IN2012DN02240A - - Google Patents

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Publication number
IN2012DN02240A
IN2012DN02240A IN2240DEN2012A IN2012DN02240A IN 2012DN02240 A IN2012DN02240 A IN 2012DN02240A IN 2240DEN2012 A IN2240DEN2012 A IN 2240DEN2012A IN 2012DN02240 A IN2012DN02240 A IN 2012DN02240A
Authority
IN
India
Prior art keywords
micro
template
column
columns
region
Prior art date
Application number
Inventor
Harry Hedler
Jorg Zapf
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of IN2012DN02240A publication Critical patent/IN2012DN02240A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0361—Tips, pillars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/05—Arrays
    • B81B2207/056—Arrays of static structures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The invention relates to a three-dimensional micro-structure comprising a plurality of adjacent micro-columns which are arranged at a distance from each other and essentially parallel in relation to the respective longitudinal extension, said micro¬columns being made of at least one micro-column material having respectively an aspect ratio in the region of 20 -1000 and respectively a micro-column diameter in the region of 0,1 µm - 200 µm, and a micro-column intermediate chamber arranged between adjacent micro-columns having a micro-column distance selected from between the adjacent micro-columns in the region of 1 µm -100 µm. The invention also relates to a method for producing the three-dimensional micro-structures according to the following steps: a) a template is provided with template material, said template having a three-dimensional structure with column-like template cavities essentially inverse for the micro-structure, b) the micro-column material is arranged in the column-like cavities such that the micro-columns are formed, and c) the template material is at least partially removed. A silicon wafer is preferably used as the template. In order to provide the template, the PAECE (Photo Assisted Electro-Chemical Etching) method is used. Said invention enables micro-structures with extremely large surfaces to be produced.
IN2240DEN2012 2009-09-29 2010-09-20 IN2012DN02240A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009043414.3A DE102009043414B4 (en) 2009-09-29 2009-09-29 Three-dimensional microstructure, arrangement with at least two three-dimensional micro-structures, method for producing the micro-structure and use of the micro-structure
PCT/EP2010/063811 WO2011039070A2 (en) 2009-09-29 2010-09-20 Three-dimensional micro-structure, arrangement with at least two three-dimensional micro-structures, method for producing the micro-structure and use of the micro-structure

Publications (1)

Publication Number Publication Date
IN2012DN02240A true IN2012DN02240A (en) 2015-08-21

Family

ID=43709055

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2240DEN2012 IN2012DN02240A (en) 2009-09-29 2010-09-20

Country Status (7)

Country Link
US (1) US9884759B2 (en)
EP (1) EP2483198B1 (en)
JP (1) JP5631404B2 (en)
CN (1) CN102510834B (en)
DE (1) DE102009043414B4 (en)
IN (1) IN2012DN02240A (en)
WO (1) WO2011039070A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009043414B4 (en) 2009-09-29 2016-09-22 Siemens Aktiengesellschaft Three-dimensional microstructure, arrangement with at least two three-dimensional micro-structures, method for producing the micro-structure and use of the micro-structure
DE102013204337A1 (en) 2013-03-13 2014-09-18 Siemens Aktiengesellschaft Carrier component with a semiconductor substrate for electronic components and method for its production
EP3108523B1 (en) 2014-02-21 2018-08-29 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A device and method of manufacturing high-aspect ratio structures
EP3023385A1 (en) 2014-11-19 2016-05-25 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO System and method for manufacturing a micropillar array
CN110668398B (en) * 2019-10-16 2023-05-12 武汉大学 Preparation method and application of bionic gecko extreme progressive rigid-flexible gradient microcolumn structure
CN113739945B (en) * 2021-07-22 2022-08-16 西安交通大学 Gas film composite tungsten-rhenium alloy film thermocouple based on surface micro-column array

Family Cites Families (24)

