IT1087439B - Tin lead alloy plating electrolyte - contg. thiourea, hypophosphite, hydrochloric acid and the metals - Google Patents
Tin lead alloy plating electrolyte - contg. thiourea, hypophosphite, hydrochloric acid and the metalsInfo
- Publication number
- IT1087439B IT1087439B IT2943877A IT2943877A IT1087439B IT 1087439 B IT1087439 B IT 1087439B IT 2943877 A IT2943877 A IT 2943877A IT 2943877 A IT2943877 A IT 2943877A IT 1087439 B IT1087439 B IT 1087439B
- Authority
- IT
- Italy
- Prior art keywords
- thiourea
- hypophosphite
- contg
- metals
- hydrochloric acid
- Prior art date
Links
Landscapes
- Chemically Coating (AREA)
Abstract
An aq. electrolyte for deposition of Sn-Pb alloys comprises 7.5-75.0 g/1 Sn (as SnCl2), 1-99% total Sn+Pb concn. of Pb (as PbCl2), 10-200 g/1 of a thiourea, 0-300 g/1 NH4Cl, 10-200 g/1 Na+, NH4+ or K+ H2PO2-, 2H2O and 20-500 ml/1 conc HCl and has pH 0.5-1.5. The alloys deposited are pref. 93% Sn 7% Pb or 60% Sn 40% Pb. The complexing agent may be thiourea or di- or tetramethyl thiourea. When NH4Cl is employed to stabilised the bath it is pref. used in amounts of 40-300 g/1. 30-100 g/1 hypophosphate is used, pref. Na or K, and 20-150 ml/1 HCl. The bath is usually operated at 130-200 degrees F at current densities of 5-100 amp/ft2. Surfactants may be added. Circuit elements and terminals may be deposited onto printed circuit boards. Deposit compsn. is consistent and both can be operated at 5-800 amp/ft2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT2943877A IT1087439B (en) | 1977-11-08 | 1977-11-08 | Tin lead alloy plating electrolyte - contg. thiourea, hypophosphite, hydrochloric acid and the metals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT2943877A IT1087439B (en) | 1977-11-08 | 1977-11-08 | Tin lead alloy plating electrolyte - contg. thiourea, hypophosphite, hydrochloric acid and the metals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1087439B true IT1087439B (en) | 1985-06-04 |
Family
ID=11226995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT2943877A IT1087439B (en) | 1977-11-08 | 1977-11-08 | Tin lead alloy plating electrolyte - contg. thiourea, hypophosphite, hydrochloric acid and the metals |
Country Status (1)
| Country | Link |
|---|---|
| IT (1) | IT1087439B (en) |
-
1977
- 1977-11-08 IT IT2943877A patent/IT1087439B/en active
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