IN2014DN05663A - - Google Patents

Info

Publication number
IN2014DN05663A
IN2014DN05663A IN5663DEN2014A IN2014DN05663A IN 2014DN05663 A IN2014DN05663 A IN 2014DN05663A IN 5663DEN2014 A IN5663DEN2014 A IN 5663DEN2014A IN 2014DN05663 A IN2014DN05663 A IN 2014DN05663A
Authority
IN
India
Application number
Inventor
James William Vangilder
Original Assignee
Schneider Electric It Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schneider Electric It Corp filed Critical Schneider Electric It Corp
Publication of IN2014DN05663A publication Critical patent/IN2014DN05663A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/28—Design optimisation, verification or simulation using fluid dynamics, e.g. using Navier-Stokes equations or computational fluid dynamics [CFD]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/704—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow using marked regions or existing inhomogeneities within the fluid stream, e.g. statistically occurring variations in a fluid parameter
    • G01F1/708—Measuring the time taken to traverse a fixed distance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • G01K7/427—Temperature calculation based on spatial modeling, e.g. spatial inter- or extrapolation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/10—Geometric CAD
    • G06F30/13—Architectural design, e.g. computer-aided architectural design [CAAD] related to design of buildings, bridges, landscapes, production plants or roads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00—Details relating to the application field
    • G06F2113/08—Fluids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/08—Thermal analysis or thermal optimisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Evolutionary Computation (AREA)
  • Mathematical Optimization (AREA)
  • Mathematical Analysis (AREA)
  • Pure & Applied Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Computational Mathematics (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • Architecture (AREA)
  • Algebra (AREA)
  • Computing Systems (AREA)
  • Mathematical Physics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IN5663DEN2014 2011-12-22 2014-07-08 IN2014DN05663A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/066776 WO2013095494A1 (en) 2011-12-22 2011-12-22 System and method for prediction of temperature values in an electronics system

Publications (1)

Publication Number Publication Date
IN2014DN05663A true IN2014DN05663A (en) 2015-04-03

Family

ID=48669136

Family Applications (1)

Application Number Title Priority Date Filing Date
IN5663DEN2014 IN2014DN05663A (en) 2011-12-22 2014-07-08

Country Status (6)

Country Link
US (1) US9830410B2 (en)
EP (1) EP2796025A4 (en)
CN (1) CN104137660B (en)
AU (2) AU2011383606A1 (en)
IN (1) IN2014DN05663A (en)
WO (1) WO2013095494A1 (en)

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WO2008144375A2 (en) 2007-05-15 2008-11-27 American Power Conversion Corporation Methods and systems for managing facility power and cooling
AU2011384046A1 (en) 2011-12-22 2014-07-17 Schneider Electric It Corporation Analysis of effect of transient events on temperature in a data center
AU2011383606A1 (en) 2011-12-22 2014-07-17 Schneider Electric It Corporation System and method for prediction of temperature values in an electronics system
CN104797990B (en) 2012-09-21 2017-10-24 施耐德电气It公司 Method and instrument for characterizing hot mapping
WO2014105014A1 (en) 2012-12-27 2014-07-03 Schneider Electric It Corporation Systems and methods of visualizing airflow
US9529641B2 (en) * 2013-08-26 2016-12-27 Cisco Technology, Inc. Data center thermal model
US10001761B2 (en) 2014-12-30 2018-06-19 Schneider Electric It Corporation Power consumption model for cooling equipment
WO2016130453A1 (en) * 2015-02-09 2016-08-18 Schneider Electric It Corporation System and methods for simulation-based optimization of data center cooling equipment
US10422760B2 (en) * 2015-03-31 2019-09-24 Ngk Insulators, Ltd. Method for analyzing honeycomb structure, and program and analysis device for the same
EP3091455A3 (en) * 2015-05-07 2016-11-16 Airbus Group India Private Limited Thermal analysis of electronics racks
US10617038B2 (en) * 2016-07-08 2020-04-07 Schneider Electric It Corporation Zero-equation turbulence models for large electrical and electronics enclosure applications
US11076509B2 (en) 2017-01-24 2021-07-27 The Research Foundation for the State University Control systems and prediction methods for it cooling performance in containment
US10817033B2 (en) * 2017-12-14 2020-10-27 Schneider Electric It Corporation Method and system for predicting effect of a transient event on a data center
US11582887B2 (en) 2018-07-17 2023-02-14 Schneider Electric It Corporation Methods of balancing airflow in ceiling-ducted containment systems
US11419247B2 (en) * 2020-03-25 2022-08-16 Kyndryl, Inc. Controlling a working condition of electronic devices
US11188214B2 (en) * 2020-03-31 2021-11-30 Schneider Electric It Corporation Systems and methods for determining liquid cooled architectures in an IT room
CN112800687B (en) * 2021-04-06 2021-06-22 联想长风科技(北京)有限公司 Method and system for evaluating product heat dissipation scheme
CN113158595B (en) * 2021-04-23 2024-02-02 重庆中国三峡博物馆 Construction method of three-dimensional transient temperature field model in museum cultural relics showcase

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US20150025833A1 (en) 2015-01-22
EP2796025A4 (en) 2016-06-29
CN104137660A (en) 2014-11-05
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