HUP0001984A2 - Copper-base contact material, contact stud and method for producing contact stud - Google Patents
Copper-base contact material, contact stud and method for producing contact studInfo
- Publication number
- HUP0001984A2 HUP0001984A2 HU0001984A HUP0001984A HUP0001984A2 HU P0001984 A2 HUP0001984 A2 HU P0001984A2 HU 0001984 A HU0001984 A HU 0001984A HU P0001984 A HUP0001984 A HU P0001984A HU P0001984 A2 HUP0001984 A2 HU P0001984A2
- Authority
- HU
- Hungary
- Prior art keywords
- copper
- contact
- graphite
- cadmium
- chromium
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 4
- 229910052802 copper Inorganic materials 0.000 abstract 4
- 239000010949 copper Substances 0.000 abstract 4
- 229910002804 graphite Inorganic materials 0.000 abstract 4
- 239000010439 graphite Substances 0.000 abstract 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052793 cadmium Inorganic materials 0.000 abstract 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 abstract 3
- 229910052804 chromium Inorganic materials 0.000 abstract 3
- 239000011651 chromium Substances 0.000 abstract 3
- 101100536354 Drosophila melanogaster tant gene Proteins 0.000 abstract 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 abstract 2
- 229910052738 indium Inorganic materials 0.000 abstract 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 238000004663 powder metallurgy Methods 0.000 abstract 2
- 229910052726 zirconium Inorganic materials 0.000 abstract 2
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 abstract 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 abstract 1
- 235000014510 cooky Nutrition 0.000 abstract 1
- 150000001879 copper Chemical class 0.000 abstract 1
- 239000008187 granular material Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0425—Copper-based alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/025—Composite material having copper as the basic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/027—Composite material containing carbon particles or fibres
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Contacts (AREA)
- Powder Metallurgy (AREA)
Abstract
A tal lm ny rézalapú érintkezőanyag, amely grafitot, kadmiumot éskrómot tartalmaz, és "sszetétele tartalmazza az al bbi anyagokat az albbi ar nyban grafit 0,5-5,0 kadmium 0,1-0,5 króm 0,2-0,5 cirkónium0,2-0,5 indium 0,1-0,3 tant l 0,05-0,2 A tal lm ny tov bb érintkezőpog csa a fenti rézalapú érintkező-anyagból, porkoh szati úton előllítva. A tal lm ny tov bb elj r s érintkező pog csa elő llít s ra,porkoh szati úton, amely elj r s sor n rézen kívül legal bb az al bbi"sszetevőket tartalmazó rézalapú érintkezőfémet llítanak elő: grafit0,5-5,0 kadmium 0,1-0,5 króm 0,2-0,5 cirkónium 0,2-0,5 indium 0,1-0,3tant l 0,05-0,2 %, úgy, hogy az "sszetevőkből 50 mikron vagy ann lkisebb szemcseméretű granul tumot llítanak elő és "sszekeverik, akeverékből jellemzően 0,4 gigaPascal fajlagos nyom ssal pog cs tsajtolnak, a pog cs t 1223<10 °K hőmérsékleten, v kuumban, alumínium-oxid szór sban, grafit és kadmium-oxid hozz ad s val "sszesütik, az"sszesült pog cs kat ut nsajtolj k, majd 723<10 °K hőmérsékletenkiégetik. ÓThis copper-based contact material contains graphite, cadmium and chromium, and its composition contains the following materials in the following amounts: graphite 0.5-5.0 cadmium 0.1-0.5 chromium 0.2-0.5 zirconium 0.2-0.5 indium 0.1-0.3 tant l 0.05-0.2 The contact button below is made of the above copper-based contact material, produced by powder metallurgy. The first contact pad is prepared by powder metallurgy, which, in addition to the first row of copper, contains at least the following copper-based contact metal: graphite 0.5-5.0 cadmium 0.1-0.5 chromium 0.2-0.5 zirconium 0.2-0.5 indium 0.1-0.3 tan l 0.05-0.2 %, so that granules with a particle size of 50 microns or less are produced from the they are "mixed, from which a mixture is typically pressed into a cake with a specific pressure of 0.4 gigaPascal, the cake is pressed at a temperature of 1223<10 °K, in water rubber, aluminum oxide powder, graphite and cadmium oxide are added and it is "baked, that" the dried cookies are pressed, then fired at a temperature of 723<10 °K. HE
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| HU0001984A HUP0001984A3 (en) | 2000-05-23 | 2000-05-23 | Copper-base contact material, contact stud and method for producing contact stud |
| PCT/HU2001/000059 WO2001090428A1 (en) | 2000-05-23 | 2001-05-23 | Copper-based contact material, contact slug and procedure for making the contact slug |
| AU2001274349A AU2001274349A1 (en) | 2000-05-23 | 2001-05-23 | Copper-based contact material, contact slug and procedure for making the contactslug |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| HU0001984A HUP0001984A3 (en) | 2000-05-23 | 2000-05-23 | Copper-base contact material, contact stud and method for producing contact stud |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| HU0001984D0 HU0001984D0 (en) | 2000-07-28 |
| HUP0001984A2 true HUP0001984A2 (en) | 2002-04-29 |
| HUP0001984A3 HUP0001984A3 (en) | 2002-05-28 |
Family
ID=89978345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HU0001984A HUP0001984A3 (en) | 2000-05-23 | 2000-05-23 | Copper-base contact material, contact stud and method for producing contact stud |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU2001274349A1 (en) |
| HU (1) | HUP0001984A3 (en) |
| WO (1) | WO2001090428A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111575527A (en) * | 2020-05-29 | 2020-08-25 | 河北工业大学 | Preparation method of composite contact material for high-breaking low-voltage electric appliance |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114480899B (en) * | 2021-12-15 | 2022-12-06 | 深圳先进技术研究院 | Rare earth modified graphene copper-based composite material and preparation method and application thereof |
| CN117127047B (en) * | 2023-10-26 | 2024-01-05 | 烟台金晖铜业有限公司 | Contact line preparation method based on hot-pressed sintered alloy |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3116680A1 (en) * | 1981-04-27 | 1982-11-18 | Siemens AG, 1000 Berlin und 8000 München | CONTACT MATERIAL FROM A COPPER ALLOY AND METHOD FOR THE PRODUCTION THEREOF |
| US4517033A (en) * | 1982-11-01 | 1985-05-14 | Mitsubishi Denki Kabushiki Kaisha | Contact material for vacuum circuit breaker |
| RU2038400C1 (en) * | 1992-09-21 | 1995-06-27 | Семен Ильич Цукерман | Copper-based composite material for electrical contacts |
-
2000
- 2000-05-23 HU HU0001984A patent/HUP0001984A3/en unknown
-
2001
- 2001-05-23 WO PCT/HU2001/000059 patent/WO2001090428A1/en active Application Filing
- 2001-05-23 AU AU2001274349A patent/AU2001274349A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111575527A (en) * | 2020-05-29 | 2020-08-25 | 河北工业大学 | Preparation method of composite contact material for high-breaking low-voltage electric appliance |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2001274349A1 (en) | 2001-12-03 |
| WO2001090428A1 (en) | 2001-11-29 |
| HU0001984D0 (en) | 2000-07-28 |
| HUP0001984A3 (en) | 2002-05-28 |
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