IT1165394B - Processo per preparare laminati impregnati di resine epossidiche per la placcatura additiva - Google Patents
Processo per preparare laminati impregnati di resine epossidiche per la placcatura additivaInfo
- Publication number
- IT1165394B IT1165394B IT2781179A IT2781179A IT1165394B IT 1165394 B IT1165394 B IT 1165394B IT 2781179 A IT2781179 A IT 2781179A IT 2781179 A IT2781179 A IT 2781179A IT 1165394 B IT1165394 B IT 1165394B
- Authority
- IT
- Italy
- Prior art keywords
- enameled
- laminates
- epoxy resin
- preparing epoxy
- additive plating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/2033—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31518—Next to glass or quartz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
- Y10T428/31696—Including polyene monomers [e.g., butadiene, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
- Y10T428/31699—Ester, halide or nitrile of addition polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/971,125 US4254186A (en) | 1978-12-20 | 1978-12-20 | Process for preparing epoxy laminates for additive plating |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7927811A0 IT7927811A0 (it) | 1979-12-04 |
IT1165394B true IT1165394B (it) | 1987-04-22 |
Family
ID=25517961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT2781179A IT1165394B (it) | 1978-12-20 | 1979-12-04 | Processo per preparare laminati impregnati di resine epossidiche per la placcatura additiva |
Country Status (5)
Country | Link |
---|---|
US (1) | US4254186A (it) |
EP (1) | EP0012862A3 (it) |
JP (1) | JPS5587497A (it) |
CA (1) | CA1129760A (it) |
IT (1) | IT1165394B (it) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4446191A (en) * | 1980-10-27 | 1984-05-01 | Hitachi Chemical Company, Ltd. | Laminates comprising prepregs metal clad |
CA1186608A (en) * | 1981-02-13 | 1985-05-07 | Makoto Ohe | Process for preparation of laminate polymer articles and polymer article surface-protecting acrylic film for use in carrying out said process |
JPS60206086A (ja) * | 1984-03-29 | 1985-10-17 | 住友ベークライト株式会社 | アデイテイブめつき用積層板の製造方法 |
US4959008A (en) * | 1984-04-30 | 1990-09-25 | National Starch And Chemical Investment Holding Corporation | Pre-patterned circuit board device-attach adhesive transfer system |
US4707394A (en) * | 1986-09-19 | 1987-11-17 | Firan Corporation | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby |
US4797508A (en) * | 1986-09-19 | 1989-01-10 | Firan Corporation | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby |
US4804575A (en) * | 1987-01-14 | 1989-02-14 | Kollmorgen Corporation | Multilayer printed wiring boards |
US5618606A (en) * | 1989-09-18 | 1997-04-08 | Rockwell International Corporation | Process for bonding staged composites with a cobonded staged adhesive and article |
US5519425A (en) * | 1993-11-15 | 1996-05-21 | Xerox Corporation | Ink supply cartridge for an ink jet printer |
CH686422A5 (de) * | 1994-05-06 | 1996-03-29 | Ernst Muller | Verfahren zur unlosbaren Verbindung einer Masse aus ausgehortetem Epoxidharz mit einer Masse aus ABS-Copolymer, sowie nach diesem Verfahren hergestellter Gegenstand. |
US6632343B1 (en) * | 2000-08-30 | 2003-10-14 | Micron Technology, Inc. | Method and apparatus for electrolytic plating of surface metals |
US6500529B1 (en) * | 2001-09-14 | 2002-12-31 | Tonoga, Ltd. | Low signal loss bonding ply for multilayer circuit boards |
US8897023B2 (en) * | 2009-05-15 | 2014-11-25 | Hamilton Sundstrand Corporation | Motor controller assembly with capacitor thermal isolation |
US20110290540A1 (en) * | 2010-05-25 | 2011-12-01 | Samsung Electro-Mechanics Co., Ltd. | Embedded printed circuit board and method of manufacturing the same |
US9504148B1 (en) | 2015-12-02 | 2016-11-22 | Honeywell Federal Manufacturing & Technologies, Llc | Rapid PCB prototyping by selective adhesion |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1355332A (en) * | 1970-02-18 | 1974-06-05 | Formica Int | Process for preparing metallised insulating substrates |
GB1355331A (en) * | 1970-02-18 | 1974-06-05 | Formica Int | Process for preparing insulating substrates |
US3948701A (en) * | 1971-07-20 | 1976-04-06 | Aeg-Isolier-Und Kunststoff Gmbh | Process for manufacturing base material for printed circuits |
US3956041A (en) * | 1972-07-11 | 1976-05-11 | Kollmorgen Corporation | Transfer coating process for manufacture of printing circuits |
US3925138A (en) * | 1973-11-27 | 1975-12-09 | Formica Int | Process for preparing an insulating substrate for use in printed circuits |
US4001466A (en) * | 1973-11-27 | 1977-01-04 | Formica International Limited | Process for preparing printed circuits |
US3989573A (en) * | 1973-12-11 | 1976-11-02 | Westinghouse Electric Corporation | Glass-epoxy laminates for high temperature use |
US3990932A (en) * | 1974-05-13 | 1976-11-09 | Dupire Pierre J | Transfer method of application of solid coating composition |
US3955024A (en) * | 1974-07-17 | 1976-05-04 | Western Electric Company, Inc. | Printed circuit board |
US4029845A (en) * | 1974-08-15 | 1977-06-14 | Sumitomo Bakelite Company, Limited | Printed circuit base board and method for manufacturing same |
JPS5127463A (en) * | 1974-08-29 | 1976-03-08 | Hirotoshi Nomura | Purintokairoyokiban no seizoho |
US4100312A (en) * | 1975-11-07 | 1978-07-11 | Macdermid Incorporated | Method of making metal-plastic laminates |
-
1978
- 1978-12-20 US US05/971,125 patent/US4254186A/en not_active Expired - Lifetime
-
1979
- 1979-10-09 JP JP12957679A patent/JPS5587497A/ja active Pending
- 1979-10-15 CA CA337,649A patent/CA1129760A/en not_active Expired
- 1979-11-27 EP EP19790104723 patent/EP0012862A3/de not_active Withdrawn
- 1979-12-04 IT IT2781179A patent/IT1165394B/it active
Also Published As
Publication number | Publication date |
---|---|
US4254186A (en) | 1981-03-03 |
EP0012862A2 (de) | 1980-07-09 |
CA1129760A (en) | 1982-08-17 |
JPS5587497A (en) | 1980-07-02 |
IT7927811A0 (it) | 1979-12-04 |
EP0012862A3 (de) | 1981-03-18 |
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