IT1094074B - Procedimento per l'elettrodeposizione di rutenio,particolarmente per contatti di interruttori a contatti magnetici protetti - Google Patents
Procedimento per l'elettrodeposizione di rutenio,particolarmente per contatti di interruttori a contatti magnetici protettiInfo
- Publication number
- IT1094074B IT1094074B IT22417/78A IT2241778A IT1094074B IT 1094074 B IT1094074 B IT 1094074B IT 22417/78 A IT22417/78 A IT 22417/78A IT 2241778 A IT2241778 A IT 2241778A IT 1094074 B IT1094074 B IT 1094074B
- Authority
- IT
- Italy
- Prior art keywords
- electrodeposition
- ruthenium
- procedure
- contact switch
- switch contacts
- Prior art date
Links
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 title 1
- 238000004070 electrodeposition Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229910052707 ruthenium Inorganic materials 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
- H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
- H01H2011/046—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion by plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S204/00—Chemistry: electrical and wave energy
- Y10S204/09—Wave forms
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/789,176 US4082622A (en) | 1977-04-20 | 1977-04-20 | Electrodeposition of ruthenium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT7822417A0 IT7822417A0 (it) | 1978-04-18 |
| IT1094074B true IT1094074B (it) | 1985-07-26 |
Family
ID=25146805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT22417/78A IT1094074B (it) | 1977-04-20 | 1978-04-18 | Procedimento per l'elettrodeposizione di rutenio,particolarmente per contatti di interruttori a contatti magnetici protetti |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4082622A (it) |
| BE (1) | BE865400A (it) |
| CA (1) | CA1116120A (it) |
| IT (1) | IT1094074B (it) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4297178A (en) * | 1979-04-10 | 1981-10-27 | The International Nickel Company, Inc. | Ruthenium electroplating and baths and compositions therefor |
| US4269671A (en) * | 1979-11-05 | 1981-05-26 | Bell Telephone Laboratories, Incorporated | Electroplating of silver-palladium alloys and resulting product |
| DE3039658A1 (de) * | 1980-10-21 | 1982-05-06 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Mit edelmetall beschichtetes molybdaen und verfahren zu seiner herstellung |
| US4514265A (en) * | 1984-07-05 | 1985-04-30 | Rca Corporation | Bonding pads for semiconductor devices |
| US4869971A (en) * | 1986-05-22 | 1989-09-26 | Nee Chin Cheng | Multilayer pulsed-current electrodeposition process |
| GB9107364D0 (en) * | 1991-04-08 | 1991-05-22 | Skw Metals Uk Ltd | Coated molybdenum parts and process for their production |
| US5783313A (en) * | 1995-12-22 | 1998-07-21 | Baldwin Hardware Corporation | Coated Article |
| US5693427A (en) * | 1995-12-22 | 1997-12-02 | Baldwin Hardware Corporation | Article with protective coating thereon |
| RU2202006C2 (ru) * | 2001-05-04 | 2003-04-10 | ОАО "Рязанский завод металлокерамических приборов" | Способ нанесения рутениевого покрытия |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH508055A (fr) * | 1969-03-21 | 1971-05-31 | Sel Rex Corp | Procédé de placage électrolytique de ruthénium, et bain aqueux pour la mise en oeuvre de ce procédé |
| DE2121150C3 (de) * | 1971-04-24 | 1980-08-21 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zur galvanischen Abscheidung von Goldlegierungen |
-
1977
- 1977-04-20 US US05/789,176 patent/US4082622A/en not_active Expired - Lifetime
-
1978
- 1978-01-25 CA CA295,637A patent/CA1116120A/en not_active Expired
- 1978-03-29 BE BE2056808A patent/BE865400A/xx unknown
- 1978-04-18 IT IT22417/78A patent/IT1094074B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| US4082622A (en) | 1978-04-04 |
| IT7822417A0 (it) | 1978-04-18 |
| BE865400A (fr) | 1978-07-17 |
| CA1116120A (en) | 1982-01-12 |
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