IT1019985B - Processo chimico di ricoprimento superficiale con metalli - Google Patents
Processo chimico di ricoprimento superficiale con metalliInfo
- Publication number
- IT1019985B IT1019985B IT26359/74A IT2635974A IT1019985B IT 1019985 B IT1019985 B IT 1019985B IT 26359/74 A IT26359/74 A IT 26359/74A IT 2635974 A IT2635974 A IT 2635974A IT 1019985 B IT1019985 B IT 1019985B
- Authority
- IT
- Italy
- Prior art keywords
- metals
- chemical process
- surface covering
- covering
- chemical
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US38864873A | 1973-08-15 | 1973-08-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT1019985B true IT1019985B (it) | 1977-11-30 |
Family
ID=23534947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT26359/74A IT1019985B (it) | 1973-08-15 | 1974-08-14 | Processo chimico di ricoprimento superficiale con metalli |
Country Status (10)
Country | Link |
---|---|
JP (1) | JPS5050235A (it) |
AT (1) | AT333564B (it) |
BE (1) | BE818613A (it) |
DE (1) | DE2439075A1 (it) |
ES (1) | ES429298A1 (it) |
FR (1) | FR2240961B1 (it) |
GB (1) | GB1453174A (it) |
IT (1) | IT1019985B (it) |
NL (1) | NL7410936A (it) |
SE (1) | SE7410276L (it) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4232060A (en) * | 1979-01-22 | 1980-11-04 | Richardson Chemical Company | Method of preparing substrate surface for electroless plating and products produced thereby |
DE2854403C2 (de) * | 1978-12-16 | 1986-07-03 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur Reaktivierung und Weiterbeschichtung von Nickel- oder Nickel- Phosphor-Schichten |
DE3380413D1 (en) * | 1982-04-27 | 1989-09-21 | Richardson Chemical Co | Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby |
KR960003723B1 (ko) * | 1986-05-19 | 1996-03-21 | 하라마 카세이 고오교오 가부시끼가이샤 | 기판 금속의 표면상에 금속 필름을 형성하는 방법 |
-
1974
- 1974-08-08 BE BE147398A patent/BE818613A/xx unknown
- 1974-08-12 SE SE7410276A patent/SE7410276L/xx unknown
- 1974-08-14 GB GB3580274A patent/GB1453174A/en not_active Expired
- 1974-08-14 ES ES429298A patent/ES429298A1/es not_active Expired
- 1974-08-14 IT IT26359/74A patent/IT1019985B/it active
- 1974-08-14 AT AT667574A patent/AT333564B/de not_active IP Right Cessation
- 1974-08-14 DE DE2439075A patent/DE2439075A1/de active Pending
- 1974-08-14 FR FR7428240A patent/FR2240961B1/fr not_active Expired
- 1974-08-15 NL NL7410936A patent/NL7410936A/xx unknown
- 1974-08-15 JP JP49092890A patent/JPS5050235A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
AT333564B (de) | 1976-11-25 |
JPS5050235A (it) | 1975-05-06 |
NL7410936A (nl) | 1975-02-18 |
DE2439075A1 (de) | 1975-03-06 |
SE7410276L (it) | 1975-02-17 |
ATA667574A (de) | 1976-03-15 |
FR2240961A1 (it) | 1975-03-14 |
BE818613A (fr) | 1975-02-10 |
FR2240961B1 (it) | 1978-06-09 |
GB1453174A (en) | 1976-10-20 |
ES429298A1 (es) | 1976-08-16 |
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