IT1063009B - Unita di collegamento a filo per connettere automaticamente elettrodi di un elemento,quale un elemento semiconduttore - Google Patents

Unita di collegamento a filo per connettere automaticamente elettrodi di un elemento,quale un elemento semiconduttore

Info

Publication number
IT1063009B
IT1063009B IT22953/76A IT2295376A IT1063009B IT 1063009 B IT1063009 B IT 1063009B IT 22953/76 A IT22953/76 A IT 22953/76A IT 2295376 A IT2295376 A IT 2295376A IT 1063009 B IT1063009 B IT 1063009B
Authority
IT
Italy
Prior art keywords
connection unit
wired connection
automatically connect
connect electrodes
semiconductor element
Prior art date
Application number
IT22953/76A
Other languages
English (en)
Italian (it)
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of IT1063009B publication Critical patent/IT1063009B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)
IT22953/76A 1975-05-10 1976-05-04 Unita di collegamento a filo per connettere automaticamente elettrodi di un elemento,quale un elemento semiconduttore IT1063009B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50056620A JPS51131273A (en) 1975-05-10 1975-05-10 Wire bonding process

Publications (1)

Publication Number Publication Date
IT1063009B true IT1063009B (it) 1985-02-11

Family

ID=13032311

Family Applications (1)

Application Number Title Priority Date Filing Date
IT22953/76A IT1063009B (it) 1975-05-10 1976-05-04 Unita di collegamento a filo per connettere automaticamente elettrodi di un elemento,quale un elemento semiconduttore

Country Status (7)

Country Link
US (1) US4054824A (enExample)
JP (1) JPS51131273A (enExample)
DE (1) DE2620600C2 (enExample)
FR (1) FR2311350A1 (enExample)
GB (1) GB1556172A (enExample)
IT (1) IT1063009B (enExample)
NL (1) NL173800C (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5350428U (enExample) * 1976-10-01 1978-04-28
US4255056A (en) * 1979-03-30 1981-03-10 Hardinge Brothers, Inc. Pre-setter for positioning tooling on turrets
NL8201653A (nl) * 1982-04-21 1983-11-16 Philips Nv Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat.
US4544889A (en) * 1983-09-12 1985-10-01 International Business Machines Corporation Robot precision probe positioner with guidance optics
US4627151A (en) * 1984-03-22 1986-12-09 Thomson Components-Mostek Corporation Automatic assembly of integrated circuits
DE3712064A1 (de) * 1987-04-09 1988-10-27 Prettl Laminar Flow & Prozesst Einrichtung zum bearbeiten von werkstuecken, insbesondere von wafern in einem reinraum einer halbleiterfertigung
US11880178B1 (en) 2010-11-16 2024-01-23 Ectoscan Systems, Llc Surface data, acquisition, storage, and assessment system
US9599461B2 (en) 2010-11-16 2017-03-21 Ectoscan Systems, Llc Surface data acquisition, storage, and assessment system
CA3084951A1 (en) 2017-12-06 2019-06-13 Ectoscan Systems, Llc Performance scanning system and method for improving athletic performance
WO2025029902A1 (en) 2023-07-31 2025-02-06 L'oreal Cosmetic securement device with universal cosmetic holder for stabilization of cosmetic applicator configured for users with limited mobility

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3038369A (en) * 1958-12-22 1962-06-12 Bell Telephone Labor Inc Positioning a transistor by use of the optical reflectance characteristics of the electrode stripes
GB1312663A (en) * 1970-05-28 1973-04-04 Ti Group Services Ltd Optical control means
US3955072A (en) * 1971-03-22 1976-05-04 Kasper Instruments, Inc. Apparatus for the automatic alignment of two superimposed objects for example a semiconductor wafer and a transparent mask
GB1366369A (en) * 1971-11-30 1974-09-11 Ferranti Ltd Detection of faults on surfaces
US3731098A (en) * 1972-03-06 1973-05-01 Spectrotherm Corp Image scanner drive system
US3805073A (en) * 1973-08-22 1974-04-16 Western Electric Co Method and apparatus for obtaining a stereoscopic thermal image of internal and surface portions of an article
DE2352113B2 (de) * 1973-10-17 1975-08-14 Eggert 8035 Gauting Herrmann Maschine zum automatischen Befestigen von Verbindungsdrähten an den Anschlußstellen eines Halbleiterkristalls

Also Published As

Publication number Publication date
DE2620600A1 (de) 1976-11-25
GB1556172A (en) 1979-11-21
FR2311350B1 (enExample) 1980-06-06
DE2620600C2 (de) 1983-10-20
JPS5423795B2 (enExample) 1979-08-16
NL173800B (nl) 1983-10-03
FR2311350A1 (fr) 1976-12-10
NL173800C (nl) 1984-03-01
NL7604900A (nl) 1976-11-12
US4054824A (en) 1977-10-18
JPS51131273A (en) 1976-11-15

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