IL299124A - שיטת מטרולוגיה ומכשירים ותוכנית מחשב - Google Patents

שיטת מטרולוגיה ומכשירים ותוכנית מחשב

Info

Publication number
IL299124A
IL299124A IL299124A IL29912422A IL299124A IL 299124 A IL299124 A IL 299124A IL 299124 A IL299124 A IL 299124A IL 29912422 A IL29912422 A IL 29912422A IL 299124 A IL299124 A IL 299124A
Authority
IL
Israel
Prior art keywords
instruments
computer program
metrology method
metrology
program
Prior art date
Application number
IL299124A
Other languages
English (en)
Other versions
IL299124B1 (he
IL299124B2 (he
Original Assignee
Asml Holding Nv
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Holding Nv, Asml Netherlands Bv filed Critical Asml Holding Nv
Publication of IL299124A publication Critical patent/IL299124A/he
Publication of IL299124B1 publication Critical patent/IL299124B1/he
Publication of IL299124B2 publication Critical patent/IL299124B2/he

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70625Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70633Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046Strategy, e.g. mark, sensor or wavelength selection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IL299124A 2020-07-09 2021-05-27 שיטת מטרולוגיה ומכשירים ותוכנית מחשב IL299124B2 (he)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063049897P 2020-07-09 2020-07-09
PCT/EP2021/064156 WO2022008135A1 (en) 2020-07-09 2021-05-27 Metrology method and apparatus and computer program

Publications (3)

Publication Number Publication Date
IL299124A true IL299124A (he) 2023-02-01
IL299124B1 IL299124B1 (he) 2025-10-01
IL299124B2 IL299124B2 (he) 2026-02-01

Family

ID=76283711

Family Applications (1)

Application Number Title Priority Date Filing Date
IL299124A IL299124B2 (he) 2020-07-09 2021-05-27 שיטת מטרולוגיה ומכשירים ותוכנית מחשב

Country Status (7)

Country Link
US (1) US12189305B2 (he)
JP (1) JP7511033B2 (he)
KR (1) KR102887499B1 (he)
CN (1) CN115777084A (he)
IL (1) IL299124B2 (he)
TW (1) TWI790651B (he)
WO (1) WO2022008135A1 (he)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3770682A1 (en) * 2019-07-25 2021-01-27 ASML Netherlands B.V. Method and system for determining information about a target structure
EP4224254A1 (en) * 2022-02-04 2023-08-09 ASML Netherlands B.V. Metrology method and associated metrology device
EP4455786A1 (en) 2023-04-26 2024-10-30 ASML Netherlands B.V. Metrology method and apparatus and computer program background

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1036245A1 (nl) 2007-12-17 2009-06-18 Asml Netherlands Bv Diffraction based overlay metrology tool and method of diffraction based overlay metrology.
NL1036597A1 (nl) 2008-02-29 2009-09-01 Asml Netherlands Bv Metrology method and apparatus, lithographic apparatus, and device manufacturing method.
JP5545782B2 (ja) 2009-07-31 2014-07-09 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置の焦点測定方法、散乱計、リソグラフィシステム、およびリソグラフィセル
KR20120058572A (ko) 2009-08-24 2012-06-07 에이에스엠엘 네델란즈 비.브이. 메트롤로지 방법 및 장치, 리소그래피 장치, 리소그래피 처리 셀 및 메트롤로지 타겟들을 포함하는 기판
JP5377595B2 (ja) 2011-03-25 2013-12-25 富士フイルム株式会社 着色感放射線性組成物、カラーフィルタ、着色パターンの製造方法、カラーフィルタの製造方法、固体撮像素子、及び液晶表示装置
EP2959262A4 (en) * 2013-02-21 2016-09-28 Nova Measuring Instr Ltd METHOD AND SYSTEM FOR OPTICAL PHASE MEASUREMENT
KR101855243B1 (ko) 2013-08-07 2018-05-04 에이에스엠엘 네델란즈 비.브이. 메트롤로지 방법 및 장치, 리소그래피 시스템 및 디바이스 제조 방법
WO2015031337A1 (en) 2013-08-27 2015-03-05 Kla-Tencor Corporation Removing process-variation-related inaccuracies from scatterometry measurements
TWI498598B (zh) 2013-11-12 2015-09-01 Delta Electronics Inc 立體裸視投影裝置及顯示裝置
CN112698551B (zh) * 2014-11-25 2024-04-23 科磊股份有限公司 分析及利用景观
WO2017055072A1 (en) * 2015-10-02 2017-04-06 Asml Netherlands B.V. Metrology method and apparatus, computer program and lithographic system
US9972547B2 (en) * 2016-03-10 2018-05-15 Toshiba Memory Corporation Measurement method, manufacturing method of device, and measurement system
KR102259091B1 (ko) 2016-11-10 2021-06-01 에이에스엠엘 네델란즈 비.브이. 스택 차이를 이용한 설계 및 교정
KR102326192B1 (ko) 2017-05-03 2021-11-15 에이에스엠엘 네델란즈 비.브이. 계측 파라미터 결정 및 계측 레시피 선택
WO2018202388A1 (en) 2017-05-03 2018-11-08 Asml Netherlands B.V. Metrology parameter determination and metrology recipe selection
EP3454126A1 (en) 2017-09-08 2019-03-13 ASML Netherlands B.V. Method for estimating overlay
WO2019048145A1 (en) 2017-09-11 2019-03-14 Asml Netherlands B.V. METROLOGY IN LITHOGRAPHIC PROCESSES
EP3770682A1 (en) 2019-07-25 2021-01-27 ASML Netherlands B.V. Method and system for determining information about a target structure

Also Published As

Publication number Publication date
US20240027918A1 (en) 2024-01-25
JP2023532455A (ja) 2023-07-28
US12189305B2 (en) 2025-01-07
TW202209006A (zh) 2022-03-01
JP7511033B2 (ja) 2024-07-04
CN115777084A (zh) 2023-03-10
KR102887499B1 (ko) 2025-11-17
TWI790651B (zh) 2023-01-21
IL299124B1 (he) 2025-10-01
IL299124B2 (he) 2026-02-01
WO2022008135A1 (en) 2022-01-13
KR20230021733A (ko) 2023-02-14

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