IL135522A - Optical inspection of laser vias - Google Patents

Optical inspection of laser vias

Info

Publication number
IL135522A
IL135522A IL13552200A IL13552200A IL135522A IL 135522 A IL135522 A IL 135522A IL 13552200 A IL13552200 A IL 13552200A IL 13552200 A IL13552200 A IL 13552200A IL 135522 A IL135522 A IL 135522A
Authority
IL
Israel
Prior art keywords
optical inspection
laser vias
vias
laser
inspection
Prior art date
Application number
IL13552200A
Other languages
English (en)
Other versions
IL135522A0 (en
Original Assignee
Orbotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=11074030&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IL135522(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Orbotech Ltd filed Critical Orbotech Ltd
Priority to IL13552200A priority Critical patent/IL135522A/xx
Priority to TW089106616A priority patent/TW504569B/zh
Priority to US09/825,493 priority patent/US6556293B2/en
Publication of IL135522A0 publication Critical patent/IL135522A0/xx
Priority to US10/259,666 priority patent/US6621572B2/en
Publication of IL135522A publication Critical patent/IL135522A/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95692—Patterns showing hole parts, e.g. honeycomb filtering structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
IL13552200A 2000-04-06 2000-04-06 Optical inspection of laser vias IL135522A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IL13552200A IL135522A (en) 2000-04-06 2000-04-06 Optical inspection of laser vias
TW089106616A TW504569B (en) 2000-04-06 2000-04-10 Optical inspection of laser vias
US09/825,493 US6556293B2 (en) 2000-04-06 2001-04-03 Optical inspection of laser vias
US10/259,666 US6621572B2 (en) 2000-04-06 2002-09-27 Optical inspection of laser vias

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL13552200A IL135522A (en) 2000-04-06 2000-04-06 Optical inspection of laser vias

Publications (2)

Publication Number Publication Date
IL135522A0 IL135522A0 (en) 2001-05-20
IL135522A true IL135522A (en) 2005-11-20

Family

ID=11074030

Family Applications (1)

Application Number Title Priority Date Filing Date
IL13552200A IL135522A (en) 2000-04-06 2000-04-06 Optical inspection of laser vias

Country Status (3)

Country Link
US (2) US6556293B2 (zh)
IL (1) IL135522A (zh)
TW (1) TW504569B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4133816B2 (ja) * 2001-08-09 2008-08-13 オーボテック リミテッド 多層電気回路内に埋め込まれたターゲットを露出させるためのシステムおよび方法
US7130036B1 (en) 2003-09-16 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for inspection of an entire wafer surface using multiple detection channels
US7650028B1 (en) 2004-10-26 2010-01-19 Sandia Corporation Vicinal light inspection of translucent materials
US7379185B2 (en) * 2004-11-01 2008-05-27 Applied Materials, Inc. Evaluation of openings in a dielectric layer
US7668364B2 (en) * 2005-04-26 2010-02-23 Hitachi Via Mechanics, Ltd. Inspection method and apparatus for partially drilled microvias
US8290239B2 (en) * 2005-10-21 2012-10-16 Orbotech Ltd. Automatic repair of electric circuits
US20130020507A1 (en) * 2010-06-17 2013-01-24 Life Technologies Corporation Methods for Detecting Defects in Inorganic-Coated Polymer Surfaces
US9035673B2 (en) * 2010-01-25 2015-05-19 Palo Alto Research Center Incorporated Method of in-process intralayer yield detection, interlayer shunt detection and correction
WO2011120089A1 (en) * 2010-03-30 2011-10-06 Bt Imaging Pty Ltd Control of laser processing steps in solar cell manufacture
WO2012142490A1 (en) 2011-04-13 2012-10-18 Kior, Inc. Improved catalyst for thermocatalytic conversion of biomass to liquid fuels and chemicals
US9518229B2 (en) 2012-07-20 2016-12-13 Inaeris Technologies, Llc Catalysts for thermo-catalytic conversion of biomass, and methods of making and using
WO2016166751A1 (en) * 2015-04-13 2016-10-20 Printcb Ltd. Printing of multi-layer circuits
US10520759B2 (en) * 2016-01-07 2019-12-31 Telefonaktiebolaget Lm Ericsson (Publ) Opto-electronic oscillator and method of generating an electrical carrier signal
CN109557450B (zh) * 2018-11-28 2021-11-30 江门市利诺达电路科技有限公司 一种电路板的检测方法
US11651492B2 (en) * 2019-07-12 2023-05-16 Bruker Nano, Inc. Methods and systems for manufacturing printed circuit board based on x-ray inspection
CN112326667A (zh) * 2020-10-27 2021-02-05 惠州市特创电子科技有限公司 导电连接孔的覆铜检测方法及装置
TWI792940B (zh) * 2021-03-22 2023-02-11 旺矽科技股份有限公司 光學檢測系統及其不需使用光纖的雷射光提供模組

