DE2432812A1 - METHOD OF FASTENING AN ELECTRONIC COMPONENT TO A SUBSTRATE - Google Patents
METHOD OF FASTENING AN ELECTRONIC COMPONENT TO A SUBSTRATEInfo
- Publication number
- DE2432812A1 DE2432812A1 DE2432812A DE2432812A DE2432812A1 DE 2432812 A1 DE2432812 A1 DE 2432812A1 DE 2432812 A DE2432812 A DE 2432812A DE 2432812 A DE2432812 A DE 2432812A DE 2432812 A1 DE2432812 A1 DE 2432812A1
- Authority
- DE
- Germany
- Prior art keywords
- adhesive
- substrate
- thread
- component
- fastening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83234—Applying energy for connecting using means for applying energy being within the device, e.g. integrated heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09772—Conductors directly under a component but not electrically connected to the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
COHAUSZ & FLORACKCOHAUSZ & FLORACK
PAT ENT AN WALT S BU RO 4 DÜSSELDORF SCHUMANNSTR. 97 PAT ENT AN WALT S BU RO 4 DÜSSELDORF SCHUMANNSTR. 97
Lucas Aerospace LimitedLucas Aerospace Limited
Well StreetWell Street
GB-Binningham . 8. Juli 1974GB-Binningham. July 8, 1974
einem Substrata substrate
Elektronische Bauteile, beispielsweise monolithische Schaltkreis-' Bauteile oder "Pakete" werden üblicherweise an ein Substrat mit einer gedruckten Sdsaltung durch ein Klebemittel angebracht, um ein Erwärmen dieser Bauteile durch Löten zu vermeiden und um auch das Element und das Substrat in einen guten thermischen Kontakt zu bringen. Me Wahl eines geeigneten Klebemittels kann auch eine Vibrationsdämpfungsschicht mit sich bringen» Es entstehen dann jedoch Probleme bei der Entfernung eines Bauteils vom Substrat zur Reparatur oder zur Änderung der Schaltung.Electronic components, such as monolithic circuits Components or "packages" are commonly attached to a substrate with a printed circuit board by an adhesive to provide a To avoid heating these components by soldering and also to bring the element and the substrate into good thermal contact. Choosing a suitable adhesive can also result in a vibration-dampening layer »However, problems then arise when removing a component from the substrate in order to repair or change the circuit.
Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zur Befestigung eines Bauteils an einem Substrat zu schaffen, wobei das Verfahren die anschließende Entfernung des Bauteils vom Substrat erleichtert. The invention is based on the object of a method for fastening of a component on a substrate, the method facilitating the subsequent removal of the component from the substrate.
Erfindungsgemäß ist ein Verfahren zur Befestigung eines elektronischen Bauteils an einem Substrat mit einem Klebemaitteln dadurch gekennzeichnet, daß zwischen das Bauteil und das Substrat ein Faden gesetzt wird, der in einer Schlaufe angeordnet ist und sich aus dem Bereich des Bauteils und des Klebemittels erstreckt, wobei die Schlaufe einen erheblichen Teil der Fläche des Klebemittels zwischen dem Bauteil und dem Substrat umschließt.According to the invention is a method for attaching an electronic Component on a substrate with an adhesive, characterized in that a thread is placed between the component and the substrate which is arranged in a loop and extends from the region of the component and the adhesive, the loop having a encloses a considerable part of the area of the adhesive between the component and the substrate.
In einem bevorzugten Ausführungsbeispiel ist die Schlaufe als eine 28 260 In a preferred embodiment, the loop is designed as a 28,260
409885/1022 - 2 -409885/1022 - 2 -
Vielzahl von Windungen innerhalb des Klebemittels vorgesehen.Multiple turns are provided within the adhesive.
In einem weiteren bevorzugten Ausführungsbeispiel erstrecken sich beide Enden der Schlaufe an dem Bereich des Klebemittels heraus.In a further preferred embodiment, both ends of the loop extend out at the area of the adhesive.
