IN150641B - - Google Patents
Info
- Publication number
- IN150641B IN150641B IN890/CAL/78A IN890CA1978A IN150641B IN 150641 B IN150641 B IN 150641B IN 890CA1978 A IN890CA1978 A IN 890CA1978A IN 150641 B IN150641 B IN 150641B
- Authority
- IN
- India
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Rectifiers (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2739242A DE2739242C2 (de) | 1977-08-31 | 1977-08-31 | Hochleistungsstromrichter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN150641B true IN150641B (no) | 1982-11-20 |
Family
ID=6017772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN890/CAL/78A IN150641B (no) | 1977-08-31 | 1978-08-14 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4184199A (no) |
| EP (1) | EP0001548B1 (no) |
| JP (1) | JPS5447487A (no) |
| BR (1) | BR7805617A (no) |
| DE (2) | DE2739242C2 (no) |
| HU (1) | HU180293B (no) |
| IN (1) | IN150641B (no) |
| NO (1) | NO145146C (no) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4613892A (en) * | 1985-02-19 | 1986-09-23 | Sundstrand Corporation | Laminated semiconductor assembly |
| DE3615782A1 (de) * | 1986-05-10 | 1987-11-12 | Bbc Brown Boveri & Cie | Anordnung zur ansteuerung einer vielzahl parallelgeschalteter leistungs-feldeffekttransistoren |
| AT413913B (de) * | 2003-08-07 | 2006-07-15 | Siemens Ag Oesterreich | Stromrichtertechnische anordnung |
| DE102012008550B4 (de) | 2011-05-27 | 2020-03-26 | Sew-Eurodrive Gmbh & Co Kg | Stromschienenteil |
| US11660697B2 (en) | 2018-12-11 | 2023-05-30 | Illinois Tool Works Inc. | Balanced plate rectifiers and welding-type power supplies including balanced plate rectifiers |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3289068A (en) * | 1963-05-02 | 1966-11-29 | Ite Circuit Breaker Ltd | Bus arrangement for semiconductor rectifiers |
| US3275856A (en) * | 1963-07-31 | 1966-09-27 | Ite Circuit Breaker Ltd | Semiconductor bank assembly |
| DE1483298B1 (de) * | 1965-06-11 | 1971-01-28 | Siemens Ag | Elektrische Kontaktanordnung zwischen einem Germanium-Silizium-Halbleiterkoerper und einem Kontaktstueck und Verfahren zur Herstellung derselben |
| US3435891A (en) * | 1967-03-23 | 1969-04-01 | Int Rectifier Corp | Air flow baffle for rectifier heat exchanger |
| US3416597A (en) * | 1967-06-15 | 1968-12-17 | Forbro Design Corp | Heat sink for forced air or convection cooling of semiconductors |
| US3476175A (en) * | 1967-11-02 | 1969-11-04 | Bell Telephone Labor Inc | Vapor-phase cooling of electronic components |
| DE2317117A1 (de) * | 1973-04-05 | 1974-10-17 | Siemens Ag | Hochleistungsstromrichter |
| US3842336A (en) * | 1973-10-05 | 1974-10-15 | Oxy Metal Finishing Corp | Balancing assembly for parallelled rectifiers |
| US3909678A (en) * | 1974-04-19 | 1975-09-30 | Ibm | Packaging structure for a plurality of wafer type integrated circuit elements |
| DE2435459C3 (de) * | 1974-07-23 | 1977-03-17 | Siemens AG, 1000 Berlin und 8000 München | Anordnung der stromschienen in einer hochstromgleichrichteranlage |
| DE2515391C3 (de) * | 1975-04-09 | 1980-08-07 | Oxy Metal Industries Corp., Warren, Mich. (V.St.A.) | Anordnung von auf gegenseitigem Abstand Hegenden Halbleiter-Gleichrichtern |
-
1977
- 1977-08-31 DE DE2739242A patent/DE2739242C2/de not_active Expired
-
1978
- 1978-08-09 NO NO782718A patent/NO145146C/no unknown
- 1978-08-14 IN IN890/CAL/78A patent/IN150641B/en unknown
- 1978-08-14 US US05/933,531 patent/US4184199A/en not_active Expired - Lifetime
- 1978-08-16 DE DE7878100679T patent/DE2860219D1/de not_active Expired
- 1978-08-16 EP EP78100679A patent/EP0001548B1/de not_active Expired
- 1978-08-28 JP JP10478278A patent/JPS5447487A/ja active Pending
- 1978-08-30 HU HU78SI1645A patent/HU180293B/hu unknown
- 1978-08-30 BR BR7805617A patent/BR7805617A/pt unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NO145146C (no) | 1982-01-20 |
| DE2860219D1 (en) | 1981-01-22 |
| DE2739242C2 (de) | 1979-10-04 |
| NO782718L (no) | 1979-03-01 |
| EP0001548B1 (de) | 1980-10-15 |
| NO145146B (no) | 1981-10-12 |
| HU180293B (en) | 1983-02-28 |
| DE2739242B1 (de) | 1979-02-15 |
| BR7805617A (pt) | 1979-05-15 |
| EP0001548A1 (de) | 1979-05-02 |
| JPS5447487A (en) | 1979-04-14 |
| US4184199A (en) | 1980-01-15 |