IL74420A - Method and apparatus for laminating flexible printed circuits - Google Patents

Method and apparatus for laminating flexible printed circuits

Info

Publication number
IL74420A
IL74420A IL74420A IL7442085A IL74420A IL 74420 A IL74420 A IL 74420A IL 74420 A IL74420 A IL 74420A IL 7442085 A IL7442085 A IL 7442085A IL 74420 A IL74420 A IL 74420A
Authority
IL
Israel
Prior art keywords
flexible printed
printed circuits
laminating flexible
laminating
circuits
Prior art date
Application number
IL74420A
Other languages
English (en)
Other versions
IL74420A0 (en
Original Assignee
Gila River Prod Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gila River Prod Inc filed Critical Gila River Prod Inc
Publication of IL74420A0 publication Critical patent/IL74420A0/xx
Publication of IL74420A publication Critical patent/IL74420A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/061—Cushion plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/408—Matt, dull surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04—Time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
IL74420A 1984-02-22 1985-02-22 Method and apparatus for laminating flexible printed circuits IL74420A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58230384A 1984-02-22 1984-02-22

Publications (2)

Publication Number Publication Date
IL74420A0 IL74420A0 (en) 1985-05-31
IL74420A true IL74420A (en) 1990-03-19

Family

ID=24328620

Family Applications (1)

Application Number Title Priority Date Filing Date
IL74420A IL74420A (en) 1984-02-22 1985-02-22 Method and apparatus for laminating flexible printed circuits

Country Status (8)

Country Link
EP (1) EP0174949B1 (ko)
JP (1) JPS61501255A (ko)
KR (1) KR910006350B1 (ko)
CA (1) CA1225163A (ko)
DE (1) DE3563325D1 (ko)
IL (1) IL74420A (ko)
IT (1) IT8519631A0 (ko)
WO (1) WO1985003669A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4753847A (en) * 1984-10-01 1988-06-28 Martin J. Wilheim Mold release sheet laminate
EP0235582A3 (en) * 1986-02-27 1989-03-29 Hewlett-Packard Company Bonded press pad
US5157589A (en) * 1990-07-02 1992-10-20 General Electric Company Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing TG 's
AT414335B (de) * 2001-11-14 2008-07-15 C2C Technologie Fuer Leiterpla Trennplatten-verbundkomponente zum herstellen von leiterplatten und verfahren zur herstellung einer solchen verbundkomponente

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS3721579Y1 (ko) * 1960-08-18 1962-08-18
US3649475A (en) * 1969-07-22 1972-03-14 Gen Dynamics Corp Multi-layer printed circuit boards and methods of making same
BE793239A (fr) * 1971-12-24 1973-06-22 Basf Ag Feuille combinee a couches multiples
DE2213768C3 (de) * 1972-03-22 1979-03-08 Dr.-Ing. Rudolf Hell Gmbh, 2300 Kiel Verfahren und Vorrichtung zum ortsgenauen Einsetzen eines Schneidorganes zur Herstellung eines Gravierstichels für elektronische Druckform-Graviermaschinen
US4075386A (en) * 1972-10-10 1978-02-21 Material Distributors Corporation Security film for shatterproofing windows
FR2230497A1 (en) * 1973-05-25 1974-12-20 Ober France Sa Veneered laminate - having resin-impregnated wood top lamina with structured surface characteristics
JPS5222380B2 (ko) * 1973-05-30 1977-06-17
JPS5126480A (en) * 1974-08-30 1976-03-04 Fujitsu Ltd Handotaisochi no seizohoho
US4224378A (en) * 1978-11-01 1980-09-23 General Electric Company Abrasion resistant organopolysiloxane coated polycarbonate article
US4264404A (en) * 1979-11-21 1981-04-28 Formica Corporation Cushion for laminating operations
US4350551A (en) * 1980-12-29 1982-09-21 The Boeing Company Fluid slip sheet and method
JPS5882217U (ja) * 1981-11-27 1983-06-03 ヤマウチ株式会社 成形プレス用クッション材

Also Published As

Publication number Publication date
JPH0572262B2 (ko) 1993-10-08
EP0174949B1 (en) 1988-06-15
DE3563325D1 (en) 1988-07-21
CA1225163A (en) 1987-08-04
KR850700226A (ko) 1985-12-26
IL74420A0 (en) 1985-05-31
JPS61501255A (ja) 1986-06-26
WO1985003669A1 (en) 1985-08-29
KR910006350B1 (ko) 1991-08-21
EP0174949A4 (en) 1986-07-23
EP0174949A1 (en) 1986-03-26
IT8519631A0 (it) 1985-02-22

Similar Documents

Publication Publication Date Title
DE3571309D1 (en) Printed circuit board laminating apparatus
DE3566071D1 (en) Printed circuit board load-unload system and method
IL84596A0 (en) Apparatus and method for temporarily sealing holes in printed circuit boards
GB8506579D0 (en) Card-like electronic apparatus
DE3662240D1 (en) Method and apparatus for making copper-clad laminates
EP0145212A3 (en) Electronic apparatus stowage
DE3476037D1 (en) Robotic hand and method for manipulating printed circuit boards
GB8912083D0 (en) Device and method for separating printed circuit boards
DE3279675D1 (en) Method and device for soldering printed board
GB2155822B (en) Apparatus and method for making laminate structures
EP0206063A3 (en) Method and apparatus for correcting printed circuit boards
DE3571004D1 (en) Method and device for printing
EP0169456A3 (en) Method and apparatus for eliminating short circuits on electrical circuitry
EP0125670A3 (en) Printing method and device
DE3563325D1 (en) Method and apparatus for laminating flexible printed circuits
GB2091493B (en) Method and apparatus for making printed circuit boards
DE3465935D1 (en) Printing method and apparatus
IL84597A0 (en) Method for temporarily sealing holes in printed circuit boards
EP0152600A3 (en) Method and apparatus for the treatment of printed circuit boards
DE3472233D1 (en) Variable impact printing apparatus and method
EP0231646A3 (en) Electronic print board apparatus
GB2226990B (en) Electronic printing apparatus
GB2116117B (en) Printing apparatus and method
GB8830251D0 (en) Improved method for making printed circuits
SG593G (en) Apparatus for transferring electronic parts

Legal Events

Date Code Title Description
KB Patent renewed
HS Change of address for service
RH1 Patent not in force