IN2014CN04750A - - Google Patents
Info
- Publication number
- IN2014CN04750A IN2014CN04750A IN4750CHN2014A IN2014CN04750A IN 2014CN04750 A IN2014CN04750 A IN 2014CN04750A IN 4750CHN2014 A IN4750CHN2014 A IN 4750CHN2014A IN 2014CN04750 A IN2014CN04750 A IN 2014CN04750A
- Authority
- IN
- India
- Prior art keywords
- chamber
- exit window
- light
- light exit
- light source
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/62—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
- F21S8/026—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/02—Combinations of only two kinds of elements
- F21V13/08—Combinations of only two kinds of elements the elements being filters or photoluminescent elements and reflectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/12—Combinations of only three kinds of elements
- F21V13/14—Combinations of only three kinds of elements the elements being filters or photoluminescent elements, reflectors and refractors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
- F21V9/38—Combination of two or more photoluminescent elements of different materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- Semiconductor Lasers (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161576398P | 2011-12-16 | 2011-12-16 | |
| PCT/IB2012/056932 WO2013088296A1 (en) | 2011-12-16 | 2012-12-04 | Optical arrangement with diffractive optics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2014CN04750A true IN2014CN04750A (enrdf_load_stackoverflow) | 2015-09-18 |
Family
ID=47553297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN4750CHN2014 IN2014CN04750A (enrdf_load_stackoverflow) | 2011-12-16 | 2012-12-04 |
Country Status (6)
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2013186954A1 (ja) * | 2012-06-11 | 2016-02-01 | 日本電気株式会社 | 光源ユニット、投射型表示装置、照明器具及び光出射方法 |
| DE102012109806A1 (de) * | 2012-10-15 | 2014-04-17 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement |
| EP3095142B1 (en) * | 2013-12-19 | 2020-10-07 | Lumileds Holding B.V. | Led module with uniform phosphor illumination |
| CN106501994B (zh) * | 2015-09-08 | 2021-10-29 | 青岛海信电器股份有限公司 | 一种量子点发光器件、背光模组及显示装置 |
| JP6459104B2 (ja) * | 2016-03-04 | 2019-01-30 | パナソニックIpマネジメント株式会社 | 波長変換装置及び照明装置 |
| US10677421B2 (en) * | 2017-03-24 | 2020-06-09 | Panasonic Intellectual Property Management Co., Ltd. | Illumination apparatus |
| JP2019192442A (ja) * | 2018-04-23 | 2019-10-31 | セイコーエプソン株式会社 | 光源装置、プロジェクター、および光源装置の製造方法 |
| CN111812887A (zh) * | 2019-04-11 | 2020-10-23 | 合肥工业大学 | 一种激光背光模组及其应用的液晶显示器 |
| US11346528B2 (en) * | 2019-08-16 | 2022-05-31 | Kenall Manufacturing Company | Lighting fixture having uniform brightness |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9919689D0 (en) * | 1999-08-19 | 1999-10-20 | Microsharp Corp Limited | Back-lighting arrangement and the like |
| TW552726B (en) * | 2001-07-26 | 2003-09-11 | Matsushita Electric Works Ltd | Light emitting device in use of LED |
| US7192161B1 (en) * | 2001-10-18 | 2007-03-20 | Ilight Technologies, Inc. | Fluorescent illumination device |
| DE10164033B4 (de) * | 2001-12-28 | 2010-08-05 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einer Mehrzahl von Lichtquellen |
| CN1384391A (zh) * | 2002-05-27 | 2002-12-11 | 胜华科技股份有限公司 | 背光模块之结构 |
| JP4230258B2 (ja) * | 2003-03-19 | 2009-02-25 | 東北パイオニア株式会社 | 有機elパネル、有機elパネルの製造方法 |