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JP3186415B2 (en) * 1994-04-06 2001-07-11 日産自動車株式会社 Manufacturing method of infrared detecting element
US5808233A (en) * 1996-03-11 1998-09-15 Temple University-Of The Commonwealth System Of Higher Education Amorphous-crystalline thermocouple and methods of its manufacture
JP3617200B2 (en) 1996-07-31 2005-02-02 住友電気工業株式会社 Manufacturing method of mold for manufacturing microstructure and manufacturing method of microstructure
JP4065049B2 (en) * 1998-03-19 2008-03-19 オリンパス株式会社 Method for manufacturing piezoelectric ceramic structure and method for manufacturing composite piezoelectric vibrator
US6551849B1 (en) * 1999-11-02 2003-04-22 Christopher J. Kenney Method for fabricating arrays of micro-needles
US6597051B2 (en) * 2001-05-22 2003-07-22 Yeda Research And Development Co. Ltd. Thermoelectric infrared detector
JP2004182537A (en) 2002-12-04 2004-07-02 Mie Tlo Co Ltd Method of forming arranged structure of nanocarbon material
US7572405B2 (en) * 2003-06-02 2009-08-11 Corium International Inc. Method for manufacturing microstructures having hollow microelements using fluidic jets during a molding operation
US7273474B2 (en) * 2003-06-17 2007-09-25 Industrial Technology Research Institute Flexible substrate structure for microneedle arrays and its manufacturing method
JP4466074B2 (en) 2003-12-26 2010-05-26 株式会社日立製作所 Fine metal structure and manufacturing method thereof, and fine mold and device
JP4356109B2 (en) 2004-01-23 2009-11-04 学校法人早稲田大学 Manufacturing method of microreactor
US20060040390A1 (en) * 2004-08-19 2006-02-23 Minor John S Jr Device, method, system, and program for intelligent in vivo cell-level chemical or genetic material delivery
JP4490774B2 (en) * 2004-09-24 2010-06-30 シチズンホールディングス株式会社 Differential thermoelectric element
JP5181413B2 (en) * 2005-09-13 2013-04-10 日立電線株式会社 Electrode for electrochemical device, solid electrolyte / electrode assembly and method for producing the same
US8084116B2 (en) * 2005-09-30 2011-12-27 Alcatel Lucent Surfaces physically transformable by environmental changes
DE102005061411A1 (en) * 2005-12-22 2007-06-28 Robert Bosch Gmbh Micromechanical thermopile sensor and method for its production
JP4872373B2 (en) * 2006-02-15 2012-02-08 株式会社日立製作所 Site-selectively modified microstructure and manufacturing method thereof
FR2902237B1 (en) 2006-06-09 2008-10-10 Commissariat Energie Atomique METHOD FOR PRODUCING A MICROELECTRONIC SEMICONDUCTOR NANOWAR LIGHT EMITTING DEVICE FORMED ON A METALLIC SUBSTRATE
US7829380B2 (en) * 2006-10-31 2010-11-09 Qimonda Ag Solder pillar bumping and a method of making the same
DE102006055263A1 (en) * 2006-11-23 2008-05-29 Robert Bosch Gmbh Micromechanical thermopile sensor for use as membrane sensor for detecting infrared radiation, has conductive areas laterally distanced from each other and electrically contacted at their upper and/or lower end areas as thermopile structure
EP1967581B1 (en) * 2007-03-08 2016-08-17 Imec CMOS compatible method for manufacturing microneedle structures
JP2008264959A (en) 2007-04-23 2008-11-06 Kyoto Univ Deformable micro nano structure
EP2100850A1 (en) 2008-03-11 2009-09-16 Stichting Voor De Technische Wetenschappen Microneedle array and a method for manufacturing microneedles
DE102009043414B4 (en) 2009-09-29 2016-09-22 Siemens Aktiengesellschaft Three-dimensional microstructure, arrangement with at least two three-dimensional micro-structures, method for producing the micro-structure and use of the micro-structure

Also Published As

Publication number Publication date
WO2011039070A2 (en) 2011-04-07
EP2483198B1 (en) 2016-11-02
JP5631404B2 (en) 2014-11-26
DE102009043414A1 (en) 2011-06-09
EP2483198A2 (en) 2012-08-08
DE102009043414B4 (en) 2016-09-22
JP2013505848A (en) 2013-02-21
US9884759B2 (en) 2018-02-06
WO2011039070A3 (en) 2011-05-26
CN102510834A (en) 2012-06-20
US20120183732A1 (en) 2012-07-19
CN102510834B (en) 2016-10-12

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