IL115934A0 - Laser processing chamber with cassette cell - Google Patents

Laser processing chamber with cassette cell

Info

Publication number
IL115934A0
IL115934A0 IL11593495A IL11593495A IL115934A0 IL 115934 A0 IL115934 A0 IL 115934A0 IL 11593495 A IL11593495 A IL 11593495A IL 11593495 A IL11593495 A IL 11593495A IL 115934 A0 IL115934 A0 IL 115934A0
Authority
IL
Israel
Prior art keywords
processing chamber
laser processing
cassette cell
cassette
cell
Prior art date
Application number
IL11593495A
Other languages
English (en)
Original Assignee
Oramir Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oramir Semiconductor Ltd filed Critical Oramir Semiconductor Ltd
Priority to IL11593495A priority Critical patent/IL115934A0/xx
Publication of IL115934A0 publication Critical patent/IL115934A0/xx
Priority to PCT/IL1996/000141 priority patent/WO1997017167A1/en
Priority to KR1019980703446A priority patent/KR19990067435A/ko
Priority to AU73312/96A priority patent/AU7331296A/en
Priority to IL12413796A priority patent/IL124137A/xx
Priority to JP9518033A priority patent/JP2000500285A/ja
Priority to US09/068,058 priority patent/US6123803A/en
Priority to EP96935314A priority patent/EP0859685A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B23K26/125—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases of mixed gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Drying Of Semiconductors (AREA)
IL11593495A 1995-11-09 1995-11-09 Laser processing chamber with cassette cell IL115934A0 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IL11593495A IL115934A0 (en) 1995-11-09 1995-11-09 Laser processing chamber with cassette cell
PCT/IL1996/000141 WO1997017167A1 (en) 1995-11-09 1996-11-04 Laser processing chamber with cassette cell
KR1019980703446A KR19990067435A (ko) 1995-11-09 1996-11-04 카세트 셀을 가지는 레이저 프로세스 챔버
AU73312/96A AU7331296A (en) 1995-11-09 1996-11-04 Laser processing chamber with cassette cell
IL12413796A IL124137A (en) 1995-11-09 1996-11-04 Laser processing chamber with cassette cell
JP9518033A JP2000500285A (ja) 1995-11-09 1996-11-04 カセットセルを有するレーザープロセッシングチェンバー
US09/068,058 US6123803A (en) 1995-11-09 1996-11-04 Laser processing chamber with cassette cell
EP96935314A EP0859685A1 (en) 1995-11-09 1996-11-04 Laser processing chamber with cassette cell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL11593495A IL115934A0 (en) 1995-11-09 1995-11-09 Laser processing chamber with cassette cell

Publications (1)

Publication Number Publication Date
IL115934A0 true IL115934A0 (en) 1996-01-31

Family

ID=11068164

Family Applications (1)

Application Number Title Priority Date Filing Date
IL11593495A IL115934A0 (en) 1995-11-09 1995-11-09 Laser processing chamber with cassette cell

Country Status (7)

Country Link
US (1) US6123803A (xx)
EP (1) EP0859685A1 (xx)
JP (1) JP2000500285A (xx)
KR (1) KR19990067435A (xx)
AU (1) AU7331296A (xx)
IL (1) IL115934A0 (xx)
WO (1) WO1997017167A1 (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL119246A (en) 1996-09-12 2000-10-31 Oramir Semiconductor Ltd Laser removal of foreign materials from surfaces
IL123416A0 (en) 1998-02-23 1998-09-24 Oramir Semiconductor Ltd Multi laser surface treatment in ambient fast flowing photoreactive gases
US6610582B1 (en) * 2002-03-26 2003-08-26 Northrop Grumman Corporation Field-assisted fusion bonding
US7288466B2 (en) 2002-05-14 2007-10-30 Kabushiki Kaisha Toshiba Processing method, manufacturing method of semiconductor device, and processing apparatus
JP4400138B2 (ja) * 2003-08-08 2010-01-20 セイコーエプソン株式会社 配線パターンの形成方法
CN110370153B (zh) * 2019-06-10 2021-07-13 浙江晶盛机电股份有限公司 一种用于抛光设备的上定盘晶片剥离装置
WO2024180117A1 (en) * 2023-02-28 2024-09-06 Hempel A/S A surface preparation apparatus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2674746B2 (ja) * 1986-02-20 1997-11-12 日本電気株式会社 半導体製造装置
US4752668A (en) * 1986-04-28 1988-06-21 Rosenfield Michael G System for laser removal of excess material from a semiconductor wafer
JPS6418226A (en) * 1987-07-14 1989-01-23 M T C Japan Kk Dry ashing device
IL84255A (en) * 1987-10-23 1993-02-21 Galram Technology Ind Ltd Process for removal of post- baked photoresist layer
US5643472A (en) * 1988-07-08 1997-07-01 Cauldron Limited Partnership Selective removal of material by irradiation
US5099557A (en) * 1988-07-08 1992-03-31 Engelsberg Audrey C Removal of surface contaminants by irradiation from a high-energy source
US5024968A (en) * 1988-07-08 1991-06-18 Engelsberg Audrey C Removal of surface contaminants by irradiation from a high-energy source
JPH02165616A (ja) * 1988-12-19 1990-06-26 Mitsubishi Electric Corp 露光装置
BR9306174A (pt) * 1992-03-31 1998-01-13 Cauldron Lp Remoção de contaminantes de superfície através de irradiação
TW252211B (xx) * 1993-04-12 1995-07-21 Cauldron Ltd Parthership
AU7682594A (en) * 1993-09-08 1995-03-27 Uvtech Systems, Inc. Surface processing
TW260806B (xx) * 1993-11-26 1995-10-21 Ushio Electric Inc

Also Published As

Publication number Publication date
US6123803A (en) 2000-09-26
EP0859685A1 (en) 1998-08-26
KR19990067435A (ko) 1999-08-16
JP2000500285A (ja) 2000-01-11
WO1997017167A1 (en) 1997-05-15
AU7331296A (en) 1997-05-29

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