| US7837348B2 (en) * | 2004-05-05 | 2010-11-23 | Rensselaer Polytechnic Institute | Lighting system using multiple colored light emitting sources and diffuser element |
| EP1622205A3 (en) * | 2004-07-29 | 2006-02-08 | Schott AG | Electronic package incorporating electronic components generating and/or receiving light-based signals |
| KR101174770B1 (ko) * | 2005-02-28 | 2012-08-17 | 엘지디스플레이 주식회사 | 백라이트 유닛 및 이를 이용한 액정표시장치 |
| JP4688553B2 (ja) * | 2005-04-18 | 2011-05-25 | 京セラ株式会社 | 発光装置および照明装置 |
| CN1316304C (zh) * | 2005-05-23 | 2007-05-16 | 深圳市中电淼浩固体光源有限公司 | 一种使用六色单元封装的led光源的lcd背光系统 |
| WO2007002234A1 (en) * | 2005-06-23 | 2007-01-04 | Rensselaer Polytechnic Institute | Package design for producing white light with short-wavelength leds and down-conversion materials |
| US7519287B2 (en) * | 2005-08-19 | 2009-04-14 | Avago Technologies Ecbu Ip (Singapore) Pte, Ltd. | Electronic flash, imaging device and method for producing a flash of light having a rectangular radiation pattern |
| TWI396814B (zh) * | 2005-12-22 | 2013-05-21 | 克里公司 | 照明裝置 |
| US7703942B2 (en) * | 2006-08-31 | 2010-04-27 | Rensselaer Polytechnic Institute | High-efficient light engines using light emitting diodes |
| US7889421B2 (en) * | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
| WO2008070604A1 (en) * | 2006-12-04 | 2008-06-12 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
| KR20100037108A (ko) * | 2007-06-29 | 2010-04-08 | 아벨 시스템즈 인코포레이션 | 회절 부재를 이용한 led 조명 장치 |
| RU2010143026A (ru) * | 2008-03-21 | 2012-04-27 | Конинклейке Филипс Элкектроникс Н.В. (Nl) | Светящееся устройство |
| JP2010092705A (ja) * | 2008-10-08 | 2010-04-22 | Sony Corp | 照明装置及びこれを用いた表示装置 |
| JP5440064B2 (ja) * | 2008-10-21 | 2014-03-12 | 東芝ライテック株式会社 | 照明装置 |
| KR101064478B1 (ko) | 2009-06-24 | 2011-09-15 | 경북대학교 산학협력단 | 점광원을 이용한 면발광 백라이트 유닛 및 면발광 램프 |
| JP2011009052A (ja) * | 2009-06-25 | 2011-01-13 | Panasonic Corp | 面光源および液晶ディスプレイ装置 |
| TW201110423A (en) * | 2009-09-11 | 2011-03-16 | Power Light Tech Co Ltd | Light-emitting diode illumination device capable of adjusting color temperature |
| JP2011204888A (ja) * | 2010-03-25 | 2011-10-13 | Panasonic Corp | 発光装置及びそれを用いたバックライトモジュール |
| US20120019890A1 (en) * | 2010-07-22 | 2012-01-26 | J Touch Corporation | Electrochromic unit and display device using the same |
| CN101936475A (zh) * | 2010-09-24 | 2011-01-05 | 鸿富锦精密工业(深圳)有限公司 | 双色混光led点光源装置 |
| JP5731303B2 (ja) * | 2011-07-14 | 2015-06-10 | 株式会社小糸製作所 | 発光モジュール |
| TW201416623A (zh) * | 2012-10-25 | 2014-05-01 | 隆達電子股份有限公司 | 燈具 |
| TW201441547A (zh) * | 2013-04-24 | 2014-11-01 | Lite On Technology Corp | 燈泡結構及其導光式燈罩 |
-
2012
- 2012-12-04 US US14/365,268 patent/US20140328049A1/en not_active Abandoned
- 2012-12-04 WO PCT/IB2012/056932 patent/WO2013088296A1/en active Search and Examination
- 2012-12-04 EP EP12813513.4A patent/EP2791574B1/en not_active Not-in-force
- 2012-12-04 JP JP2014546682A patent/JP2015506071A/ja active Pending
- 2012-12-04 IN IN4750CHN2014 patent/IN2014CN04750A/en unknown
- 2012-12-04 CN CN201280061993.2A patent/CN103998860A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN103998860A (zh) | 2014-08-20 |
| EP2791574B1 (en) | 2016-05-18 |
| EP2791574A1 (en) | 2014-10-22 |
| JP2015506071A (ja) | 2015-02-26 |
| US20140328049A1 (en) | 2014-11-06 |
| WO2013088296A1 (en) | 2013-06-20 |
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