IL128326A0 - Encapsulated micro-relay modules and methods of fabricating same - Google Patents

Encapsulated micro-relay modules and methods of fabricating same

Info

Publication number
IL128326A0
IL128326A0 IL12832697A IL12832697A IL128326A0 IL 128326 A0 IL128326 A0 IL 128326A0 IL 12832697 A IL12832697 A IL 12832697A IL 12832697 A IL12832697 A IL 12832697A IL 128326 A0 IL128326 A0 IL 128326A0
Authority
IL
Israel
Prior art keywords
methods
fabricating same
relay modules
encapsulated micro
encapsulated
Prior art date
Application number
IL12832697A
Other languages
English (en)
Original Assignee
Mcnc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mcnc filed Critical Mcnc
Publication of IL128326A0 publication Critical patent/IL128326A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/005—Details of electromagnetic relays using micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/64—Protective enclosures, baffle plates, or screens for contacts
    • H01H1/66—Contacts sealed in an evacuated or gas-filled envelope, e.g. magnetic dry-reed contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/023—Details concerning sealing, e.g. sealing casing with resin
    • H01H2050/025—Details concerning sealing, e.g. sealing casing with resin containing inert or dielectric gasses, e.g. SF6, for arc prevention or arc extinction

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Micromachines (AREA)
IL12832697A 1996-08-05 1997-07-30 Encapsulated micro-relay modules and methods of fabricating same IL128326A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/692,502 US6025767A (en) 1996-08-05 1996-08-05 Encapsulated micro-relay modules and methods of fabricating same
PCT/US1997/014332 WO1998006118A1 (fr) 1996-08-05 1997-07-30 Modules de micro-relais encapsules et leurs procedes de fabrication

Publications (1)

Publication Number Publication Date
IL128326A0 true IL128326A0 (en) 2000-01-31

Family

ID=24780839

Family Applications (1)

Application Number Title Priority Date Filing Date
IL12832697A IL128326A0 (en) 1996-08-05 1997-07-30 Encapsulated micro-relay modules and methods of fabricating same

Country Status (8)

