IN2012DN03288A - - Google Patents

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Publication number
IN2012DN03288A
IN2012DN03288A IN3288DEN2012A IN2012DN03288A IN 2012DN03288 A IN2012DN03288 A IN 2012DN03288A IN 3288DEN2012 A IN3288DEN2012 A IN 3288DEN2012A IN 2012DN03288 A IN2012DN03288 A IN 2012DN03288A
Authority
IN
India
Prior art keywords
solder ribbon
bus bar
flux
solar cell
providing
Prior art date
Application number
Inventor
Wolfgang Risch
Jörg ZÖNNCHEN
Karol Kamasinski
Original Assignee
3S Ind Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3S Ind Ag filed Critical 3S Ind Ag
Publication of IN2012DN03288A publication Critical patent/IN2012DN03288A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)

Abstract

The invention relates to a method for providing a solar cell with a solder ribbon. The solar cell having at least one bus bar   wherein flux is applied by means of at least one automatically controlled spray head and the solder ribbon is connected to a bus bar by means of at least one automatically controlled soldering unit  and wherein the flux is only applied to those locations of the solder ribbon that are to be connected to the bus bar and/or that the flux is only applied to those locations of the bus bars that is to be connected to the solder ribbon. The invention further relates to an apparatus for providing a solar cell that has at least one bus bar  with a solder ribbon according to such a method.
IN3288DEN2012 2009-09-16 2010-09-14 IN2012DN03288A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09011796A EP2299501A1 (en) 2009-09-16 2009-09-16 Method and apparatus for providing a solar cell with a solder ribbon
PCT/IB2010/054146 WO2011033451A2 (en) 2009-09-16 2010-09-14 Method and apparatus for providing a solar cell with a solder ribbon

Publications (1)

Publication Number Publication Date
IN2012DN03288A true IN2012DN03288A (en) 2015-10-23

Family

ID=41667448

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3288DEN2012 IN2012DN03288A (en) 2009-09-16 2010-09-14

Country Status (5)

Country Link
US (1) US20120228363A1 (en)
EP (1) EP2299501A1 (en)
CN (1) CN102656709A (en)
IN (1) IN2012DN03288A (en)
WO (1) WO2011033451A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140076956A1 (en) * 2012-09-20 2014-03-20 Tyco Electronics Corporation Soldering machine and method of soldering
EP2837459A1 (en) 2013-08-17 2015-02-18 Somont GmbH Systems and methods for applying particles in a gas flow to a workpiece
CN106328746A (en) * 2015-06-30 2017-01-11 上海比亚迪有限公司 Photovoltaic welding tape and preparation method
EP3157065B1 (en) * 2015-10-12 2020-12-09 LG Electronics Inc. Apparatus and method for attaching interconnector of solar cell panel
KR102487772B1 (en) * 2015-12-23 2023-01-12 상라오 징코 솔라 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 Apparatus for attaching interconnector of solar cell panel
CN107192467B (en) * 2016-03-15 2023-09-05 苏州沃特维自动化系统有限公司 Temperature monitoring device for welding battery piece
EP3276655A1 (en) * 2016-07-26 2018-01-31 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method and system for bonding a chip to a substrate
CN107464856B (en) * 2017-08-16 2019-08-02 君泰创新（北京）科技有限公司 Heterogeneous solar cells made of crystalline silicon piece low temperature series welding method and system
US10780515B2 (en) * 2018-04-26 2020-09-22 Raytheon Technologies Corporation Auto-adaptive braze dispensing systems and methods
CN112246909A (en) * 2020-08-18 2021-01-22 宁波林源光电科技有限公司 Solder strip manufacturing equipment
CN113399858A (en) * 2021-04-25 2021-09-17 郑州机械研究所有限公司 Composite brazing filler metal for brazing, preparation method thereof and hard alloy cutter
WO2023151705A1 (en) * 2022-09-15 2023-08-17 苏州小牛自动化设备有限公司 Battery string production apparatus and production method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2228218B1 (en) * 1972-06-09 1973-05-10 Siemens AG, 1000 Berlin u. 8000 München PROCESS FOR DIP SOLDERING CARRIER PLATES
US4446358A (en) * 1981-12-15 1984-05-01 Cooper Industries, Inc. Preheater for use in mass soldering apparatus
US5065692A (en) * 1990-04-30 1991-11-19 At&T Bell Laboratories Solder flux applicator
US5328085A (en) * 1992-08-18 1994-07-12 Precision Dispensing Equipment, Inc. Apparatus for applying flux
US5368219A (en) * 1993-11-04 1994-11-29 Nordson Corporation Method and apparatus for applying solder flux to a printed circuit
US5560537A (en) * 1995-04-11 1996-10-01 Vlt Corporation Automatic soldering
US5747102A (en) * 1995-11-16 1998-05-05 Nordson Corporation Method and apparatus for dispensing small amounts of liquid material
WO2002028156A1 (en) * 2000-09-26 2002-04-04 Matsushita Electric Industrial Co., Ltd. Method and device for flow soldering
NL1022515C2 (en) * 2003-01-29 2004-08-03 Vitronics Soltec B V Device and method for corrective soldering.
JP2006339342A (en) * 2005-06-01 2006-12-14 Shin Etsu Handotai Co Ltd Solar cell and method of manufacturing same
EP1884305A1 (en) * 2006-08-04 2008-02-06 Harman Becker Automotive Systems GmbH Soldering flux application apparatus with an airbrush device ; Method of applying soldering flux to a surface of an object using an airbrush device
US8308047B2 (en) * 2006-12-19 2012-11-13 Intel Corporation Compliant spray flux masks, systems, and methods
JP4030068B2 (en) * 2007-01-25 2008-01-09 千住金属工業株式会社 Partial soldering method for printed circuit boards

Also Published As

Publication number Publication date
WO2011033451A2 (en) 2011-03-24
EP2299501A1 (en) 2011-03-23
US20120228363A1 (en) 2012-09-13
CN102656709A (en) 2012-09-05
WO2011033451A3 (en) 2011-07-14

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