Die Erfindung besteht ferner-in der Kombination aus einem Bauteil und einem Substrat, die nach dem vorstehenden Verfahren miteinander verbunden sind.The invention also consists in the combination of one component and a substrate bonded together by the above method.
Die Erfindung ist nachstehend an Hand eines Ausführungsbeispiels unter Bezugnahme auf die Zeichnung näher erläutert. In der Zeichnung sind:The invention is explained in more detail below using an exemplary embodiment with reference to the drawing. In the drawing are:
Fig. 1 eine Ansicht eines Bauteils, das an einem Substrat nachFig. 1 is a view of a component that is attached to a substrate according to
einem Verfahren gemäß der Erfindung befestigt ist, Fig. 2 ein Schnitt an der Linie 2-2 der Pig. 1 und Pig. 3 eine Ansicht ähnlicher Darstellung in Pig. 2, in der eine Alternativanordnung gezeigt ist.a method according to the invention, Fig. 2 is a section on line 2-2 of Pig. 1 and Pig. 3 is a similar view in Pig. 2 showing an alternative arrangement.
Ein Keramiksubstrat 10 hat ein durch eine Schicht 12 aus Klebemittel daran befestigtes elektronisches Bauteil 11. Ein geeignetes Kelebemittel für diesen Zweck ist ein kaltgehärtetes Einteil-Silikongummi mit niedriger Heißfestigkeit, beispielsweise DOW COiOiIIiG ADHESIVE SEALAUT Uo. 738. Zwischen das Bauteil 11 und das Substrat 10 ist ein Faden 13 geschaltet, der als eineSchlaufe angeordnet ist, deren Enden sich aus dem Bereich des Bauteils 11 und der Klebemittelshhicht 12 erstrecken.A ceramic substrate 10 has a layer 12 of adhesive electronic component attached to it 11. A suitable glue means for this purpose is a one-piece cold-cured silicone rubber with low hot strength, for example DOW COiOiIIiG ADHESIVE SEALAUT Uo. 738. Between the component 11 and the substrate 10 a thread 13 is connected, which is arranged as a loop whose End from the area of the component 11 and the adhesive layer 12 extend.
Es versteht sich, daß der Begriff Faden sich auf Monofäden als auch auf Fäden erstreckt, die aus mehreren Gespinsten zusammenges4zt sind. Der Faden 13 kann aus irgendeinem geeigneten Material bestehen, zum Beeispiel Metall oder Uylon, das ausreichend stark ist, um durch die Klebemittelschicht 12 zu schneiden, wenn diese ausgehärtet ist. In einem bevorzugten Ausführungsbeispiel handelt es sich bei dem Faden 13 um einen halbharten Edelstahl-Monofaden mit einem Durchmesser von 0,19 mm.It should be understood that the term thread applies to monofilaments as well extends to threads that are composed of several webs. The thread 13 can be made of any suitable material for For example metal or uylon that is strong enough to pass through cut the adhesive layer 12 when it has cured. In a preferred embodiment, the thread 13 is a semi-hard stainless steel monofilament with a diameter of 0.19 mm.
409885/1022 " 5 "409885/1022 " 5 "
Die Schlaufe des Fadens 13 is* vorzugsweise als eine Folge von Windungen angeordnet, die sich im wesentlichen über die gesamte Breite der Klebemittelschxcht 12 erstrecken. Ferner umschließt die Schlaufe selbst einen erheblichen Teil der Fläche der Klebemittelschicht 12. Wenn ein Ende des Fadens also gezogen wird, schneiden sich die Windungen der Schlaufe durch sukzessive Bereiche der Klebemittelschicht, um das Bauteil 11 am Substrat 10 durch einen Klebemittelbereich befestigt zu halten» weas ein leichtes Entfernen des Bauteile ermöglicht.The loop of the thread 13 is * preferably as a series of turns arranged, which extend over the entire width of the adhesive tube 12 substantially. Furthermore, the loop encloses itself a substantial portion of the area of the adhesive layer 12. Thus, when one end of the thread is pulled, the turns intersect the loop through successive areas of the adhesive layer, to keep the component 11 attached to the substrate 10 by an adhesive area »which enables easy removal of the component.
