IE822386L - Electroplating tabs of printed circuit boards - Google Patents

Electroplating tabs of printed circuit boards

Info

Publication number
IE822386L
IE822386L IE822386A IE238682A IE822386L IE 822386 L IE822386 L IE 822386L IE 822386 A IE822386 A IE 822386A IE 238682 A IE238682 A IE 238682A IE 822386 L IE822386 L IE 822386L
Authority
IE
Ireland
Prior art keywords
boards
along
path
electrolyte
tabs
Prior art date
Application number
IE822386A
Other versions
IE53960B1 (en
Original Assignee
Chemcut Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/307,687 external-priority patent/US4402799A/en
Application filed by Chemcut Corp filed Critical Chemcut Corp
Publication of IE822386L publication Critical patent/IE822386L/en
Publication of IE53960B1 publication Critical patent/IE53960B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Printed circuit boards are carried generally vertically, along a path, with the tabs at the lower end being immersed in an electrolyte. The boards are automatically conveyed through opposed serially arranged pairs of rollers, which drive them along their path. Brushes wipe the boards to prevent contact with electrolyte above the desired contact level, as they are conveyed along the path. The solution is constantly replenished and turbulence provided by delivering electrolyte solution, with insoluble metallic ions in it, by pumping the solution from a sump, through an array of nozzles along each side of the path, thus providing fresh electrolyte along with providing turbulence to the electrolyte. The nozzles are charged at a sufficiently low level to avoid their destruction. Electrical contact is made with the printed circuit boards, by means of serially engaging the boards with spring fingers of a continuous conductor along each side of the boards as they are conveyed along their path, and thereby conducting the applied charge to the immersed tabs, whereby the tabs function as cathodes for electrodeposition of metallic ions thereon. The drive for the boards is provided by means of opposed pairs of rollers. One roller in each pair is a driving roller, with the opposing roller functioning as an idler, but forming an interference fit between the rollers as the boards are carried therebetween. [US4402800A]
IE2386/82A 1981-10-02 1982-10-01 Apparatus and method of electroplating tabs of printed circuit boards and the like IE53960B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/307,687 US4402799A (en) 1981-10-02 1981-10-02 Apparatus and method of treating tabs of printed circuit boards and the like
US06/369,242 US4402800A (en) 1981-10-02 1982-04-16 Apparatus and method of treating tabs of printed circuit boards and the like

Publications (2)

Publication Number Publication Date
IE822386L true IE822386L (en) 1983-04-02
IE53960B1 IE53960B1 (en) 1989-04-26

Family

ID=26975878

Family Applications (1)

Application Number Title Priority Date Filing Date
IE2386/82A IE53960B1 (en) 1981-10-02 1982-10-01 Apparatus and method of electroplating tabs of printed circuit boards and the like

Country Status (12)

Country Link
US (1) US4402800A (en)
AT (1) AT386718B (en)
CA (1) CA1200528A (en)
CH (1) CH656284A5 (en)
DE (1) DE3235958A1 (en)
ES (1) ES516167A0 (en)
FR (1) FR2514207B1 (en)
GB (1) GB2107356B (en)
IE (1) IE53960B1 (en)
IT (1) IT1196670B (en)
NL (1) NL8203811A (en)
SE (1) SE8205616L (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4534843A (en) * 1983-01-28 1985-08-13 Technic, Inc. Apparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their like
DE3317970A1 (en) * 1983-05-13 1984-11-15 Schering AG, 1000 Berlin und 4709 Bergkamen DEVICE AND METHOD FOR GALVANIC DEPOSITION OF METALS
FR2549336B1 (en) * 1983-06-23 1986-11-21 Telmec Spa Tec Elett Mecc MACHINE FOR THE CONTINUOUS GOLDING OF LAMELLAR CONNECTORS OF PRINTED CIRCUITS, WITH A TRANSPORT GROUP WHICH CAN MAKE A TRANSLATION
DE3435335A1 (en) * 1984-09-26 1986-04-03 Relectronic GmbH, 8045 Ismaning Method for replacing the gold surface coating on plug contacts of fitted printed-circuit boards
US4576685A (en) * 1985-04-23 1986-03-18 Schering Ag Process and apparatus for plating onto articles
US4755271A (en) * 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
US5007968A (en) * 1989-07-28 1991-04-16 Chemcut Corporation Process and apparatus for treating articles of substantial thickness
US4922938A (en) * 1989-09-06 1990-05-08 Siegmund, Inc. Apparatus for single side spray processing of printed circuit boards
US4966647A (en) * 1989-09-06 1990-10-30 Siegmund, Inc. Method for single side spray processing of printed circuit boards
US5223116A (en) * 1992-05-11 1993-06-29 Siemens Aktiengesellschaft Apparatus for electrophoretic application of a lacquer onto plate-shaped work pieces
IT1256443B (en) * 1992-11-23 1995-12-05 GALVANIC PLANT WITH ELECTROLYTIC CELLS OPPOSED WITH CONTINUOUS FEEDING OF THE SURFACES TO BE TREATED
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
JP3043319B2 (en) * 1998-09-25 2000-05-22 栄電子工業株式会社 Continuous plating equipment
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
US6294060B1 (en) * 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device

Family Cites Families (40)

