IT1021575B - METHOD FOR FIXING AN ELECTRONIC COMPONENT ON A SUBSTRATE AND PREPARATION AND THEIR USE TO STABILIZE ORGANIC MATERIALS - Google Patents
METHOD FOR FIXING AN ELECTRONIC COMPONENT ON A SUBSTRATE AND PREPARATION AND THEIR USE TO STABILIZE ORGANIC MATERIALSInfo
- Publication number
- IT1021575B IT1021575B IT51988/74A IT5198874A IT1021575B IT 1021575 B IT1021575 B IT 1021575B IT 51988/74 A IT51988/74 A IT 51988/74A IT 5198874 A IT5198874 A IT 5198874A IT 1021575 B IT1021575 B IT 1021575B
- Authority
- IT
- Italy
- Prior art keywords
- substrate
- fixing
- preparation
- electronic component
- organic materials
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83234—Applying energy for connecting using means for applying energy being within the device, e.g. integrated heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09772—Conductors directly under a component but not electrically connected to the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3280773A GB1467245A (en) | 1973-07-10 | 1973-07-10 | Method of securing component to a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
IT1021575B true IT1021575B (en) | 1978-02-20 |
Family
ID=10344286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT51988/74A IT1021575B (en) | 1973-07-10 | 1974-07-09 | METHOD FOR FIXING AN ELECTRONIC COMPONENT ON A SUBSTRATE AND PREPARATION AND THEIR USE TO STABILIZE ORGANIC MATERIALS |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5069554A (en) |
DE (1) | DE2432812A1 (en) |
GB (1) | GB1467245A (en) |
IT (1) | IT1021575B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2147148A (en) * | 1983-09-27 | 1985-05-01 | John Patrick Burke | Electronic circuit assembly |
DE4211355A1 (en) * | 1992-04-04 | 1993-10-07 | Thomson Brandt Gmbh | Circuit board component mounting system - has adhesive between circuit component and circuit board section having rupture line allowing easy subsequent removal |
-
1973
- 1973-07-10 GB GB3280773A patent/GB1467245A/en not_active Expired
-
1974
- 1974-07-09 IT IT51988/74A patent/IT1021575B/en active
- 1974-07-09 DE DE2432812A patent/DE2432812A1/en active Pending
- 1974-07-10 JP JP49078340A patent/JPS5069554A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
GB1467245A (en) | 1977-03-16 |
DE2432812A1 (en) | 1975-01-30 |
JPS5069554A (en) | 1975-06-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NO140761C (en) | FACILITY FOR PROCESSING PRINTED MATTERS | |
BR7504396A (en) | PROCESS FOR THE PREPARATION OF ORGANIC AND COMPOSITE COMPOUNDS BASED ON THESE | |
NL7603463A (en) | MACHINE FOR AUTOMATICALLY FIXING ELECTRONIC CHAIN ELEMENTS OF PRINTED CHAINS TO THE SUBSTRATE THEREOF. | |
IT1076957B (en) | FUEL TABS AND METHOD TO PRODUCE THEM FROM ORGANIC FIBROUS MATERIALS | |
IT1090430B (en) | METHOD AND APPARATUS TO POLYMERIZE COATING MATERIALS | |
IT1057264B (en) | ORGANIC SULFURATED SILICON COMPOUNDS USEFUL AS ADHESIVES AND PROCEDURE FOR THEIR PRODUCTION | |
BR7605324A (en) | APPARATUS TO PRODUCE FERTILIZER WITH ORGANIC WASTE | |
IT1143831B (en) | PERFECTED ORGANIC DISSOLVEMENT COMPOSITIONS AND PROCEDURE FOR THEIR USE | |
BR7600385A (en) | PROCESS FOR THE PRODUCTION OF AN ORGANIC COMPOUND AND COMPOSITION BASED ON THIS COMPOUND | |
IT1035701B (en) | INORGANIC ORGANIC SYNTHETIC MATERIALS AND PROCEDURE FOR THEIR PRODUCTION | |
BE842347A (en) | IGNIFUGATION OF ORGANIC MATERIALS | |
SE389568B (en) | DEVICE FOR ELECTRONIC TAXAMETERS | |
IT1065419B (en) | PERFECTED PHOTOSENSITIVE MATERIALS | |
IT1052512B (en) | PROCEDURE AND EQUIPMENT FOR HARDENING COATINGS ABOVE SENSITIVE SUBSTRATES BY ELECTRONIC RAYS | |
FR2295997A1 (en) | OXIDIZABLE PARTICULAR MATTER PROTECTED BY AN ORGANIC COATING AND ITS PREPARATION PROCESS | |
SE435623B (en) | ORGANIC ALKYLENTITANATE COMPOUNDS | |
IT1021575B (en) | METHOD FOR FIXING AN ELECTRONIC COMPONENT ON A SUBSTRATE AND PREPARATION AND THEIR USE TO STABILIZE ORGANIC MATERIALS | |
IT1032140B (en) | PROCEDURE FOR PRODUCING INPGANIC ORGANIC SIMETHETIGI MATERIALS | |
IT1073834B (en) | ELECTRONIC STOPWATCH | |
SE7613832L (en) | METHOD FOR VATOXIDATIVE DECOMPOSITION OF ORGANIC ASSOCIATIONS IN WASTEWATER | |
SE7612951L (en) | DEVICE FOR MANUVERING THE TRANSPORTER BY A STRIKE PACKAGE OR SIMILAR | |
IT1096083B (en) | WAREHOUSE FOR MATERIALS PLACED ON PALETTE | |
IT1084841B (en) | PROCESS FOR FASTENING ORGANIC COMPOUNDS ON FIBROUS STRUCTURE MATERIALS | |
AR229077A1 (en) | PROCEDURE FOR COATING A SUBSTRATE WITH ORGANIC RESIN BY COAGULATION | |
IT1057924B (en) | PROCEDURE AND AGENTS TO PRODUCE REPELLENT COATINGS WITH STICKY MATERIALS |