Country Link
US (1) US6025767A (fr)
EP (1) EP0916145A1 (fr)
JP (1) JP2000515676A (fr)
KR (1) KR20000029835A (fr)
AU (1) AU3915897A (fr)
CA (1) CA2261683A1 (fr)
IL (1) IL128326A0 (fr)
WO (1) WO1998006118A1 (fr)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6388203B1 (en) 1995-04-04 2002-05-14 Unitive International Limited Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby
AU5316996A (en) 1995-04-05 1996-10-23 Mcnc A solder bump structure for a microelectronic substrate
EP0899787A3 (fr) * 1997-07-25 2001-05-16 Mcnc Réservoirs de soudure formés-contrôlés pour augmenter le volume de bosses de soudure et dtructures ainsi formées
US6373356B1 (en) 1999-05-21 2002-04-16 Interscience, Inc. Microelectromechanical liquid metal current carrying system, apparatus and method
US6853067B1 (en) 1999-10-12 2005-02-08 Microassembly Technologies, Inc. Microelectromechanical systems using thermocompression bonding
EP1093143A1 (fr) * 1999-10-15 2001-04-18 Lucent Technologies Inc. Micro-relais du type "flip-chip" monté sur un circuit integré
US6472739B1 (en) * 1999-11-15 2002-10-29 Jds Uniphase Corporation Encapsulated microelectromechanical (MEMS) devices
US6531341B1 (en) 2000-05-16 2003-03-11 Sandia Corporation Method of fabricating a microelectronic device package with an integral window
US6384473B1 (en) 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
US6335224B1 (en) 2000-05-16 2002-01-01 Sandia Corporation Protection of microelectronic devices during packaging
US6364460B1 (en) 2000-06-13 2002-04-02 Chad R. Sager Liquid delivery system
KR100370398B1 (ko) * 2000-06-22 2003-01-30 삼성전자 주식회사 전자 및 ｍｅｍｓ 소자의 표면실장형 칩 규모 패키징 방법
US6587021B1 (en) 2000-11-09 2003-07-01 Raytheon Company Micro-relay contact structure for RF applications
US20020096421A1 (en) * 2000-11-29 2002-07-25 Cohn Michael B. MEMS device with integral packaging
US6798931B2 (en) * 2001-03-06 2004-09-28 Digital Optics Corp. Separating of optical integrated modules and structures formed thereby
US6639493B2 (en) * 2001-03-30 2003-10-28 Arizona State University Micro machined RF switches and methods of operating the same
KR100387239B1 (ko) * 2001-04-26 2003-06-12 삼성전자주식회사 Ｍｅｍｓ 릴레이 및 그 제조방법
WO2002095784A1 (fr) * 2001-05-18 2002-11-28 Microlab, Inc. Boitier pour commutateur de verrouillage micromagnetique
WO2002096166A1 (fr) * 2001-05-18 2002-11-28 Corporation For National Research Initiatives Systemes microelectromecaniques (mems) radiofrequences sur substrats a ceramiques cocuites a basse temperature (ltcc)
ATE458386T1 (de) * 2001-09-17 2010-03-15 John Stafford Kapselung fuer polarisiertes mems relais und verfahren zur kapselung
US6778046B2 (en) * 2001-09-17 2004-08-17 Magfusion Inc. Latching micro magnetic relay packages and methods of packaging
US20030179057A1 (en) * 2002-01-08 2003-09-25 Jun Shen Packaging of a micro-magnetic switch with a patterned permanent magnet
US20030137374A1 (en) * 2002-01-18 2003-07-24 Meichun Ruan Micro-Magnetic Latching switches with a three-dimensional solenoid coil
US6852926B2 (en) * 2002-03-26 2005-02-08 Intel Corporation Packaging microelectromechanical structures
US6673697B2 (en) * 2002-04-03 2004-01-06 Intel Corporation Packaging microelectromechanical structures
US6713314B2 (en) * 2002-08-14 2004-03-30 Intel Corporation Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator
US7317232B2 (en) * 2002-10-22 2008-01-08 Cabot Microelectronics Corporation MEM switching device
FR2846318B1 (fr) * 2002-10-24 2005-01-07 Commissariat Energie Atomique Microstructure electromecanique integree comportant des moyens de reglage de la pression dans une cavite scellee et procede de reglage de la pression
US7170155B2 (en) * 2003-06-25 2007-01-30 Intel Corporation MEMS RF switch module including a vertical via
US7795723B2 (en) * 2004-02-05 2010-09-14 Analog Devices, Inc. Capped sensor
US7183622B2 (en) * 2004-06-30 2007-02-27 Intel Corporation Module integrating MEMS and passive components
US7668415B2 (en) 2004-09-27 2010-02-23 Qualcomm Mems Technologies, Inc. Method and device for providing electronic circuitry on a backplate
US7288940B2 (en) * 2004-12-06 2007-10-30 Analog Devices, Inc. Galvanically isolated signal conditioning system
WO2006085825A1 (fr) * 2005-02-08 2006-08-17 Altus Technologies Pte. Ltd. Procede de conditionnement de dispositifs mems et boitiers de dispositifs mems produits a l’aide dudit procede
US7692521B1 (en) 2005-05-12 2010-04-06 Microassembly Technologies, Inc. High force MEMS device
TWI275187B (en) * 2005-11-30 2007-03-01 Advanced Semiconductor Eng Flip chip package and manufacturing method of the same
US7524693B2 (en) * 2006-05-16 2009-04-28 Freescale Semiconductor, Inc. Method and apparatus for forming an electrical connection to a semiconductor substrate
US8044755B2 (en) * 2008-04-09 2011-10-25 National Semiconductor Corporation MEMS power inductor
US7705411B2 (en) * 2008-04-09 2010-04-27 National Semiconductor Corporation MEMS-topped integrated circuit with a stress relief layer
ITTO20120542A1 (it) 2012-06-20 2013-12-21 St Microelectronics Srl Dispositivo microelettromeccanico con instradamento dei segnali attraverso un cappuccio protettivo e metodo per controllare un dispositivo microelettromeccanico
CN114434072B (zh) * 2022-01-27 2023-10-31 贵州航天电器股份有限公司 一种用于继电器接触片组合焊接的定位机构

