IT1115981B - Dispositivo e procedimento per il taglio di oggetti tubolari mediante laser - Google Patents

Dispositivo e procedimento per il taglio di oggetti tubolari mediante laser

Info

Publication number
IT1115981B
IT1115981B IT49030/79A IT4903079A IT1115981B IT 1115981 B IT1115981 B IT 1115981B IT 49030/79 A IT49030/79 A IT 49030/79A IT 4903079 A IT4903079 A IT 4903079A IT 1115981 B IT1115981 B IT 1115981B
Authority
IT
Italy
Prior art keywords
laser
procedure
tubular objects
cutting tubular
cutting
Prior art date
Application number
IT49030/79A
Other languages
English (en)
Other versions
IT7949030A0 (it
Original Assignee
Owens Illinois Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Owens Illinois Inc filed Critical Owens Illinois Inc
Publication of IT7949030A0 publication Critical patent/IT7949030A0/it
Application granted granted Critical
Publication of IT1115981B publication Critical patent/IT1115981B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0619—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams with spots located on opposed surfaces of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1645—Laser beams characterised by the way of heating the interface heating both sides of the joint, e.g. by using two lasers or a split beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
IT49030/79A 1978-05-11 1979-05-11 Dispositivo e procedimento per il taglio di oggetti tubolari mediante laser IT1115981B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/904,729 US4174476A (en) 1978-05-11 1978-05-11 Laser cutting of tubular articles

Publications (2)

Publication Number Publication Date
IT7949030A0 IT7949030A0 (it) 1979-05-11
IT1115981B true IT1115981B (it) 1986-02-10

Family

ID=25419660

Family Applications (1)

Application Number Title Priority Date Filing Date
IT49030/79A IT1115981B (it) 1978-05-11 1979-05-11 Dispositivo e procedimento per il taglio di oggetti tubolari mediante laser

Country Status (6)

Country Link
US (1) US4174476A (it)
JP (1) JPS54149996A (it)
DE (1) DE2919089C2 (it)
FR (1) FR2425304A1 (it)
GB (1) GB2020592B (it)
IT (1) IT1115981B (it)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57156886A (en) * 1981-03-23 1982-09-28 Nec Corp Laser printing device
JPS60170341A (ja) * 1984-02-14 1985-09-03 Nec Corp 交換方式
US4549066A (en) * 1984-02-24 1985-10-22 Continental Packaging Company, Inc. Trimming of polyester containers using a laser
JPH0636949B2 (ja) * 1985-06-10 1994-05-18 北海製罐株式会社 ネックイン缶胴の製造方法
ATE102119T1 (de) * 1988-09-07 1994-03-15 Leeuwarder Papier Verfahren zur herstellung von einkerbungen in verpackungsmaterial.
US5141428A (en) * 1990-03-16 1992-08-25 Philip Morris Incorporated Apparatus for cutting thin-walled tubes
DE4335580C2 (de) * 1993-10-19 2002-07-11 Krupp Kunststofftechnik Gmbh Vorrichtung zum Trennen einer mehrfach hohen Dosenzarge
US6548370B1 (en) * 1999-08-18 2003-04-15 Semiconductor Energy Laboratory Co., Ltd. Method of crystallizing a semiconductor layer by applying laser irradiation that vary in energy to its top and bottom surfaces
TW494444B (en) * 1999-08-18 2002-07-11 Semiconductor Energy Lab Laser apparatus and laser annealing method
EP1278611B1 (de) * 2000-04-25 2008-07-02 Tecpharma Licensing AG Vorrichtung zur beschriftung von gegenständen mittels laserstrahlen
US6460759B1 (en) 2000-05-02 2002-10-08 Sonoco Development, Inc. Multi-ply composite container with regions of weakened strength and method for manufacturing same
JP2005101504A (ja) * 2003-08-22 2005-04-14 Topcon Corp レーザ装置
CN102470485B (zh) * 2009-07-28 2014-12-31 新日铁住金株式会社 激光处理装置及容器制造装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3256524A (en) * 1963-11-29 1966-06-14 Honeywell Inc Laser recording apparatus
US3524046A (en) * 1968-04-26 1970-08-11 Aluminum Co Of America Apparatus and method for piercing holes in elastomeric articles
US4000391A (en) * 1973-05-14 1976-12-28 Westinghouse Electric Corporation Nuclear reactor fuel element splitter
DE2420577C2 (de) * 1973-05-14 1982-12-02 Westinghouse Electric Corp., 15222 Pittsburgh, Pa. Verfahren und Vorrichtung zum Entfernen von Kernbrennstoff aus ummantelten Kernbrennelementen
US4020319A (en) * 1974-02-07 1977-04-26 The Torrington Company Method of forming a knitting needle latch pivot
US4048464A (en) * 1975-08-22 1977-09-13 Fuji Photo Film Co., Ltd. Method of and means for cutting hose for high pressure hydraulic systems
US3989778A (en) * 1975-12-17 1976-11-02 W. R. Grace & Co. Method of heat sealing thermoplastic sheets together using a split laser beam

Also Published As

Publication number Publication date
JPS54149996A (en) 1979-11-24
DE2919089A1 (de) 1979-11-15
GB2020592B (en) 1983-07-20
FR2425304A1 (fr) 1979-12-07
JPS5714279B2 (it) 1982-03-23
US4174476A (en) 1979-11-13
IT7949030A0 (it) 1979-05-11
DE2919089C2 (de) 1982-05-13
GB2020592A (en) 1979-11-21

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