IL183653A - Image sensor and method of fabricating the same - Google Patents

Image sensor and method of fabricating the same

Info

Publication number
IL183653A
IL183653A IL183653A IL18365303A IL183653A IL 183653 A IL183653 A IL 183653A IL 183653 A IL183653 A IL 183653A IL 18365303 A IL18365303 A IL 18365303A IL 183653 A IL183653 A IL 183653A
Authority
IL
Israel
Prior art keywords
fabricating
same
image sensor
sensor
image
Prior art date
Application number
IL183653A
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of IL183653A publication Critical patent/IL183653A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1462Coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685Process for coatings or optical elements

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
IL183653A 2002-06-20 2003-06-17 Image sensor and method of fabricating the same IL183653A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20020034589 2002-06-20
KR10-2003-0025165A KR100512177B1 (en) 2002-06-20 2003-04-21 Image sensor and method of fabricating the same

Publications (1)

Publication Number Publication Date
IL183653A true IL183653A (en) 2010-12-30

Family

ID=32387841

Family Applications (2)

Application Number Title Priority Date Filing Date
IL183653A IL183653A (en) 2002-06-20 2003-06-17 Image sensor and method of fabricating the same
IL183653A IL183653A0 (en) 2002-06-20 2007-06-04 Image sensor and method of fabricating the same

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL183653A IL183653A0 (en) 2002-06-20 2007-06-04 Image sensor and method of fabricating the same

Country Status (2)

Country Link
KR (1) KR100512177B1 (en)
IL (2) IL183653A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4616565B2 (en) * 2004-02-16 2011-01-19 パナソニック株式会社 Semiconductor device and manufacturing method thereof
KR100660324B1 (en) 2004-07-01 2006-12-22 동부일렉트로닉스 주식회사 Fabricating method of CMOS image sensor
KR100684870B1 (en) 2004-12-07 2007-02-20 삼성전자주식회사 Cmos image sensor and methods of forming the same
KR100731064B1 (en) * 2005-12-28 2007-06-22 동부일렉트로닉스 주식회사 Method for manufacturing of cmos image sensor
KR100776169B1 (en) * 2006-08-09 2007-11-12 동부일렉트로닉스 주식회사 Image sensor device and method of manufacturing thereof
KR100792334B1 (en) * 2006-08-21 2008-01-07 동부일렉트로닉스 주식회사 Image sensor and method of manufacturing the same
KR100792335B1 (en) * 2006-08-22 2008-01-07 동부일렉트로닉스 주식회사 Image sensor and method of manufacturing the image sensor
KR101024825B1 (en) 2008-06-20 2011-03-31 주식회사 동부하이텍 Image sensor and Manufacturing method of image sensor

Also Published As

Publication number Publication date
KR20030097648A (en) 2003-12-31
IL183653A0 (en) 2007-09-20
KR100512177B1 (en) 2005-09-02

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Legal Events

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