IT1070808B - Componente a semiconduttore con un dispositivo a semiconduttori disposto all interno di un anello costituito di materiale isolante elastico - Google Patents
Componente a semiconduttore con un dispositivo a semiconduttori disposto all interno di un anello costituito di materiale isolante elasticoInfo
- Publication number
- IT1070808B IT1070808B IT2724676A IT2724676A IT1070808B IT 1070808 B IT1070808 B IT 1070808B IT 2724676 A IT2724676 A IT 2724676A IT 2724676 A IT2724676 A IT 2724676A IT 1070808 B IT1070808 B IT 1070808B
- Authority
- IT
- Italy
- Prior art keywords
- insulating material
- placed inside
- ring made
- device placed
- semiconductor device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19752541971 DE2541971A1 (de) | 1975-09-19 | 1975-09-19 | Halbleiterbauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1070808B true IT1070808B (it) | 1985-04-02 |
Family
ID=5956967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT2724676A IT1070808B (it) | 1975-09-19 | 1976-09-16 | Componente a semiconduttore con un dispositivo a semiconduttori disposto all interno di un anello costituito di materiale isolante elastico |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5239375A (ja) |
| DE (1) | DE2541971A1 (ja) |
| ES (1) | ES451614A1 (ja) |
| IT (1) | IT1070808B (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6029664U (ja) * | 1983-08-02 | 1985-02-28 | 大塚 興二 | バインダ |
| DE3327992A1 (de) * | 1983-08-03 | 1985-02-21 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleitervorrichtung |
| JP3550243B2 (ja) * | 1996-01-30 | 2004-08-04 | 株式会社東芝 | 内部圧接型半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5091665U (ja) * | 1973-12-27 | 1975-08-02 |
-
1975
- 1975-09-19 DE DE19752541971 patent/DE2541971A1/de not_active Withdrawn
-
1976
- 1976-09-16 IT IT2724676A patent/IT1070808B/it active
- 1976-09-17 ES ES451614A patent/ES451614A1/es not_active Expired
- 1976-09-18 JP JP11238976A patent/JPS5239375A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE2541971A1 (de) | 1977-03-24 |
| JPS5239375A (en) | 1977-03-26 |
| JPS563670B2 (ja) | 1981-01-26 |
| ES451614A1 (es) | 1977-07-16 |
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