IT1088411B - Procedimento per la relaizzazione di rivelatori multispettrali per infrarosso - Google Patents

Procedimento per la relaizzazione di rivelatori multispettrali per infrarosso

Info

Publication number
IT1088411B
IT1088411B IT30501/77A IT3050177A IT1088411B IT 1088411 B IT1088411 B IT 1088411B IT 30501/77 A IT30501/77 A IT 30501/77A IT 3050177 A IT3050177 A IT 3050177A IT 1088411 B IT1088411 B IT 1088411B
Authority
IT
Italy
Prior art keywords
multispettral
detectors
infrared
procedure
relationship
Prior art date
Application number
IT30501/77A
Other languages
English (en)
Inventor
Giancarlo Fiorito
Guido Gasparrini
Francesco Svelto
Original Assignee
Cise Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cise Spa filed Critical Cise Spa
Priority to IT30501/77A priority Critical patent/IT1088411B/it
Priority to US05/931,088 priority patent/US4217490A/en
Application granted granted Critical
Publication of IT1088411B publication Critical patent/IT1088411B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
    • H01L25/043—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1828—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
    • H01L31/1832—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe comprising ternary compounds, e.g. Hg Cd Te
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Light Receiving Elements (AREA)
IT30501/77A 1977-12-06 1977-12-06 Procedimento per la relaizzazione di rivelatori multispettrali per infrarosso IT1088411B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT30501/77A IT1088411B (it) 1977-12-06 1977-12-06 Procedimento per la relaizzazione di rivelatori multispettrali per infrarosso
US05/931,088 US4217490A (en) 1977-12-06 1978-08-04 Method for constructing multispectral infrared detectors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT30501/77A IT1088411B (it) 1977-12-06 1977-12-06 Procedimento per la relaizzazione di rivelatori multispettrali per infrarosso

Publications (1)

Publication Number Publication Date
IT1088411B true IT1088411B (it) 1985-06-10

Family

ID=11229863

Family Applications (1)

Application Number Title Priority Date Filing Date
IT30501/77A IT1088411B (it) 1977-12-06 1977-12-06 Procedimento per la relaizzazione di rivelatori multispettrali per infrarosso

Country Status (2)

Country Link
US (1) US4217490A (it)
IT (1) IT1088411B (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517464A (en) * 1982-09-30 1985-05-14 The United States Of America As Represented By The Secretary Of The Air Force Sensor system
US4544843A (en) * 1983-01-28 1985-10-01 Santa Barbara Research Center Radiation detector with built-in test capability
US8030615B2 (en) * 2008-06-20 2011-10-04 Bowling Green State University Method and apparatus for detecting organic materials and objects from multispectral reflected light
US7767966B2 (en) * 2008-06-20 2010-08-03 Bowling Green State University Method and apparatus for detecting organic materials and objects from multispectral reflected light
RU2540836C1 (ru) * 2013-07-10 2015-02-10 Открытое Акционерное общество "Научно-исследовательский институт "Гириконд" Инфракрасный многоспектральный приемник излучения

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4005288A (en) * 1975-09-19 1977-01-25 Honeywell Inc. Photodetector mounting and connecting
FR2336804A1 (fr) * 1975-12-23 1977-07-22 Telecommunications Sa Perfectionnements apportes aux dispositifs semi-conducteurs, notamment aux detecteurs photovoltaiques comprenant un substrat a base d'un alliage cdxhg1-xte, et procede de fabrication d'un tel dispositif perfectionne
US4157926A (en) * 1977-02-24 1979-06-12 The United States Of America As Represented By The Secretary Of The Navy Method of fabricating a high electrical frequency infrared detector by vacuum deposition

Also Published As

Publication number Publication date
US4217490A (en) 1980-08-12

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