IL106552A - High density electronics package having stacked circuit boards - Google Patents

High density electronics package having stacked circuit boards

Info

Publication number
IL106552A
IL106552A IL106552A IL10655293A IL106552A IL 106552 A IL106552 A IL 106552A IL 106552 A IL106552 A IL 106552A IL 10655293 A IL10655293 A IL 10655293A IL 106552 A IL106552 A IL 106552A
Authority
IL
Israel
Prior art keywords
heat sink
housing
circuit board
disposed
circuit boards
Prior art date
Application number
IL106552A
Other languages
English (en)
Other versions
IL106552A0 (en
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of IL106552A0 publication Critical patent/IL106552A0/xx
Publication of IL106552A publication Critical patent/IL106552A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/023—Stackable modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1434—Housings for electronics exposed to high gravitational force; Cylindrical housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06589—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
IL106552A 1992-08-14 1993-08-02 High density electronics package having stacked circuit boards IL106552A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/929,354 US5251099A (en) 1992-08-14 1992-08-14 High density electronics package having stacked circuit boards

Publications (2)

Publication Number Publication Date
IL106552A0 IL106552A0 (en) 1994-08-26
IL106552A true IL106552A (en) 1997-03-18

Family

ID=25457727

Family Applications (1)

Application Number Title Priority Date Filing Date
IL106552A IL106552A (en) 1992-08-14 1993-08-02 High density electronics package having stacked circuit boards

Country Status (9)

Country Link
US (1) US5251099A (de)
EP (1) EP0584669B1 (de)
JP (1) JPH07123191B2 (de)
AU (1) AU656087B2 (de)
CA (1) CA2101140C (de)
DE (1) DE69305133T2 (de)
ES (1) ES2092193T3 (de)
IL (1) IL106552A (de)
TW (1) TW222718B (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5469331A (en) * 1994-04-07 1995-11-21 Conway; Harry E. Cooling system for modular power supply device
US5621617A (en) * 1995-06-07 1997-04-15 Hughes Missile Systems Company Circuit card mounting system having a cylindrical housing and circular card locks
US6119573A (en) * 1997-01-27 2000-09-19 Raytheon Company Carbon fiber flocking for thermal management of compact missile electronics
EP0824451B1 (de) * 1996-01-30 2002-01-02 Raytheon Company Beflocken von kohlenstofffasern für thermische verwaltung von kompakten elektronischen teilen einer rakete
US5841638A (en) * 1996-02-15 1998-11-24 L3 Communications Stacked memory for flight recorders
US5812374A (en) * 1996-10-28 1998-09-22 Shuff; Gregg Douglas Electrical circuit cooling device
US5744771A (en) * 1996-11-05 1998-04-28 Argus Machine Co. Ltd. Pressure switch with increased deadband
US5847927A (en) * 1997-01-27 1998-12-08 Raytheon Company Electronic assembly with porous heat exchanger and orifice plate
US6292556B1 (en) 1997-11-06 2001-09-18 Anacapa Technology, Inc. Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction
FR2776888B1 (fr) * 1998-03-27 2000-06-16 Thomson Csf Structure de circuits electroniques a encombrement optimise en fonction du volume disponible
US6011691A (en) * 1998-04-23 2000-01-04 Lockheed Martin Corporation Electronic component assembly and method for low cost EMI and capacitive coupling elimination
US6351383B1 (en) * 1999-09-02 2002-02-26 Raytheon Company Heat conducting device for a circuit board
US6201700B1 (en) * 2000-01-06 2001-03-13 Ford Motor Company Box design for maximum heat dissipation
US6430044B2 (en) 2000-02-10 2002-08-06 Special Product Company Telecommunications enclosure with individual, separated card holders
US6404637B2 (en) * 2000-02-14 2002-06-11 Special Product Company Concentrical slot telecommunications equipment enclosure
US6940014B1 (en) 2000-07-27 2005-09-06 Special Product Company Modular electronic equipment enclosure comprising sealed cable interface module
US6514095B1 (en) 2000-07-27 2003-02-04 Special Product Company Cable interface for electronic equipment enclosure
US6507494B1 (en) 2000-07-27 2003-01-14 Adc Telecommunications, Inc. Electronic equipment enclosure
US6532154B2 (en) * 2001-01-09 2003-03-11 Rockwell Automation Technologies, Inc. Stack assembly housing
US6625017B1 (en) 2001-02-12 2003-09-23 Special Products Company Telecommunications enclosure with individual, separated card holders
US6707670B2 (en) * 2001-09-12 2004-03-16 Dorsal Networks, Inc. Systems and methods for mounting devices
US6615997B2 (en) 2002-02-07 2003-09-09 Raytheon Company Wedgelock system
US6735086B1 (en) * 2003-05-13 2004-05-11 Raytheon Company Heat-conducting device for circuit board
US6778389B1 (en) * 2003-07-03 2004-08-17 Visteon Global Technologies, Inc. Microelectronic package with tubular housing
US6865085B1 (en) * 2003-09-26 2005-03-08 Adc Dsl Systems, Inc. Heat dissipation for electronic enclosures
DE102006022497B4 (de) * 2006-05-05 2008-02-28 Danfoss Drives A/S Zylinderförmige Baugruppe mit mindestens einem elektronischen Bauteil
US7652880B2 (en) * 2007-03-27 2010-01-26 Adc Telecommunications, Inc. Combined-natural-and-forced-convection heat sink
US8291965B2 (en) * 2007-03-27 2012-10-23 Adc Telecommunications, Inc. Heat sink with angled fins
US7515420B2 (en) * 2007-03-27 2009-04-07 Adc Telecommunications, Inc. Apparatus for transferring heat between two corner surfaces
US7457123B1 (en) * 2007-05-10 2008-11-25 Adc Telecommunications, Inc. Chassis mounted heat sink system
FR2938151B1 (fr) * 2008-11-06 2010-12-24 Arion Entpr Agencement de calculateur apte a etre realise par un empilement de modules
US8942005B2 (en) * 2009-05-21 2015-01-27 Raytheon Company Low cost, high strength electronics module for airborne object
US8547699B1 (en) * 2010-11-09 2013-10-01 Adtran, Inc. Enclosure for outside plant equipment with interconnect for mating printed circuit boards, printed circuit board device and method of repairing outside plant equipment
WO2012104017A1 (de) * 2011-02-04 2012-08-09 Sew-Eurodrive Gmbh & Co. Kg Elektrisches gerät
US10142034B2 (en) 2013-09-02 2018-11-27 Philips Lighting Holding B.V. Optically transmissive electronic device having an optically transmissive light emitting device to transmit optical signal to a second optically transmissive light receiving device through a first optically transmissive light receiving device
US20220127013A1 (en) * 2020-10-23 2022-04-28 CCX Technologies Secure avioncs wireless access point device with heat sink enclosure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1201452A (en) * 1968-02-29 1970-08-05 Telefunken Patent Verwertungsg Improvements in or relating to stacked electric circuit constructions
US4514784A (en) * 1983-04-22 1985-04-30 Cray Research, Inc. Interconnected multiple circuit module
FR2596231B1 (fr) * 1986-03-21 1993-01-29 Cit Alcatel Boitier pour circuits electroniques
US4956746A (en) * 1989-03-29 1990-09-11 Hughes Aircraft Company Stacked wafer electronic package
FR2656763A1 (fr) * 1989-12-29 1991-07-05 Cit Alcatel Boitier pour circuits electroniques immerges.
US5060115A (en) * 1990-09-28 1991-10-22 The United States Of America As Represented By The Secretary Of The Navy Heat sink device for electronics modules packaged in cylindrical casings
FR2672184B1 (fr) * 1991-01-25 1993-05-21 Degreane Ets Dispositif de fixation de moyens electroniques dans un element tubulaire.

