IL157827A0 - Reinforced polishing pad with a shaped or flexible window structure - Google Patents
Reinforced polishing pad with a shaped or flexible window structureInfo
- Publication number
- IL157827A0 IL157827A0 IL15782702A IL15782702A IL157827A0 IL 157827 A0 IL157827 A0 IL 157827A0 IL 15782702 A IL15782702 A IL 15782702A IL 15782702 A IL15782702 A IL 15782702A IL 157827 A0 IL157827 A0 IL 157827A0
- Authority
- IL
- Israel
- Prior art keywords
- shaped
- polishing pad
- window structure
- flexible window
- reinforced
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/823,685 US6641470B1 (en) | 2001-03-30 | 2001-03-30 | Apparatus for accurate endpoint detection in supported polishing pads |
PCT/US2002/009675 WO2002078902A1 (en) | 2001-03-30 | 2002-03-29 | Reinforced polishing pad with a shaped or flexible window structure |
Publications (1)
Publication Number | Publication Date |
---|---|
IL157827A0 true IL157827A0 (en) | 2004-03-28 |
Family
ID=25239411
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL15782702A IL157827A0 (en) | 2001-03-30 | 2002-03-29 | Reinforced polishing pad with a shaped or flexible window structure |
IL157827A IL157827A (en) | 2001-03-30 | 2003-09-09 | Reinforced polishing pad with a shaped or flexible window structure |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL157827A IL157827A (en) | 2001-03-30 | 2003-09-09 | Reinforced polishing pad with a shaped or flexible window structure |
Country Status (8)
Country | Link |
---|---|
US (1) | US6641470B1 (ja) |
EP (1) | EP1372908A1 (ja) |
JP (1) | JP2005506682A (ja) |
KR (1) | KR20030090697A (ja) |
CN (1) | CN1543387A (ja) |
IL (2) | IL157827A0 (ja) |
TW (1) | TW548734B (ja) |
WO (1) | WO2002078902A1 (ja) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8485862B2 (en) | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US7040957B2 (en) * | 2002-08-14 | 2006-05-09 | Novellus Systems Inc. | Platen and manifold for polishing workpieces |
US6806100B1 (en) * | 2002-12-24 | 2004-10-19 | Lam Research Corporation | Molded end point detection window for chemical mechanical planarization |
US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US7086932B2 (en) * | 2004-05-11 | 2006-08-08 | Freudenberg Nonwovens | Polishing pad |
JP2005019669A (ja) * | 2003-06-26 | 2005-01-20 | Matsushita Electric Ind Co Ltd | 研磨パッド、研磨装置、及びウェハの研磨方法 |
US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
US7258602B2 (en) * | 2003-10-22 | 2007-08-21 | Iv Technologies Co., Ltd. | Polishing pad having grooved window therein and method of forming the same |
TWI385050B (zh) | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於cmp之特製拋光墊及其製造方法及其用途 |
TWI357845B (en) * | 2006-02-15 | 2012-02-11 | Applied Materials Inc | Polishing surfaces |
WO2007104063A1 (en) * | 2006-03-09 | 2007-09-13 | Rimpad Tech Ltd. | Composite polishing pad |
US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
DE102008021569A1 (de) * | 2008-04-30 | 2009-11-05 | Advanced Micro Devices, Inc., Sunnyvale | System und Verfahren zur optischen Endpunkterkennung während des CMP unter Anwendung eines substratüberspannenenden Signals |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
US20110281510A1 (en) * | 2010-05-12 | 2011-11-17 | Applied Materials, Inc. | Pad Window Insert |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
CN101957486B (zh) * | 2010-08-25 | 2012-01-04 | 哈尔滨工业大学 | 耐高低温光学窗口支撑部件 |
