IT1165401B - Termocapsula con microsoffietto - Google Patents
Termocapsula con microsoffiettoInfo
- Publication number
- IT1165401B IT1165401B IT28239/79A IT2823979A IT1165401B IT 1165401 B IT1165401 B IT 1165401B IT 28239/79 A IT28239/79 A IT 28239/79A IT 2823979 A IT2823979 A IT 2823979A IT 1165401 B IT1165401 B IT 1165401B
- Authority
- IT
- Italy
- Prior art keywords
- thermocapsula
- microsoffietto
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/000,048 US4212349A (en) | 1979-01-02 | 1979-01-02 | Micro bellows thermo capsule |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7928239A0 IT7928239A0 (it) | 1979-12-20 |
IT1165401B true IT1165401B (it) | 1987-04-22 |
Family
ID=21689667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT28239/79A IT1165401B (it) | 1979-01-02 | 1979-12-20 | Termocapsula con microsoffietto |
Country Status (6)
Country | Link |
---|---|
US (1) | US4212349A (it) |
EP (1) | EP0013362B1 (it) |
JP (1) | JPS5592887A (it) |
CA (1) | CA1120604A (it) |
DE (1) | DE2963197D1 (it) |
IT (1) | IT1165401B (it) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4395728A (en) * | 1979-08-24 | 1983-07-26 | Li Chou H | Temperature controlled apparatus |
JPS59141872U (ja) * | 1983-03-11 | 1984-09-21 | 高世 一郎 | 襞枕 |
US4660625A (en) * | 1983-12-30 | 1987-04-28 | Kms Fusion, Inc. | Heat transport system, method and material |
CA1227886A (en) * | 1984-01-26 | 1987-10-06 | Haruhiko Yamamoto | Liquid-cooling module system for electronic circuit components |
JPS61134370U (it) * | 1985-02-12 | 1986-08-21 | ||
DE3504992A1 (de) * | 1985-02-14 | 1986-08-14 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul mit integriertem waermerohr |
US4833567A (en) * | 1986-05-30 | 1989-05-23 | Digital Equipment Corporation | Integral heat pipe module |
US4789023A (en) * | 1987-07-28 | 1988-12-06 | Grant Frederic F | Vibration isolating heat sink |
IT1218075B (it) * | 1988-06-15 | 1990-04-12 | Fimac Spa | Dispositivo per il raffredamento di zone con superficie di scambio termico limitata,in particolare per componenti elettronici |
US4951740A (en) * | 1988-06-27 | 1990-08-28 | Texas A & M University System | Bellows heat pipe for thermal control of electronic components |
JPH0437502Y2 (it) * | 1988-10-18 | 1992-09-03 | ||
US5386143A (en) * | 1991-10-25 | 1995-01-31 | Digital Equipment Corporation | High performance substrate, electronic package and integrated circuit cooling process |
AT399951B (de) * | 1991-11-05 | 1995-08-25 | Grabner Werner | Verfahren und vorrichtung zur begrenzung der temperatur |
US5206791A (en) * | 1992-02-07 | 1993-04-27 | Digital Equipment Corporation | Bellows heat pipe apparatus for cooling systems |
US5520244A (en) * | 1992-12-16 | 1996-05-28 | Sdl, Inc. | Micropost waste heat removal system |
US5453641A (en) * | 1992-12-16 | 1995-09-26 | Sdl, Inc. | Waste heat removal system |
US5744752A (en) * | 1995-06-05 | 1998-04-28 | International Business Machines Corporation | Hermetic thin film metallized sealband for SCM and MCM-D modules |
SE512906C2 (sv) * | 1998-10-02 | 2000-06-05 | Ericsson Telefon Ab L M | Förfarande vid lödning av ett halvledarchip samt RF-power transistor för genomförande därav |
US6466442B2 (en) * | 2001-01-29 | 2002-10-15 | Ching-Bin Lin | Guidably-recirculated heat dissipating means for cooling central processing unit |
US9042097B2 (en) * | 2012-05-17 | 2015-05-26 | Hamilton Sundstrand Corporation | Two-phase electronic component cooling arrangement |
EP3707454A4 (en) * | 2017-11-06 | 2021-08-04 | Zuta-Core Ltd. | SYSTEMS AND PROCEDURES FOR HEAT EXCHANGE |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2958021A (en) * | 1958-04-23 | 1960-10-25 | Texas Instruments Inc | Cooling arrangement for transistor |
JPS466687A (it) * | 1970-05-13 | 1971-12-13 | ||
US3673306A (en) * | 1970-11-02 | 1972-06-27 | Trw Inc | Fluid heat transfer method and apparatus for semi-conducting devices |
DE2429985A1 (de) * | 1974-06-21 | 1976-01-08 | Siemens Ag | Vorrichtung zur luftkuehlung eines scheibenthyristors |
-
1979
- 1979-01-02 US US06/000,048 patent/US4212349A/en not_active Expired - Lifetime
- 1979-12-06 CA CA000341313A patent/CA1120604A/en not_active Expired
- 1979-12-10 DE DE7979105058T patent/DE2963197D1/de not_active Expired
- 1979-12-10 EP EP79105058A patent/EP0013362B1/de not_active Expired
- 1979-12-20 IT IT28239/79A patent/IT1165401B/it active
- 1979-12-20 JP JP16487279A patent/JPS5592887A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
DE2963197D1 (en) | 1982-08-12 |
US4212349A (en) | 1980-07-15 |
EP0013362B1 (de) | 1982-06-23 |
EP0013362A1 (de) | 1980-07-23 |
JPS5592887A (en) | 1980-07-14 |
CA1120604A (en) | 1982-03-23 |
IT7928239A0 (it) | 1979-12-20 |
JPS5712076B2 (it) | 1982-03-09 |
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