IT1089189B - INTERMEDIATE SUPPORT TO SUPPORT AND ESTABLISH CONTACT WITH A BODY OF SEMICONDUCTIVE MATERIAL - Google Patents

INTERMEDIATE SUPPORT TO SUPPORT AND ESTABLISH CONTACT WITH A BODY OF SEMICONDUCTIVE MATERIAL

Info

Publication number
IT1089189B
IT1089189B IT3107677A IT3107677A IT1089189B IT 1089189 B IT1089189 B IT 1089189B IT 3107677 A IT3107677 A IT 3107677A IT 3107677 A IT3107677 A IT 3107677A IT 1089189 B IT1089189 B IT 1089189B
Authority
IT
Italy
Prior art keywords
support
semiconductive material
establish contact
intermediate support
establish
Prior art date
Application number
IT3107677A
Other languages
Italian (it)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT1089189B publication Critical patent/IT1089189B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Packaging Frangible Articles (AREA)
  • Lead Frames For Integrated Circuits (AREA)
IT3107677A 1976-12-23 1977-12-22 INTERMEDIATE SUPPORT TO SUPPORT AND ESTABLISH CONTACT WITH A BODY OF SEMICONDUCTIVE MATERIAL IT1089189B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762658532 DE2658532C2 (en) 1976-12-23 1976-12-23 Intermediate carrier for holding and contacting a semiconductor body and method for its production

Publications (1)

Publication Number Publication Date
IT1089189B true IT1089189B (en) 1985-06-18

Family

ID=5996481

Family Applications (1)

Application Number Title Priority Date Filing Date
IT3107677A IT1089189B (en) 1976-12-23 1977-12-22 INTERMEDIATE SUPPORT TO SUPPORT AND ESTABLISH CONTACT WITH A BODY OF SEMICONDUCTIVE MATERIAL

Country Status (5)

Country Link
JP (1) JPS5381074A (en)
DE (1) DE2658532C2 (en)
FR (1) FR2375721A1 (en)
GB (1) GB1563870A (en)
IT (1) IT1089189B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2456390A1 (en) * 1979-05-11 1980-12-05 Thomson Csf Connector grid for integrated circuit encapsulation - forms external contacts and internal links from single piece component
JPS56152244A (en) * 1980-04-25 1981-11-25 Seiko Epson Corp Semiconductor device
US4736236A (en) * 1984-03-08 1988-04-05 Olin Corporation Tape bonding material and structure for electronic circuit fabrication
CA1226967A (en) * 1984-03-08 1987-09-15 Sheldon H. Butt Tape bonding material and structure for electronic circuit fabrication
US4795694A (en) * 1986-06-20 1989-01-03 Siemens Aktiengesellschaft Manufacture of fine structures for semiconductor contacting
JPS63142660A (en) * 1986-12-04 1988-06-15 Dainippon Screen Mfg Co Ltd Manufacture of lead frame
JPH063818B2 (en) * 1988-01-13 1994-01-12 株式会社三井ハイテック Wireless bonding method
JPH03106009A (en) * 1989-09-20 1991-05-02 Isuzu Motors Ltd Electric double layer capacitor
DE19916177B4 (en) * 1999-04-10 2006-01-26 Sokymat Gmbh Method for contacting the semiconductor chip and semiconductor chip with wire-shaped connecting pieces
DE102004030042B4 (en) 2004-06-22 2009-04-02 Infineon Technologies Ag Semiconductor device having a semiconductor chip mounted on a carrier, in which the heat transferred from the semiconductor chip to the carrier is limited, and a method for producing a semiconductor device
US7598603B2 (en) 2006-03-15 2009-10-06 Infineon Technologies Ag Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1184319A (en) * 1967-12-27 1970-03-11 Rca Corp Semiconductor Device Assembly
US3680206A (en) * 1969-06-23 1972-08-01 Ferranti Ltd Assemblies of semiconductor devices having mounting pillars as circuit connections
DE2127633B2 (en) * 1971-06-03 1975-03-20 Siemens Ag, 1000 Berlin Und 8000 Muenchen Method for producing a system carrier for holding and contacting a semiconductor body

Also Published As

Publication number Publication date
DE2658532A1 (en) 1978-06-29
FR2375721A1 (en) 1978-07-21
GB1563870A (en) 1980-04-02
FR2375721B1 (en) 1982-05-14
DE2658532C2 (en) 1984-02-16
JPS5381074A (en) 1978-07-18

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