Also Published As

Publication number Publication date
CA2101140A1 (en) 1994-02-15
TW222718B (de) 1994-04-21
JPH06169184A (ja) 1994-06-14
AU4462393A (en) 1994-02-17
IL106552A0 (en) 1994-08-26
DE69305133D1 (de) 1996-11-07
EP0584669A1 (de) 1994-03-02
AU656087B2 (en) 1995-01-19
JPH07123191B2 (ja) 1995-12-25
US5251099A (en) 1993-10-05
CA2101140C (en) 1997-01-07
EP0584669B1 (de) 1996-10-02
DE69305133T2 (de) 1997-05-07
ES2092193T3 (es) 1996-11-16

Similar Documents

Publication Publication Date Title
IL106552A (en) High density electronics package having stacked circuit boards
US5461542A (en) Multi-board electrical control device
DE3377181D1 (en) Electrical connector for interconnecting printed circuit boards
US5159537A (en) Mounting structure for electronic apparatus
US5794454A (en) Cooling device for hard to access non-coplanar circuit chips
US4354770A (en) Wedge assembly
MY108725A (en) Coaxial connector for connecting two circuit boards
CA2160242A1 (en) Three dimensional package for monolithic microwave/millimeterwave integrated circuits
EP0917189A4 (de) Verfahren zum montieren eines eingekapselten körpers auf montageplatten und optischer wandler
EP0357362A3 (de) Gehäuse für elektronische Bauteile
MY132998A (en) Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board
US5093761A (en) Circuit board device
SE8703944D0 (sv) Kompakt elektrisk kopplingsanordning
AU7036200A (en) A printed circuit board assembly
US5323295A (en) Assembly for integrating heat generating electronic device with nonheat generating devices
US5198887A (en) Semiconductor chip carrier
US5422790A (en) Computer chip mounting hardware for heat dissipation
EP1041617A4 (de) Halbleitervorrichtung und verfahren zu deren herstellung und halbleitermontagestruktur und verfahren
US5087888A (en) Light weight power amplifier assembled with no hand soldering or screws
EP0286440A3 (de) Verbinderanordnung
JPS57162453A (en) Heat radiating device
CA2031865A1 (en) High-density memory array packaging
JPS6424636A (en) Microwave converter
US5285348A (en) Circuit assembly for down converter for satellite communications
ES8404599A1 (es) Un metodo de producir una capa de un panel de un circuito impreso.

Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed
KB Patent renewed
KB Patent renewed
KB Patent renewed
KB Patent renewed
EXP Patent expired