IN2012DN03288A - - Google Patents

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Publication number
IN2012DN03288A
IN2012DN03288A IN3288DEN2012A IN2012DN03288A IN 2012DN03288 A IN2012DN03288 A IN 2012DN03288A IN 3288DEN2012 A IN3288DEN2012 A IN 3288DEN2012A IN 2012DN03288 A IN2012DN03288 A IN 2012DN03288A
Authority
IN
India
Prior art keywords
solder ribbon
bus bar
flux
solar cell
providing
Prior art date
Application number
Other languages
English (en)
Inventor
Wolfgang Risch
Jörg ZÖNNCHEN
Karol Kamasinski
Original Assignee
3S Ind Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3S Ind Ag filed Critical 3S Ind Ag
Publication of IN2012DN03288A publication Critical patent/IN2012DN03288A/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/137Batch treatment of the devices
    • H10F71/1375Apparatus for automatic interconnection of photovoltaic cells in a module
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
IN3288DEN2012 2009-09-16 2010-09-14 IN2012DN03288A (th)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09011796A EP2299501A1 (en) 2009-09-16 2009-09-16 Method and apparatus for providing a solar cell with a solder ribbon
PCT/IB2010/054146 WO2011033451A2 (en) 2009-09-16 2010-09-14 Method and apparatus for providing a solar cell with a solder ribbon

Publications (1)

Publication Number Publication Date
IN2012DN03288A true IN2012DN03288A (th) 2015-10-23

Family

ID=41667448

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3288DEN2012 IN2012DN03288A (th) 2009-09-16 2010-09-14

Country Status (5)

Country Link
US (1) US20120228363A1 (th)
EP (1) EP2299501A1 (th)
CN (1) CN102656709A (th)
IN (1) IN2012DN03288A (th)
WO (1) WO2011033451A2 (th)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140076956A1 (en) * 2012-09-20 2014-03-20 Tyco Electronics Corporation Soldering machine and method of soldering
EP2837459A1 (en) 2013-08-17 2015-02-18 Somont GmbH Systems and methods for applying particles in a gas flow to a workpiece
CN106328746A (zh) * 2015-06-30 2017-01-11 上海比亚迪有限公司 一种光伏焊带及其制备方法
CN106571412B (zh) * 2015-10-12 2018-05-01 Lg电子株式会社 用于附接太阳能电池板的互连器的设备和方法
KR102487772B1 (ko) * 2015-12-23 2023-01-12 상라오 징코 솔라 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 태양 전지 패널의 배선재 부착 장치
CN107192467B (zh) * 2016-03-15 2023-09-05 苏州沃特维自动化系统有限公司 一种电池片焊接的温度监测装置
EP3276655A1 (en) * 2016-07-26 2018-01-31 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method and system for bonding a chip to a substrate
CN107464856B (zh) * 2017-08-16 2019-08-02 君泰创新(北京)科技有限公司 异质结晶硅太阳能电池片低温串焊方法及系统
US10780515B2 (en) 2018-04-26 2020-09-22 Raytheon Technologies Corporation Auto-adaptive braze dispensing systems and methods
CN112246909A (zh) * 2020-08-18 2021-01-22 宁波林源光电科技有限公司 焊带制造设备
CN113399858A (zh) * 2021-04-25 2021-09-17 郑州机械研究所有限公司 一种钎焊用复合钎料及其制备方法和硬质合金刀具
TWI854363B (zh) * 2021-12-16 2024-09-01 美商阿爾發金屬化工公司 製造太陽能模組之方法
WO2023151705A1 (zh) * 2022-09-15 2023-08-17 苏州小牛自动化设备有限公司 一种电池串生产设备及生产方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2228218B1 (de) * 1972-06-09 1973-05-10 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum tauchloeten von traegerplaettchen
US4446358A (en) * 1981-12-15 1984-05-01 Cooper Industries, Inc. Preheater for use in mass soldering apparatus
US5065692A (en) * 1990-04-30 1991-11-19 At&T Bell Laboratories Solder flux applicator
US5328085A (en) * 1992-08-18 1994-07-12 Precision Dispensing Equipment, Inc. Apparatus for applying flux
US5368219A (en) * 1993-11-04 1994-11-29 Nordson Corporation Method and apparatus for applying solder flux to a printed circuit
US5560537A (en) * 1995-04-11 1996-10-01 Vlt Corporation Automatic soldering
US5747102A (en) * 1995-11-16 1998-05-05 Nordson Corporation Method and apparatus for dispensing small amounts of liquid material
EP1405687B1 (en) * 2000-09-26 2009-12-09 Panasonic Corporation Method and device for flow soldering
NL1022515C2 (nl) * 2003-01-29 2004-08-03 Vitronics Soltec B V Inrichting en werkwijze voor correctief solderen.
JP2006339342A (ja) * 2005-06-01 2006-12-14 Shin Etsu Handotai Co Ltd 太陽電池および太陽電池の製造方法
EP1884305A1 (en) * 2006-08-04 2008-02-06 Harman Becker Automotive Systems GmbH Soldering flux application apparatus with an airbrush device ; Method of applying soldering flux to a surface of an object using an airbrush device
US8308047B2 (en) * 2006-12-19 2012-11-13 Intel Corporation Compliant spray flux masks, systems, and methods
JP4030068B2 (ja) * 2007-01-25 2008-01-09 千住金属工業株式会社 プリント基板の部分はんだ付け方法

Also Published As

Publication number Publication date
CN102656709A (zh) 2012-09-05
US20120228363A1 (en) 2012-09-13
WO2011033451A3 (en) 2011-07-14
WO2011033451A2 (en) 2011-03-24
EP2299501A1 (en) 2011-03-23

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