IL91904A0 - Heat exchanger - Google Patents
Heat exchangerInfo
- Publication number
- IL91904A0 IL91904A0 IL91904A IL9190489A IL91904A0 IL 91904 A0 IL91904 A0 IL 91904A0 IL 91904 A IL91904 A IL 91904A IL 9190489 A IL9190489 A IL 9190489A IL 91904 A0 IL91904 A0 IL 91904A0
- Authority
- IL
- Israel
- Prior art keywords
- heat exchanger
- exchanger
- heat
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/261,992 US4901201A (en) | 1988-10-25 | 1988-10-25 | Plate fin/chic heat exchanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL91904A0 true IL91904A0 (en) | 1990-06-10 |
Family
ID=22995729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL91904A IL91904A0 (en) | 1988-10-25 | 1989-10-05 | Heat exchanger |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4901201A (fr) |
| IL (1) | IL91904A0 (fr) |
| WO (1) | WO1990004914A1 (fr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5153449A (en) * | 1990-08-28 | 1992-10-06 | Milwaukee Electric Tool Corporation | Heatsink bus for electronic switch |
| JPH04196395A (ja) * | 1990-11-28 | 1992-07-16 | Hitachi Ltd | 冷却装置を備えた電子計算機 |
| US5749413A (en) * | 1991-09-23 | 1998-05-12 | Sundstrand Corporation | Heat exchanger for high power electrical component and package incorporating same |
| TW265430B (en) * | 1994-06-30 | 1995-12-11 | Intel Corp | Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system |
| US5864466A (en) * | 1994-07-19 | 1999-01-26 | Remsburg; Ralph | Thermosyphon-powered jet-impingement cooling device |
| US6424533B1 (en) | 2000-06-29 | 2002-07-23 | International Business Machines Corporation | Thermoelectric-enhanced heat spreader for heat generating component of an electronic device |
| DE102004026061B4 (de) * | 2004-05-25 | 2009-09-10 | Danfoss Silicon Power Gmbh | Leistungshalbleitermodul und Verfahren zum Kühlen eines Leistungshalbleitermoduls |
| US20130068433A1 (en) * | 2011-03-17 | 2013-03-21 | Shreekanth Murthy Muthigi | Heat exchanger |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4103737A (en) * | 1976-12-16 | 1978-08-01 | Marantz Company, Inc. | Heat exchanger structure for electronic apparatus |
| GB1578208A (en) * | 1977-01-19 | 1980-11-05 | Hisaka Works Ltd | Plate type indirect heat exchanger |
| US4494171A (en) * | 1982-08-24 | 1985-01-15 | Sundstrand Corporation | Impingement cooling apparatus for heat liberating device |
| US4498118A (en) * | 1983-04-05 | 1985-02-05 | Bicc-Vero Electronics Limited | Circuit board installation |
| US4644443A (en) * | 1985-09-27 | 1987-02-17 | Texas Instruments Incorporated | Computer cooling system using recycled coolant |
| US4691274A (en) * | 1986-04-29 | 1987-09-01 | Modular Power Corporation | Modular electronic power supply |
-
1988
- 1988-10-25 US US07/261,992 patent/US4901201A/en not_active Expired - Lifetime
-
1989
- 1989-09-29 WO PCT/US1989/004280 patent/WO1990004914A1/fr unknown
- 1989-10-05 IL IL91904A patent/IL91904A0/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO1990004914A1 (fr) | 1990-05-03 |
| US4901201A (en) | 1990-02-13 |
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