IN2012DN03288A - - Google Patents
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- Publication number
- IN2012DN03288A IN2012DN03288A IN3288DEN2012A IN2012DN03288A IN 2012DN03288 A IN2012DN03288 A IN 2012DN03288A IN 3288DEN2012 A IN3288DEN2012 A IN 3288DEN2012A IN 2012DN03288 A IN2012DN03288 A IN 2012DN03288A
- Authority
- IN
- India
- Prior art keywords
- solder ribbon
- bus bar
- flux
- solar cell
- providing
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 abstract 5
- 230000004907 flux Effects 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 1
- 239000007921 spray Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/137—Batch treatment of the devices
- H10F71/1375—Apparatus for automatic interconnection of photovoltaic cells in a module
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09011796A EP2299501A1 (en) | 2009-09-16 | 2009-09-16 | Method and apparatus for providing a solar cell with a solder ribbon |
| PCT/IB2010/054146 WO2011033451A2 (en) | 2009-09-16 | 2010-09-14 | Method and apparatus for providing a solar cell with a solder ribbon |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2012DN03288A true IN2012DN03288A (th) | 2015-10-23 |
Family
ID=41667448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN3288DEN2012 IN2012DN03288A (th) | 2009-09-16 | 2010-09-14 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20120228363A1 (th) |
| EP (1) | EP2299501A1 (th) |
| CN (1) | CN102656709A (th) |
| IN (1) | IN2012DN03288A (th) |
| WO (1) | WO2011033451A2 (th) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140076956A1 (en) * | 2012-09-20 | 2014-03-20 | Tyco Electronics Corporation | Soldering machine and method of soldering |
| EP2837459A1 (en) | 2013-08-17 | 2015-02-18 | Somont GmbH | Systems and methods for applying particles in a gas flow to a workpiece |
| CN106328746A (zh) * | 2015-06-30 | 2017-01-11 | 上海比亚迪有限公司 | 一种光伏焊带及其制备方法 |
| CN106571412B (zh) * | 2015-10-12 | 2018-05-01 | Lg电子株式会社 | 用于附接太阳能电池板的互连器的设备和方法 |
| KR102487772B1 (ko) * | 2015-12-23 | 2023-01-12 | 상라오 징코 솔라 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 | 태양 전지 패널의 배선재 부착 장치 |
| CN107192467B (zh) * | 2016-03-15 | 2023-09-05 | 苏州沃特维自动化系统有限公司 | 一种电池片焊接的温度监测装置 |
| EP3276655A1 (en) * | 2016-07-26 | 2018-01-31 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Method and system for bonding a chip to a substrate |
| CN107464856B (zh) * | 2017-08-16 | 2019-08-02 | 君泰创新(北京)科技有限公司 | 异质结晶硅太阳能电池片低温串焊方法及系统 |
| US10780515B2 (en) | 2018-04-26 | 2020-09-22 | Raytheon Technologies Corporation | Auto-adaptive braze dispensing systems and methods |
| CN112246909A (zh) * | 2020-08-18 | 2021-01-22 | 宁波林源光电科技有限公司 | 焊带制造设备 |
| CN113399858A (zh) * | 2021-04-25 | 2021-09-17 | 郑州机械研究所有限公司 | 一种钎焊用复合钎料及其制备方法和硬质合金刀具 |
| TWI854363B (zh) * | 2021-12-16 | 2024-09-01 | 美商阿爾發金屬化工公司 | 製造太陽能模組之方法 |
| WO2023151705A1 (zh) * | 2022-09-15 | 2023-08-17 | 苏州小牛自动化设备有限公司 | 一种电池串生产设备及生产方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2228218B1 (de) * | 1972-06-09 | 1973-05-10 | Siemens AG, 1000 Berlin u. 8000 München | Verfahren zum tauchloeten von traegerplaettchen |
| US4446358A (en) * | 1981-12-15 | 1984-05-01 | Cooper Industries, Inc. | Preheater for use in mass soldering apparatus |
| US5065692A (en) * | 1990-04-30 | 1991-11-19 | At&T Bell Laboratories | Solder flux applicator |
| US5328085A (en) * | 1992-08-18 | 1994-07-12 | Precision Dispensing Equipment, Inc. | Apparatus for applying flux |
| US5368219A (en) * | 1993-11-04 | 1994-11-29 | Nordson Corporation | Method and apparatus for applying solder flux to a printed circuit |
| US5560537A (en) * | 1995-04-11 | 1996-10-01 | Vlt Corporation | Automatic soldering |
| US5747102A (en) * | 1995-11-16 | 1998-05-05 | Nordson Corporation | Method and apparatus for dispensing small amounts of liquid material |
| EP1405687B1 (en) * | 2000-09-26 | 2009-12-09 | Panasonic Corporation | Method and device for flow soldering |
| NL1022515C2 (nl) * | 2003-01-29 | 2004-08-03 | Vitronics Soltec B V | Inrichting en werkwijze voor correctief solderen. |
| JP2006339342A (ja) * | 2005-06-01 | 2006-12-14 | Shin Etsu Handotai Co Ltd | 太陽電池および太陽電池の製造方法 |
| EP1884305A1 (en) * | 2006-08-04 | 2008-02-06 | Harman Becker Automotive Systems GmbH | Soldering flux application apparatus with an airbrush device ; Method of applying soldering flux to a surface of an object using an airbrush device |
| US8308047B2 (en) * | 2006-12-19 | 2012-11-13 | Intel Corporation | Compliant spray flux masks, systems, and methods |
| JP4030068B2 (ja) * | 2007-01-25 | 2008-01-09 | 千住金属工業株式会社 | プリント基板の部分はんだ付け方法 |
-
2009
- 2009-09-16 EP EP09011796A patent/EP2299501A1/en not_active Ceased
-
2010
- 2010-09-14 IN IN3288DEN2012 patent/IN2012DN03288A/en unknown
- 2010-09-14 WO PCT/IB2010/054146 patent/WO2011033451A2/en not_active Ceased
- 2010-09-14 CN CN2010800418629A patent/CN102656709A/zh active Pending
-
2012
- 2012-03-15 US US13/421,800 patent/US20120228363A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN102656709A (zh) | 2012-09-05 |
| US20120228363A1 (en) | 2012-09-13 |
| WO2011033451A3 (en) | 2011-07-14 |
| WO2011033451A2 (en) | 2011-03-24 |
| EP2299501A1 (en) | 2011-03-23 |
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