IN2013CH04361A - - Google Patents

Info

Publication number
IN2013CH04361A
IN2013CH04361A IN4361CH2013A IN2013CH04361A IN 2013CH04361 A IN2013CH04361 A IN 2013CH04361A IN 4361CH2013 A IN4361CH2013 A IN 4361CH2013A IN 2013CH04361 A IN2013CH04361 A IN 2013CH04361A
Authority
IN
India
Prior art keywords
cooling
cooling zone
components
zone
casing
Prior art date
Application number
Other languages
English (en)
Inventor
Krishnakumar Varadarajan
Anand V Reddy
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Priority to PCT/US2014/052370 priority Critical patent/WO2015047615A1/en
Priority to IN4361CH2013 priority patent/IN2013CH04361A/en
Priority to US14/905,275 priority patent/US10165705B2/en
Priority to TW103132424A priority patent/TWI605745B/zh
Publication of IN2013CH04361A publication Critical patent/IN2013CH04361A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IN4361CH2013 2013-09-26 2014-08-22 IN2013CH04361A (enrdf_load_stackoverflow)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/US2014/052370 WO2015047615A1 (en) 2013-09-26 2014-08-22 Partitioned cooling for electronic devices and systems
IN4361CH2013 IN2013CH04361A (enrdf_load_stackoverflow) 2013-09-26 2014-08-22
US14/905,275 US10165705B2 (en) 2013-09-26 2014-08-22 Partitioned cooling for electronic devices and systems
TW103132424A TWI605745B (zh) 2013-09-26 2014-09-19 用於電子裝置及系統之分區冷卻技術

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IN4361CH2013 IN2013CH04361A (enrdf_load_stackoverflow) 2013-09-26 2014-08-22

Publications (1)

Publication Number Publication Date
IN2013CH04361A true IN2013CH04361A (enrdf_load_stackoverflow) 2015-04-03

Family

ID=52744328

Family Applications (1)

Application Number Title Priority Date Filing Date
IN4361CH2013 IN2013CH04361A (enrdf_load_stackoverflow) 2013-09-26 2014-08-22

Country Status (4)

Country Link
US (1) US10165705B2 (enrdf_load_stackoverflow)
IN (1) IN2013CH04361A (enrdf_load_stackoverflow)
TW (1) TWI605745B (enrdf_load_stackoverflow)
WO (1) WO2015047615A1 (enrdf_load_stackoverflow)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015149212A1 (en) * 2014-03-31 2015-10-08 Intel Corporation Sonic dust remediation
US10886875B2 (en) * 2017-03-06 2021-01-05 Tapicu, Inc. Solar powered cooler for smart device
US10037062B1 (en) 2017-03-17 2018-07-31 Microsoft Technology Licensing, Llc Thermal venting device with pressurized plenum
US11847002B2 (en) 2019-05-21 2023-12-19 Hewlett-Packard Development Company, L.P. Expelling air from a computer enclosure
TWI763256B (zh) * 2021-01-15 2022-05-01 宏碁股份有限公司 可攜式電子裝置的散熱系統
US11429164B1 (en) * 2021-02-10 2022-08-30 Dell Products L.P. Cooling system for an information handling system
US11503740B2 (en) * 2021-02-10 2022-11-15 Dell Products L.P. Cooling system for an information handling system
TWI872752B (zh) * 2022-10-24 2025-02-11 仁寶電腦工業股份有限公司 電子裝置及其風扇的控制方法
US12147598B1 (en) 2023-05-15 2024-11-19 Apple Inc. Head mountable display
US12196974B2 (en) 2023-05-15 2025-01-14 Apple Inc. Head mountable display
US12169283B2 (en) 2023-05-15 2024-12-17 Apple Inc. Head mountable display
US12347051B2 (en) 2023-05-15 2025-07-01 Apple Inc. Head mountable display
US12289874B2 (en) 2023-05-15 2025-04-29 Apple Inc. Head mountable display
US12379595B2 (en) 2023-05-15 2025-08-05 Apple Inc. Head mountable display
US12210169B2 (en) 2023-05-15 2025-01-28 Apple Inc. Head mountable display
US12238909B2 (en) * 2023-05-15 2025-02-25 Apple Inc. Head mountable display
US12093077B1 (en) 2023-05-15 2024-09-17 Apple Inc. Head mountable display
US12148332B1 (en) 2023-05-15 2024-11-19 Apple Inc. Head mountable display
CN120165566B (zh) * 2025-05-19 2025-08-15 深圳爱科思达科技有限公司 一种氮化镓适配器的多模式功率管理方法及装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002169626A (ja) * 2000-12-05 2002-06-14 Nec Gumma Ltd 中央処理装置内蔵型電子機器
JP2003108269A (ja) 2001-09-28 2003-04-11 Nec Gumma Ltd 電子部品の冷却構造及び冷却方法
JP2004246403A (ja) * 2003-02-10 2004-09-02 Toshiba Corp 情報処理装置、電子機器及び電子機器の冷却方法
JP4675666B2 (ja) * 2005-04-15 2011-04-27 株式会社東芝 電子機器
US8085535B2 (en) * 2009-12-18 2011-12-27 Intel Corporation Fan casing integrated heat spreader for active cooling of computing system skins
CN102566719A (zh) * 2010-12-30 2012-07-11 鸿富锦精密工业（深圳）有限公司 电子装置
JP5991125B2 (ja) * 2012-09-28 2016-09-14 富士通株式会社 電子機器
CN104936411A (zh) * 2014-03-17 2015-09-23 名硕电脑(苏州)有限公司 风扇散热系统
US9788460B2 (en) * 2015-12-02 2017-10-10 International Business Machines Corporation Heatsink providing equivalent cooling for multiple in-line modules

Also Published As

Publication number Publication date
TW201528928A (zh) 2015-07-16
WO2015047615A1 (en) 2015-04-02
TWI605745B (zh) 2017-11-11
US10165705B2 (en) 2018-12-25
US20160165751A1 (en) 2016-06-09

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