171790B (en) | 1983-10-31 | 1983-10-31 | Copper clad laminate for printed circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8323544A0 IT8323544A0 (en) | 1983-10-31 |
| IT1171790B true IT1171790B (en) | 1987-06-10 |
Family
ID=11208007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT23544/83A IT1171790B (en) | 1983-10-31 | 1983-10-31 | Copper clad laminate for printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| IT (1) | IT1171790B (en) |
-
1983
- 1983-10-31 IT IT23544/83A patent/IT1171790B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| IT8323544A0 (en) | 1983-10-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19951026 |