Es versteht sich, daß die tatsächliche Anordnug des Fadens mit seiner Schlaufe so geändert werden kann, daß irgendeine gewünschte Fläche des Klebemittels durchschnitten wird. Wie in Fig. 3 gezeigt ist, kann der Faden 13 so angeordnet sein, daß er im wesentlichen durch die gesamte Klebemittelschicht 12 schneidet.It is understood that the actual arrangement of the thread with his Loop can be altered to cut any desired area of adhesive. As shown in Fig. 3, the thread 13 can be arranged so that it is substantially through the entire adhesive layer 12 cuts.
Die Schicht 12 des Klebemittels in seinem nicht ausgehärteten Zustand wird zweckmäßigerweise auf einen der zu verbindenden Teile aufgetragen, und der Faden 13 wird auf das nicht ausgehärtete Klebemittel gesetzt, ehe ein Zusammenpassen mit dem anderen Teil erfolgt. Alternativ kann der Faden 13 in Vorbereitung an einem getrennten Plättchen befestigt sein, und die Klebemittelschicht 12 kann in zwei Auftragungen auf der einen wie auf der anderen Seite des Plättchens vorgesehen sein.The layer 12 of the adhesive in its uncured state is expediently applied to one of the parts to be connected, and the thread 13 is applied to the uncured adhesive set before fitting with the other part. Alternatively, the thread 13 can be prepared on a separate plate and the adhesive layer 12 can be provided in two applications on one side as on the other side of the wafer be.
Das vorstehend beschriebene Verfahren ermöglicht eine höhere Packdichte von Bauteilen auf einem Substrat als sich das bisher als möglich erwiesen hat, da es nicht mehr erforderlich ist, für einen ausreichenden Raum zwischen den Bauteilen zu sorgen, damit das Einsetzen eines Messers oder eines entsprechenden Werkzeugs ermöglicht wird, um durch das Klebemittel zu schneiden.The method described above enables a higher packing density of components on a substrate than that has so far proven possible, since it is no longer necessary for a sufficient To provide space between the components so that the insertion of a knife or a corresponding tool is possible, to cut through the adhesive.
AnsprücheExpectations
.. 9 8 8 5 / 1 0 2 2.. 9 8 8 5/1 0 2 2
Claims (6)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3280773A GB1467245A (en) | 1973-07-10 | 1973-07-10 | Method of securing component to a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2432812A1 true DE2432812A1 (en) | 1975-01-30 |
Family
ID=10344286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2432812A Pending DE2432812A1 (en) | 1973-07-10 | 1974-07-09 | METHOD OF FASTENING AN ELECTRONIC COMPONENT TO A SUBSTRATE |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5069554A (en) |
DE (1) | DE2432812A1 (en) |
GB (1) | GB1467245A (en) |
IT (1) | IT1021575B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4211355A1 (en) * | 1992-04-04 | 1993-10-07 | Thomson Brandt Gmbh | Circuit board component mounting system - has adhesive between circuit component and circuit board section having rupture line allowing easy subsequent removal |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2147148A (en) * | 1983-09-27 | 1985-05-01 | John Patrick Burke | Electronic circuit assembly |
-
1973
- 1973-07-10 GB GB3280773A patent/GB1467245A/en not_active Expired
-
1974
- 1974-07-09 IT IT51988/74A patent/IT1021575B/en active
- 1974-07-09 DE DE2432812A patent/DE2432812A1/en active Pending
- 1974-07-10 JP JP49078340A patent/JPS5069554A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4211355A1 (en) * | 1992-04-04 | 1993-10-07 | Thomson Brandt Gmbh | Circuit board component mounting system - has adhesive between circuit component and circuit board section having rupture line allowing easy subsequent removal |
Also Published As
Publication number | Publication date |
---|---|
GB1467245A (en) | 1977-03-16 |
IT1021575B (en) | 1978-02-20 |
JPS5069554A (en) | 1975-06-10 |
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