US8257545B2 (en) | 2010-09-29 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith |
CN102554809B (zh) * | 2010-12-30 | 2015-02-04 | 圣戈班磨料磨具(上海)有限公司 | 具有检视窗口的砂轮 |
US20130217306A1 (en) * | 2012-02-16 | 2013-08-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | CMP Groove Depth and Conditioning Disk Monitoring |
US9108293B2 (en) * | 2012-07-30 | 2015-08-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing layer pretexturing |
JP2014104521A (ja) * | 2012-11-26 | 2014-06-09 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
JP6105371B2 (ja) * | 2013-04-25 | 2017-03-29 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
CN103465154B (zh) * | 2013-09-07 | 2016-05-25 | 南通春光自控设备工程有限公司 | 软质研磨抛光盘 |
US10160089B2 (en) * | 2015-10-01 | 2018-12-25 | Ebara Corporation | Polishing apparatus |
US11133231B2 (en) * | 2017-11-20 | 2021-09-28 | Taiwan Semiconductor Manufacturing Company Ltd. | CMP apparatus and method for estimating film thickness |
CN110962001B (zh) * | 2019-11-27 | 2021-04-27 | 广东博智林机器人有限公司 | 打磨装置及打磨机器人 |
US20210299816A1 (en) * | 2020-03-25 | 2021-09-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cmp polishing pad with protruding structures having engineered open void space |
KR20230161943A (ko) * | 2021-03-26 | 2023-11-28 | 후지보 홀딩스 가부시키가이샤 | 연마 패드 |
CN113246015B (zh) * | 2021-05-25 | 2022-09-20 | 万华化学集团电子材料有限公司 | 具有终点检测窗的抛光垫及其应用 |
CN113478382B (zh) * | 2021-07-20 | 2022-11-04 | 湖北鼎汇微电子材料有限公司 | 检测窗口、化学机械抛光垫及抛光系统 |
KR20240006369A (ko) * | 2022-07-06 | 2024-01-15 | 케이피엑스케미칼 주식회사 | 윈도우가 장착된 연마패드 및 이의 제조방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
JP3313505B2 (ja) * | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
US5964643A (en) * | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
DE19720623C1 (de) | 1997-05-16 | 1998-11-05 | Siemens Ag | Poliervorrichtung und Poliertuch |
US6146248A (en) | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
US6186865B1 (en) * | 1998-10-29 | 2001-02-13 | Lam Research Corporation | Apparatus and method for performing end point detection on a linear planarization tool |
KR100435246B1 (ko) | 1999-03-31 | 2004-06-11 | 가부시키가이샤 니콘 | 연마체, 연마장치, 연마장치의 조정방법, 연마막 두께또는 연마종점의 측정방법, 및 반도체 디바이스의 제조방법 |
JP2002001652A (ja) * | 2000-06-22 | 2002-01-08 | Nikon Corp | 研磨パッド及び研磨装置及び素子製造方法 |
-
2001
- 2001-03-30 US US09/823,685 patent/US6641470B1/en not_active Expired - Fee Related
-
2002
- 2002-03-29 TW TW091106455A patent/TW548734B/zh not_active IP Right Cessation
- 2002-03-29 JP JP2002577151A patent/JP2005506682A/ja active Pending
- 2002-03-29 KR KR10-2003-7012784A patent/KR20030090697A/ko not_active Application Discontinuation
- 2002-03-29 IL IL15782702A patent/IL157827A0/xx active IP Right Grant
- 2002-03-29 CN CNA028074831A patent/CN1543387A/zh active Pending
- 2002-03-29 EP EP02733910A patent/EP1372908A1/en not_active Withdrawn
- 2002-03-29 WO PCT/US2002/009675 patent/WO2002078902A1/en not_active Application Discontinuation
-
2003
- 2003-09-09 IL IL157827A patent/IL157827A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2002078902A1 (en) | 2002-10-10 |
JP2005506682A (ja) | 2005-03-03 |
EP1372908A1 (en) | 2004-01-02 |
IL157827A (en) | 2008-06-05 |
TW548734B (en) | 2003-08-21 |
KR20030090697A (ko) | 2003-11-28 |
US6641470B1 (en) | 2003-11-04 |
CN1543387A (zh) | 2004-11-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
FF | Patent granted |