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4166540A (en) * 1978-01-26 1979-09-04 A. C. Nielsen Company Document sorter utilizing cascaded sorting steps
US4504727A (en) * 1982-12-30 1985-03-12 International Business Machines Corporation Laser drilling system utilizing photoacoustic feedback
US5087396A (en) * 1988-09-15 1992-02-11 Unisys Corporation Method of forming holes in unfired ceramic layers of integrated circuit packages
US4983817A (en) * 1989-03-01 1991-01-08 Battelle Memorial Institute Background compensating bar code readers
DE68910322T2 (de) * 1989-11-28 1994-05-05 Ibm Verfahren zur Inspektion von Durchkontakt-Stiften in integrierten Schaltungspackungen mittels Photoemission.
JPH0786466B2 (ja) * 1990-07-18 1995-09-20 大日本スクリーン製造株式会社 プリント基板のパターン検査装置
IL95205A0 (en) 1990-07-27 1991-06-10 Optrotech Ltd Method and apparatus for optical inspection of substrates
US5127730A (en) * 1990-08-10 1992-07-07 Regents Of The University Of Minnesota Multi-color laser scanning confocal imaging system
US5214712A (en) * 1990-09-11 1993-05-25 Matsushita Electric Industrial Co., Ltd. Pattern inspection system for inspecting defect of land pattern for through-hole on printed board
US5608225A (en) * 1994-03-08 1997-03-04 Hitachi Maxell, Ltd. Fluorescent detecting apparatus and method
US5903342A (en) * 1995-04-10 1999-05-11 Hitachi Electronics Engineering, Co., Ltd. Inspection method and device of wafer surface
US5773808A (en) * 1996-05-17 1998-06-30 Laser; Vadim Method and apparatus for reading invisible messages
US6033503A (en) * 1997-05-05 2000-03-07 Steven K. Radowicz Adhesive sensing assembly for end jointed beam
US6246472B1 (en) * 1997-07-04 2001-06-12 Hitachi, Ltd. Pattern inspecting system and pattern inspecting method
US6038336A (en) * 1997-12-04 2000-03-14 Daewoo Electronics Co., Ltd. PCB testing circuit for an automatic inserting apparatus and a testing method therefor
GB9811557D0 (en) * 1998-05-29 1998-07-29 Exitech Ltd The use of beam shaping for improving the performance of machines used to laser drill microvia holes in printed circuit (wiring) and other packages
CN1129788C (zh) 1998-08-10 2003-12-03 三菱电机株式会社 印刷电路基板的检查装置

Also Published As

Publication number Publication date
TW504569B (en) 2002-10-01
IL135522A0 (en) 2001-05-20
US20010028454A1 (en) 2001-10-11
US20030025907A1 (en) 2003-02-06
US6556293B2 (en) 2003-04-29
US6621572B2 (en) 2003-09-16

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Legal Events

Date Code Title Description
NP Permission for amending the patent specification granted (section 66, patents law 1967)
NP Permission for amending the patent specification granted (section 66, patents law 1967)
FF Patent granted
KB Patent renewed
MM9K Patent not in force due to non-payment of renewal fees