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US557132A (en) * 1896-03-31 Photographic child s support
US3259814A (en) * 1955-05-20 1966-07-05 Rca Corp Power semiconductor assembly including heat dispersing means
DE1182353C2 (de) * 1961-03-29 1973-01-11 Siemens Ag Verfahren zum Herstellen eines Halbleiter-bauelements, wie Halbleiterstromtor oder Flaechentransistor, mit einer hochohmigen n-Zone zwischen zwei p-Zonen im Halbleiter-koerper
US3244947A (en) * 1962-06-15 1966-04-05 Slater Electric Inc Semi-conductor diode and manufacture thereof
US3274458A (en) * 1964-04-02 1966-09-20 Int Rectifier Corp Extremely high voltage silicon device
GB1134998A (en) * 1967-04-04 1968-11-27 Marconi Co Ltd Improvements in or relating to insulated gate field effect transistors
JPS49135749U (fr) * 1973-03-24 1974-11-21
US3959577A (en) * 1974-06-10 1976-05-25 Westinghouse Electric Corporation Hermetic seals for insulating-casing structures
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
US4257905A (en) * 1977-09-06 1981-03-24 The United States Of America As Represented By The United States Department Of Energy Gaseous insulators for high voltage electrical equipment
US4168480A (en) * 1978-02-13 1979-09-18 Torr Laboratories, Inc. Relay assembly
US4449580A (en) * 1981-06-30 1984-05-22 International Business Machines Corporation Vertical wall elevated pressure heat dissipation system
JPS58146827A (ja) * 1982-02-25 1983-09-01 Fuji Electric Co Ltd 半導体式圧力センサ
CH664040A5 (de) * 1982-07-19 1988-01-29 Bbc Brown Boveri & Cie Druckgasisolierter stromwandler.
JPS602011A (ja) * 1983-06-14 1985-01-08 三菱電機株式会社 ガス絶縁電気装置
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
JPH01214141A (ja) * 1988-02-23 1989-08-28 Nec Corp フリップチップ型半導体装置
CA2002213C (fr) * 1988-11-10 1999-03-30 Iwona Turlik Boitier de puce de circuits integres a haute performance et sa methode de fabrication
DE4205029C1 (en) * 1992-02-19 1993-02-11 Siemens Ag, 8000 Muenchen, De Micro-mechanical electrostatic relay - has tongue-shaped armature etched from surface of silicon@ substrate
US5371431A (en) * 1992-03-04 1994-12-06 Mcnc Vertical microelectronic field emission devices including elongate vertical pillars having resistive bottom portions
JPH0637143A (ja) * 1992-07-15 1994-02-10 Toshiba Corp 半導体装置および半導体装置の製造方法
US5479042A (en) * 1993-02-01 1995-12-26 Brooktree Corporation Micromachined relay and method of forming the relay

Also Published As

Publication number Publication date
JP2000515676A (ja) 2000-11-21
US6025767A (en) 2000-02-15
EP0916145A1 (fr) 1999-05-19
CA2261683A1 (fr) 1998-02-12
WO1998006118A1 (fr) 1998-02-12
KR20000029835A (ko) 2000-05-25
AU3915897A (en) 1998-02-25

Similar Documents

Publication Publication Date Title
IL128326A0 (en) Encapsulated micro-relay modules and methods of fabricating same
EP1037290A4 (fr) Procede de fabrication d'une batterie fermee et batterie fermee ainsi produite
EP0847465A4 (fr) Ensemble d'isolation encapsule
AU2373995A (en) Encapsulated retroreflective elements and method for making same
GB2314975B (en) Analog semiconductor device and method of fabricating the same
IL115191A0 (en) Current collector device and method of manufacturing same
PL328668A1 (en) Load carrying structural member and method of making same
EP0654854A3 (fr) Borne électrique et sa méthode de fabrication.
GB2320571B (en) Semiconductor micromachine and manufacturing method thereof
PL332741A1 (en) Battery and method of making same
EP0720228A3 (fr) Structure de connexion semi-conductrice et procédé associé
GB2310822B (en) Thermoplastic and thermoplastic composite structures and methods of manufacturing them
EP0982742A4 (fr) Module et procede de fabrication correspondant
GB9516203D0 (en) Vibration-generating-motor mounting structure and its mounting method
EP1100136A4 (fr) Cellule et procede de fabrication correspondant
EP0716478A3 (fr) Structure et procédé de connexion électrique
SG76496A1 (en) Circuit breaker and manufacturing method therefor
GB2318449B (en) Semiconductor device and method of fabricating the same
SG71064A1 (en) Package and method of manufacture of the same
EP0720182A3 (fr) Isolateur composite et son procédé de fabrication
AU4604497A (en) Method of fabricating and devices employing vents
AU2363497A (en) Integrated circuit and fabricating method and evaluating method of integrated circuit
GB2317496B (en) Chipshooter manufacturing system and method of operation
EP1031323A4 (fr) Dispositif de fixation d'os et procede de fabrication dudit dispositif
AU8748698A (en) Semiconductor device and method of fabricating the same