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Publication number Priority date Publication date Assignee Title
BE517552A (en) * 1951-05-17
GB1188206A (en) * 1967-08-22 1970-04-15 Kirkby Process & Equipment Ltd Improvements in or relating to Selective Plating Machines
US3575829A (en) * 1968-08-14 1971-04-20 Allegheny Ludlum Steel System for cleaning contact rolls in a plating tank
US3616423A (en) * 1969-02-03 1971-10-26 M & F Chemicals Inc Continuous plating system
US3933615A (en) * 1969-06-09 1976-01-20 The United States Of America As Represented By The Secretary Of The Air Force Fluid flow stripping and plating system
US3649507A (en) * 1970-07-13 1972-03-14 Omark Industries Inc Apparatus for continuous electroplating
US3746630A (en) * 1970-12-08 1973-07-17 Auric Corp Apparatus for selective electroplating of strips
US3723283A (en) * 1970-12-23 1973-03-27 Select Au Matic Selective plating system
US3799861A (en) * 1971-07-22 1974-03-26 Raptes Res Applic And Trade Es Electrical contact for equipment used in the electrolytical production of metals,particularly copper
US4015706A (en) * 1971-11-15 1977-04-05 Chemcut Corporation Connecting modules for an etching system
US3776800A (en) * 1971-12-06 1973-12-04 Chemut Corp Etching apparatus
US3865698A (en) * 1972-01-13 1975-02-11 Auric Corp Process for intermittent electroplating strips
SE357580B (en) * 1972-08-22 1973-07-02 Loennstroem Oy
US3898151A (en) * 1973-06-18 1975-08-05 Diamond Shamrock Corp Apparatus for electrocoating conductive articles including magnet means to convey the articles
US4132617A (en) * 1973-10-04 1979-01-02 Galentan, A.G. Apparatus for continuous application of strip-, ribbon- or patch-shaped coatings to a metal tape
US3996127A (en) * 1973-10-17 1976-12-07 Outokumpu Oy Device for detaching an electrolytically precipitated metal sheet from a cathode
US4064019A (en) * 1974-09-03 1977-12-20 Dixie Plating, Inc. Continuous contact plater method
US3966581A (en) * 1974-10-16 1976-06-29 Auric Corporation Selective plating apparatus
DE2460634C3 (en) * 1974-12-20 1980-02-21 Siemens Ag, 1000 Berlin Und 8000 Muenchen Electroplating device for the partial metallization of continuously moving goods
US3951761A (en) * 1975-01-31 1976-04-20 Bunker Ramo Corporation Method and apparatus for electro-plating strip contacts
US3982321A (en) * 1975-03-24 1976-09-28 Inter-Lakes Engineering Co. Machine and process for assembling cathodes
US3970540A (en) * 1975-03-26 1976-07-20 The Mitchell-Bate Company Clamping device for use in electroplating
CH610937A5 (en) * 1975-06-10 1979-05-15 Zbinden & Co
US4003805A (en) * 1975-10-20 1977-01-18 Uop Inc. System for electroplating a sequence of moving plate members
US4093520A (en) * 1976-02-17 1978-06-06 Bell Telephone Laboratories, Incorporated Process for gold plating
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GB1544951A (en) * 1976-03-23 1979-04-25 Electroplating Engs Of Ja Ltd Device for plating a selected portion of opposite side surfaces of a sheet-like article
US4029564A (en) * 1976-03-26 1977-06-14 Electroplating Engineers Of Japan, Limited High speed plating device for rectangular sheets
US4124454A (en) * 1976-10-04 1978-11-07 Shang Wai K Electrolytic treatment of metal sheet
US4162952A (en) * 1977-02-24 1979-07-31 Societe Anonyme dite: F.M.C. Apparatus for electrolysis by projection
FR2390517A1 (en) * 1977-05-10 1978-12-08 Coppertron Sa INSTALLATION FOR THE ELECTRO-PRODUCTION OF COPPER IN SHEETS INTENDED TO BE APPLIED IN PARTICULAR TO DIELECTRIC MATERIALS
US4145267A (en) * 1977-09-06 1979-03-20 National Steel Corporation Nonplating cathode and method for producing same
US4155815A (en) * 1978-04-03 1979-05-22 Francis William L Method of continuous electroplating and continuous electroplating machine for printed circuit board terminals
US4186062A (en) * 1978-07-13 1980-01-29 Micro-Plate, Inc. Continuous tab plater and method
US4162955A (en) * 1978-10-10 1979-07-31 Midland-Ross Corporation Electrodeposition coating apparatus
DE2856460C3 (en) * 1978-12-28 1982-02-11 Gebr. Schmid GmbH & Co, 7290 Freudenstadt Device for applying a layer of solder to a printed circuit board
US4236990A (en) * 1979-05-29 1980-12-02 King Arthur S Treater with self-cleaning electrodes
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US4244833A (en) * 1979-11-15 1981-01-13 Oxy Metal Industries Corporation Composition and process for chemically stripping metallic deposits
DE3001726C2 (en) * 1980-01-18 1984-08-09 Gebr. Schmid GmbH & Co, 7290 Freudenstadt Device for treating a printed circuit board

Also Published As

Publication number Publication date
ES8400648A1 (en) 1983-10-16
IE53960B1 (en) 1989-04-26
SE8205616D0 (en) 1982-10-01
FR2514207A1 (en) 1983-04-08
IT1196670B (en) 1988-11-25
SE8205616L (en) 1983-04-03
AT386718B (en) 1988-10-10
US4402800A (en) 1983-09-06
DE3235958C2 (en) 1992-06-25
FR2514207B1 (en) 1987-01-30
IT8268144A0 (en) 1982-09-29
ES516167A0 (en) 1983-10-16
NL8203811A (en) 1983-05-02
CH656284A5 (en) 1986-06-13
GB2107356A (en) 1983-04-27
GB2107356B (en) 1985-05-22
CA1200528A (en) 1986-02-11
ATA364782A (en) 1988-02-15
DE3235958A1 (en) 1983-05-05

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Legal Events

Date Code Title Description
MM4A Patent lapsed