IT1001264B - Dispositivo elettrico comprendente elementi resistivi a strati sottili e suo procedimento di costruzione - Google Patents

Dispositivo elettrico comprendente elementi resistivi a strati sottili e suo procedimento di costruzione

Info

Publication number
IT1001264B
IT1001264B IT83675/73A IT8367573A IT1001264B IT 1001264 B IT1001264 B IT 1001264B IT 83675/73 A IT83675/73 A IT 83675/73A IT 8367573 A IT8367573 A IT 8367573A IT 1001264 B IT1001264 B IT 1001264B
Authority
IT
Italy
Prior art keywords
device including
thin layer
electrical device
resistive elements
construction procedure
Prior art date
Application number
IT83675/73A
Other languages
English (en)
Original Assignee
Cii Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cii Honeywell Bull filed Critical Cii Honeywell Bull
Application granted granted Critical
Publication of IT1001264B publication Critical patent/IT1001264B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Weting (AREA)
IT83675/73A 1972-12-14 1973-12-13 Dispositivo elettrico comprendente elementi resistivi a strati sottili e suo procedimento di costruzione IT1001264B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7244558A FR2210881B1 (it) 1972-12-14 1972-12-14

Publications (1)

Publication Number Publication Date
IT1001264B true IT1001264B (it) 1976-04-20

Family

ID=9108698

Family Applications (1)

Application Number Title Priority Date Filing Date
IT83675/73A IT1001264B (it) 1972-12-14 1973-12-13 Dispositivo elettrico comprendente elementi resistivi a strati sottili e suo procedimento di costruzione

Country Status (6)

Country Link
US (1) US3849757A (it)
DE (1) DE2362241A1 (it)
FR (1) FR2210881B1 (it)
GB (1) GB1445018A (it)
IT (1) IT1001264B (it)
NL (1) NL7316959A (it)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE29676E (en) * 1973-09-03 1978-06-20 Nippon Electric Company, Limited Matrix resistors for integrated circuit
US3906430A (en) * 1974-08-29 1975-09-16 Nippon Electric Co Matrix resistors for integrated circuit
US3943473A (en) * 1974-04-29 1976-03-09 Square D Company Current limiting circuit breaker
US3986255A (en) * 1974-11-29 1976-10-19 Itek Corporation Process for electrically interconnecting chips with substrates employing gold alloy bumps and magnetic materials therein
US4053866A (en) * 1975-11-24 1977-10-11 Trw Inc. Electrical resistor with novel termination and method of making same
US4139832A (en) * 1976-03-19 1979-02-13 Hitachi, Ltd. Glass-coated thick film resistor
DE3005662C2 (de) * 1980-02-15 1983-10-27 G. Rau GmbH & Co, 7530 Pforzheim Verfahren zur Herstellung eines Kontaktelementes
US4467312A (en) * 1980-12-23 1984-08-21 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor resistor device
US4396900A (en) * 1982-03-08 1983-08-02 The United States Of America As Represented By The Secretary Of The Navy Thin film microstrip circuits
JPS5916084A (ja) * 1982-07-19 1984-01-27 Nitto Electric Ind Co Ltd 入力タブレツト
JPS59185801U (ja) * 1983-05-26 1984-12-10 アルプス電気株式会社 チツプ抵抗
FR2567709B1 (fr) * 1984-07-11 1990-11-09 Nec Corp Ensemble a paillette comprenant un substrat de cablage multi-couche
JPS61188901A (ja) * 1985-02-16 1986-08-22 株式会社日本自動車部品総合研究所 流量センサ用膜式抵抗
DE3605425A1 (de) * 1986-02-20 1987-08-27 Standard Elektrik Lorenz Ag Duennschichtschaltung und ein verfahren zu ihrer herstellung
WO1996004668A1 (en) * 1994-08-05 1996-02-15 Philips Electronics N.V. Electrically resistive structure
WO1997030461A1 (en) * 1996-02-15 1997-08-21 Bourns, Inc. Resistor network in ball grid array package
CA2246405A1 (en) * 1996-12-17 1998-06-25 Yozo Ohara Circuit board having electric component and its manufacturing method
JPH10261507A (ja) * 1997-03-18 1998-09-29 Murata Mfg Co Ltd サーミスタ素子
US6414585B1 (en) 1997-05-13 2002-07-02 Chipscale, Inc. Integrated passive components and package with posts
US6051489A (en) * 1997-05-13 2000-04-18 Chipscale, Inc. Electronic component package with posts on the active side of the substrate
US6097277A (en) * 1998-11-05 2000-08-01 Cts Resistor network with solder sphere connector
US6703666B1 (en) * 1999-07-14 2004-03-09 Agere Systems Inc. Thin film resistor device and a method of manufacture therefor
US6292091B1 (en) * 1999-07-22 2001-09-18 Rohm Co., Ltd. Resistor and method of adjusting resistance of the same
US6489035B1 (en) 2000-02-08 2002-12-03 Gould Electronics Inc. Applying resistive layer onto copper
US6489034B1 (en) 2000-02-08 2002-12-03 Gould Electronics Inc. Method of forming chromium coated copper for printed circuit boards
US6622374B1 (en) 2000-09-22 2003-09-23 Gould Electronics Inc. Resistor component with multiple layers of resistive material
US6576489B2 (en) * 2001-05-07 2003-06-10 Applied Materials, Inc. Methods of forming microstructure devices
US6798189B2 (en) * 2001-06-14 2004-09-28 Koa Corporation Current detection resistor, mounting structure thereof and method of measuring effective inductance
JP3826749B2 (ja) 2001-08-22 2006-09-27 株式会社日立製作所 シャント抵抗を備えた電力変換装置
US6897761B2 (en) * 2002-12-04 2005-05-24 Cts Corporation Ball grid array resistor network
US7180186B2 (en) 2003-07-31 2007-02-20 Cts Corporation Ball grid array package
US6946733B2 (en) * 2003-08-13 2005-09-20 Cts Corporation Ball grid array package having testing capability after mounting
US20050046543A1 (en) * 2003-08-28 2005-03-03 Hetzler Ullrich U. Low-impedance electrical resistor and process for the manufacture of such resistor
US7342804B2 (en) * 2004-08-09 2008-03-11 Cts Corporation Ball grid array resistor capacitor network

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3256588A (en) * 1962-10-23 1966-06-21 Philco Corp Method of fabricating thin film r-c circuits on single substrate
US3296574A (en) * 1962-12-21 1967-01-03 Tassara Luigi Film resistors with multilayer terminals
US3456159A (en) * 1963-08-08 1969-07-15 Ibm Connections for microminiature functional components
US3562040A (en) * 1967-05-03 1971-02-09 Itt Method of uniformally and rapidly etching nichrome
FR1554767A (it) * 1967-11-14 1969-01-24
US3649945A (en) * 1971-01-20 1972-03-14 Fairchild Camera Instr Co Thin film resistor contact

Also Published As

Publication number Publication date
GB1445018A (en) 1976-08-04
FR2210881A1 (it) 1974-07-12
NL7316959A (it) 1974-06-18
FR2210881B1 (it) 1976-04-23
DE2362241A1 (de) 1974-06-20
US3849757A (en) 1974-11-19

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