IL45626A0 - Hybrid microcircuit fabrication aid - Google Patents

Hybrid microcircuit fabrication aid

Info

Publication number
IL45626A0
IL45626A0 IL45626A IL4562674A IL45626A0 IL 45626 A0 IL45626 A0 IL 45626A0 IL 45626 A IL45626 A IL 45626A IL 4562674 A IL4562674 A IL 4562674A IL 45626 A0 IL45626 A0 IL 45626A0
Authority
IL
Israel
Prior art keywords
hybrid microcircuit
microcircuit fabrication
fabrication aid
aid
hybrid
Prior art date
Application number
IL45626A
Other versions
IL45626A (en
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of IL45626A0 publication Critical patent/IL45626A0/en
Publication of IL45626A publication Critical patent/IL45626A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C11/00—Auxiliary processes in photography
    • G03C11/02—Marking or applying text
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
IL45626A 1973-10-09 1974-09-09 Hybrid microcircuit fabrication aid IL45626A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US40452573A 1973-10-09 1973-10-09

Publications (2)

Publication Number Publication Date
IL45626A0 true IL45626A0 (en) 1974-11-29
IL45626A IL45626A (en) 1976-10-31

Family

ID=23599946

Family Applications (1)

Application Number Title Priority Date Filing Date
IL45626A IL45626A (en) 1973-10-09 1974-09-09 Hybrid microcircuit fabrication aid

Country Status (6)

Country Link
JP (1) JPS5837719B2 (en)
DE (1) DE2443850C3 (en)
FR (1) FR2247049B1 (en)
GB (1) GB1471163A (en)
IL (1) IL45626A (en)
IT (1) IT1019493B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5930545Y2 (en) * 1976-09-28 1984-08-31 日本電気株式会社 printed wiring board
FR2381627B1 (en) * 1978-01-20 1983-06-10 Ibm METHOD OF FORMING CHARACTERS ON KEYBOARD KEYS AND KEYBOARD KEYS CARRYING CHARACTERS FORMED ACCORDING TO THIS METHOD
GB2182207B (en) * 1985-10-29 1988-12-14 Marconi Instruments Ltd Electrical circuit identification
US4668603A (en) * 1986-06-26 1987-05-26 E. I. Du Pont De Nemours And Company Method of making raised relief circuit board with soldered connections having nomenclature applied thereto
GB2211667A (en) * 1986-12-29 1989-07-05 Motorola Inc Method for inspecting printed circuit boards for missing or misplaced components
CN1025460C (en) * 1988-06-17 1994-07-13 精工爱普生株式会社 Multifunctional electronic watch
JPH05308176A (en) * 1992-04-30 1993-11-19 Nec Corp Printed wiring board
JP2833521B2 (en) * 1995-05-18 1998-12-09 日本電気株式会社 Wiring board

Also Published As

Publication number Publication date
DE2443850A1 (en) 1975-04-17
GB1471163A (en) 1977-04-21
DE2443850B2 (en) 1977-09-22
IL45626A (en) 1976-10-31
FR2247049B1 (en) 1978-05-05
IT1019493B (en) 1977-11-10
JPS5837719B2 (en) 1983-08-18
DE2443850C3 (en) 1980-04-03
JPS5065872A (en) 1975-06-03
FR2247049A1 (en) 1975-05-02

Similar Documents

Publication Publication Date Title
CA997482A (en) Integrated circuit fabrication process
JPS56124256A (en) Integrated circuit
JPS514464A (en) Junkatsuyu no saiseihoho
CA1023011A (en) Integrated circuits
CA1004778A (en) Integrated circuit
JPS5133102A (en) Sekitan no gasukahoho
JPS511558A (en) Atsushukuhizumi no hikui shirokisanerasutomaa
AU6138073A (en) Figure
AU6912674A (en) Semiconductor devices
AU6733674A (en) Lifebelt-swimming aid
GB1442151A (en) Electronic hybrid
IL45626A0 (en) Hybrid microcircuit fabrication aid
JPS51118963A (en) Hybrid semiconductor element
JPS5143759A (en) Nn * jihidorokishipuropiru * hidantoinruino seizohoho
GB1438263A (en) Linematching circuit
JPS5152867A (en) yobihyojibanoyobi hizukehyojiban no kudosochi
CA1015070A (en) Semiconductor components
JPS5137457A (en) Sokohoisuto no itsusoboshisochi
JPS5110895A (en) Horikaaboneeto no seizohoho
IE39471L (en) Chlorothio-n-phthalimide; intermediate
JPS5129210A (en) Mushukaninnikumatsu no seizoho
JPS517064A (en) Goseimeiboku no seizohoho
AU6982574A (en) Circuit
JPS511508A (en) Kazangarasunyoru tainetsushogekiseitojiki no seizoho
GB1410544A (en) Chuck