FR2408666A1 - Tin lead alloy plating electrolyte - contg. thiourea, hypophosphite, hydrochloric acid and the metals - Google Patents
Tin lead alloy plating electrolyte - contg. thiourea, hypophosphite, hydrochloric acid and the metalsInfo
- Publication number
- FR2408666A1 FR2408666A1 FR7734157A FR7734157A FR2408666A1 FR 2408666 A1 FR2408666 A1 FR 2408666A1 FR 7734157 A FR7734157 A FR 7734157A FR 7734157 A FR7734157 A FR 7734157A FR 2408666 A1 FR2408666 A1 FR 2408666A1
- Authority
- FR
- France
- Prior art keywords
- thiourea
- hypophosphite
- contg
- metals
- hydrochloric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
An aq. electrolyte for deposition of Sn-Pb alloys comprises 7.5-75.0 g/1 Sn (as SnCl2), 1-99% total Sn+Pb concn. of Pb (as PbCl2), 10-200 g/1 of a thiourea, 0-300 g/1 NH4Cl, 10-200 g/1 Na+, NH4+ or K+ H2PO2-, 2H2O and 20-500 ml/1 conc HCl and has pH 0.5-1.5. The alloys deposited are pref. 93% Sn 7% Pb or 60% Sn 40% Pb. The complexing agent may be thiourea or di- or tetramethyl thiourea. When NH4Cl is employed to stabilised the bath it is pref. used in amounts of 40-300 g/1. 30-100 g/1 hypophosphate is used, pref. Na or K, and 20-150 ml/1 HCl. The bath is usually operated at 130-200 degrees F at current densities of 5-100 amp/ft2. Surfactants may be added. Circuit elements and terminals may be deposited onto printed circuit boards. Deposit compsn. is consistent and both can be operated at 5-800 amp/ft2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7734157A FR2408666A1 (en) | 1977-11-14 | 1977-11-14 | Tin lead alloy plating electrolyte - contg. thiourea, hypophosphite, hydrochloric acid and the metals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7734157A FR2408666A1 (en) | 1977-11-14 | 1977-11-14 | Tin lead alloy plating electrolyte - contg. thiourea, hypophosphite, hydrochloric acid and the metals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2408666A1 true FR2408666A1 (en) | 1979-06-08 |
Family
ID=9197565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7734157A Withdrawn FR2408666A1 (en) | 1977-11-14 | 1977-11-14 | Tin lead alloy plating electrolyte - contg. thiourea, hypophosphite, hydrochloric acid and the metals |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2408666A1 (en) |
-
1977
- 1977-11-14 FR FR7734157A patent/FR2408666A1/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |