IT1072618B - Sistema resistivo di alta sensibilita' per metallizzazione a strappo - Google Patents

Sistema resistivo di alta sensibilita' per metallizzazione a strappo

Info

Publication number
IT1072618B
IT1072618B IT29279/76A IT2927976A IT1072618B IT 1072618 B IT1072618 B IT 1072618B IT 29279/76 A IT29279/76 A IT 29279/76A IT 2927976 A IT2927976 A IT 2927976A IT 1072618 B IT1072618 B IT 1072618B
Authority
IT
Italy
Prior art keywords
rip
metallization
high sensitivity
resistive system
sensitivity resistive
Prior art date
Application number
IT29279/76A
Other languages
English (en)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT1072618B publication Critical patent/IT1072618B/it

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143Masks therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/143Electron beam

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
IT29279/76A 1975-12-10 1976-11-12 Sistema resistivo di alta sensibilita' per metallizzazione a strappo IT1072618B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/639,551 US4024293A (en) 1975-12-10 1975-12-10 High sensitivity resist system for lift-off metallization

Publications (1)

Publication Number Publication Date
IT1072618B true IT1072618B (it) 1985-04-10

Family

ID=24564564

Family Applications (1)

Application Number Title Priority Date Filing Date
IT29279/76A IT1072618B (it) 1975-12-10 1976-11-12 Sistema resistivo di alta sensibilita' per metallizzazione a strappo

Country Status (7)

Country Link
US (1) US4024293A (it)
JP (1) JPS5272176A (it)
CA (1) CA1071455A (it)
DE (1) DE2655455C2 (it)
FR (1) FR2334980A1 (it)
GB (1) GB1514109A (it)
IT (1) IT1072618B (it)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5934296B2 (ja) * 1976-06-16 1984-08-21 松下電器産業株式会社 電子ビ−ムレジストおよびその使用方法
US4165395A (en) * 1977-06-30 1979-08-21 International Business Machines Corporation Process for forming a high aspect ratio structure by successive exposures with electron beam and actinic radiation
US4204009A (en) * 1977-12-30 1980-05-20 International Business Machines Corporation Two layer resist system
US4180604A (en) * 1977-12-30 1979-12-25 International Business Machines Corporation Two layer resist system
US4253888A (en) * 1978-06-16 1981-03-03 Matsushita Electric Industrial Co., Ltd. Pretreatment of photoresist masking layers resulting in higher temperature device processing
US4238559A (en) * 1978-08-24 1980-12-09 International Business Machines Corporation Two layer resist system
US4349620A (en) * 1979-06-15 1982-09-14 E. I. Du Pont De Nemours And Company Solvent developable photoresist film
US4341850A (en) * 1979-07-19 1982-07-27 Hughes Aircraft Company Mask structure for forming semiconductor devices, comprising electron-sensitive resist patterns with controlled line profiles
US4283483A (en) * 1979-07-19 1981-08-11 Hughes Aircraft Company Process for forming semiconductor devices using electron-sensitive resist patterns with controlled line profiles
CA1155238A (en) * 1979-11-27 1983-10-11 Richard E. Howard High resolution two-layer resists
JPS5676531A (en) * 1979-11-28 1981-06-24 Fujitsu Ltd Manufacture of semiconductor device
DE3027941A1 (de) * 1980-07-23 1982-02-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von reliefstrukturen aus doppellackschichten fuer integrierte halbleiterschaltungen, wobei zur strukturierung hochenergetische strahlung verwendet wird
US4415653A (en) * 1981-05-07 1983-11-15 Honeywell Inc. Method of making sensitive positive electron beam resists
US4352835A (en) * 1981-07-01 1982-10-05 Western Electric Co., Inc. Masking portions of a substrate
DE3131031A1 (de) * 1981-08-05 1983-02-24 Siemens AG, 1000 Berlin und 8000 München Verfahren zum erzeugen der felddotierung beim herstellen von integrierten komplementaeren mos-feldeffekttransistoren
US4389482A (en) * 1981-12-14 1983-06-21 International Business Machines Corporation Process for forming photoresists with strong resistance to reactive ion etching and high sensitivity to mid- and deep UV-light
US4647524A (en) * 1982-04-01 1987-03-03 Sullivan Donald F Transferring polymer from thin plastic films to photodevelop insulation patterns on printed wiring boards
US4556627A (en) * 1982-04-01 1985-12-03 Sullivan Donald F Transferring polymer from thin plastic films to photodevelop insulation patterns on printed wiring boards
EP0187870B1 (en) * 1984-07-23 1990-05-23 Nippon Telegraph and Telephone Corporation Pattern formation
EP0197519A3 (en) * 1985-04-10 1989-01-11 International Business Machines Corporation Process for masking and resist formation
US4912018A (en) * 1986-02-24 1990-03-27 Hoechst Celanese Corporation High resolution photoresist based on imide containing polymers
JP2538081B2 (ja) * 1988-11-28 1996-09-25 松下電子工業株式会社 現像液及びパタ―ン形成方法
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7932615B2 (en) * 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers
DE102006030359B4 (de) * 2006-06-30 2011-07-07 Infineon Technologies AG, 81669 Verfahren zum Entwickeln eines Photolacks
US8148055B2 (en) * 2006-06-30 2012-04-03 Infineon Technologies Ag Method for developing a photoresist
EP2835687B1 (en) 2013-08-06 2017-03-15 Ams Ag Method of producing a resist structure with undercut sidewall

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3535137A (en) * 1967-01-13 1970-10-20 Ibm Method of fabricating etch resistant masks
US3799777A (en) * 1972-06-20 1974-03-26 Westinghouse Electric Corp Micro-miniature electronic components by double rejection
US3930857A (en) * 1973-05-03 1976-01-06 International Business Machines Corporation Resist process
US3934057A (en) * 1973-12-19 1976-01-20 International Business Machines Corporation High sensitivity positive resist layers and mask formation process
US3987215A (en) * 1974-04-22 1976-10-19 International Business Machines Corporation Resist mask formation process
US3985597A (en) * 1975-05-01 1976-10-12 International Business Machines Corporation Process for forming passivated metal interconnection system with a planar surface

Also Published As

Publication number Publication date
GB1514109A (en) 1978-06-14
FR2334980B1 (it) 1978-12-22
JPS5324786B2 (it) 1978-07-22
DE2655455A1 (de) 1977-06-16
CA1071455A (en) 1980-02-12
US4024293A (en) 1977-05-17
DE2655455C2 (de) 1984-11-29
FR2334980A1 (fr) 1977-07-08
JPS5272176A (en) 1977-06-16

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