IL26908A - Method for fabrication of beam lead semiconductor device - Google Patents

Method for fabrication of beam lead semiconductor device

Info

Publication number
IL26908A
IL26908A IL26908A IL2690866A IL26908A IL 26908 A IL26908 A IL 26908A IL 26908 A IL26908 A IL 26908A IL 2690866 A IL2690866 A IL 2690866A IL 26908 A IL26908 A IL 26908A
Authority
IL
Israel
Prior art keywords
fabrication
semiconductor device
beam lead
lead semiconductor
semiconductor
Prior art date
Application number
IL26908A
Other languages
English (en)
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of IL26908A publication Critical patent/IL26908A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1203Rectifying Diode
    • H01L2924/12036PN diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
  • Die Bonding (AREA)
  • Bipolar Transistors (AREA)
IL26908A 1965-12-07 1966-11-21 Method for fabrication of beam lead semiconductor device IL26908A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US512045A US3388048A (en) 1965-12-07 1965-12-07 Fabrication of beam lead semiconductor devices

Publications (1)

Publication Number Publication Date
IL26908A true IL26908A (en) 1970-11-30

Family

ID=24037447

Family Applications (1)

Application Number Title Priority Date Filing Date
IL26908A IL26908A (en) 1965-12-07 1966-11-21 Method for fabrication of beam lead semiconductor device

Country Status (11)

Country Link
US (1) US3388048A (US20100268047A1-20101021-C00003.png)
AT (1) AT266219B (US20100268047A1-20101021-C00003.png)
BE (1) BE690534A (US20100268047A1-20101021-C00003.png)
CH (1) CH455945A (US20100268047A1-20101021-C00003.png)
DE (1) DE1589076C3 (US20100268047A1-20101021-C00003.png)
ES (1) ES334684A1 (US20100268047A1-20101021-C00003.png)
FR (1) FR1504176A (US20100268047A1-20101021-C00003.png)
GB (1) GB1166659A (US20100268047A1-20101021-C00003.png)
IL (1) IL26908A (US20100268047A1-20101021-C00003.png)
NL (1) NL6617128A (US20100268047A1-20101021-C00003.png)
SE (1) SE325336B (US20100268047A1-20101021-C00003.png)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3506887A (en) * 1966-02-23 1970-04-14 Motorola Inc Semiconductor device and method of making same
GB1175667A (en) * 1966-04-07 1969-12-23 Associated Semiconductor Mft Improvements in the Electrodeposition of Metals using a Composite Mask
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
US3507756A (en) * 1967-08-04 1970-04-21 Bell Telephone Labor Inc Method of fabricating semiconductor device contact
US3658489A (en) * 1968-08-09 1972-04-25 Nippon Electric Co Laminated electrode for a semiconductor device
US3620932A (en) * 1969-05-05 1971-11-16 Trw Semiconductors Inc Beam leads and method of fabrication
US3708403A (en) * 1971-09-01 1973-01-02 L Terry Self-aligning electroplating mask
US3926747A (en) * 1974-02-19 1975-12-16 Bell Telephone Labor Inc Selective electrodeposition of gold on electronic devices
US4011144A (en) * 1975-12-22 1977-03-08 Western Electric Company Methods of forming metallization patterns on beam lead semiconductor devices
US4988412A (en) * 1988-12-27 1991-01-29 General Electric Company Selective electrolytic desposition on conductive and non-conductive substrates
WO1991014288A1 (en) * 1990-03-07 1991-09-19 Santa Barbara Research Center Magnetoresistor structure and operating method
CN111945128A (zh) * 2020-08-18 2020-11-17 江苏能华微电子科技发展有限公司 一种提高铂与衬底黏附性的方法及其产品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3287612A (en) * 1963-12-17 1966-11-22 Bell Telephone Labor Inc Semiconductor contacts and protective coatings for planar devices
US3325379A (en) * 1962-05-22 1967-06-13 Hazeltine Research Inc Method of making metallic patterns having continuous interconnections
NL134170C (US20100268047A1-20101021-C00003.png) * 1963-12-17 1900-01-01
US3274670A (en) * 1965-03-18 1966-09-27 Bell Telephone Labor Inc Semiconductor contact

Also Published As

Publication number Publication date
SE325336B (US20100268047A1-20101021-C00003.png) 1970-06-29
DE1589076C3 (de) 1980-11-06
NL6617128A (US20100268047A1-20101021-C00003.png) 1967-06-08
GB1166659A (en) 1969-10-08
DE1589076B2 (de) 1975-05-22
CH455945A (de) 1968-05-15
FR1504176A (fr) 1967-12-01
BE690534A (US20100268047A1-20101021-C00003.png) 1967-05-16
US3388048A (en) 1968-06-11
AT266219B (de) 1968-11-11
DE1589076A1 (de) 1970-03-19
ES334684A1 (es) 1967-11-01

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