IN175302B - - Google Patents
Info
- Publication number
- IN175302B IN175302B IN1085DE1988A IN175302B IN 175302 B IN175302 B IN 175302B IN 1085DE1988 A IN1085DE1988 A IN 1085DE1988A IN 175302 B IN175302 B IN 175302B
- Authority
- IN
- India
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
- G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
-
- H10P52/00—
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB878728879A GB8728879D0 (en) | 1987-12-10 | 1987-12-10 | Shaping silicon semiconductor wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN175302B true IN175302B (enExample) | 1995-06-10 |
Family
ID=10628300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN1085DE1988 IN175302B (enExample) | 1987-12-10 | 1988-12-12 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0320090A3 (enExample) |
| JP (1) | JPH01173620A (enExample) |
| GB (2) | GB8728879D0 (enExample) |
| IN (1) | IN175302B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7674689B2 (en) * | 2007-09-20 | 2010-03-09 | Infineon Technologies Ag | Method of making an integrated circuit including singulating a semiconductor wafer |
| JP6696263B2 (ja) * | 2015-09-29 | 2020-05-20 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のスクライブ方法及びスクライブヘッドユニット |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4517769A (en) * | 1981-05-20 | 1985-05-21 | Tokyo Shibaura Denki Kabushiki Kaisha | Method and apparatus for forming oblique groove in semiconductor device |
-
1987
- 1987-12-10 GB GB878728879A patent/GB8728879D0/en active Pending
-
1988
- 1988-09-09 EP EP88308371A patent/EP0320090A3/en not_active Withdrawn
- 1988-09-09 GB GB8821124A patent/GB2213637B/en not_active Expired - Lifetime
- 1988-11-10 JP JP63284815A patent/JPH01173620A/ja active Pending
- 1988-12-12 IN IN1085DE1988 patent/IN175302B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB2213637A (en) | 1989-08-16 |
| JPH01173620A (ja) | 1989-07-10 |
| GB8821124D0 (en) | 1988-10-12 |
| GB2213637B (en) | 1990-12-19 |
| EP0320090A3 (en) | 1990-01-31 |
| GB8728879D0 (en) | 1988-01-27 |
| EP0320090A2 (en) | 1989-06-14 |