HUE034630T2 - Method for producing a substrate and substrate, in particular for a package - Google Patents

Description

METHOD FOR PRODUCING A SUBSTRATE AND SUBSTRATE, IN PARTICULAR FOR A PACKAGE

Description

The invention relates to a method for producing a substrate with electric and/or magnetic conducting paths, a corresponding substrate as well as a packing from such a substrate. it is known from the prior art to provide different base materials from the packing area with electric or magnetic conductive paths. For example, it is known from DE. 633677 A to apply an electrically conductive material to a base material; by templating, pre-printing, embossing or cutting lettering methods. Such substrates are also referred to as circuit boards. Alternatively or additionally, magnetic materials are applied to a base material to generate corresponding magnetic conducting paths. Thereby, substrates for packings can for example be provided with magneticaliy closabie flaps. Therein, the application of the magnetic conducting paths to the base material is usually effected by adhering permanent magnets. From WO 2011/145121 Ä1, a box of cardboard is known, in which passage openings are introduced into the cardboard material. In order to provide a magnetic closure, at least one magnet and/or a magnetic metal are disposed on the opposing sides of the passage openings. From WO 2010/138046 A1, a paper containing packing material is known, which can be provided with magnetizable paths and magnetic markers.

In the known methods, the circumstance is to be regarded as disadvantageous that they are comparatively expensive and can only poorly be adapted to different base materials and different path geometries.

It is the object of the present invention to provide a method, by means of which substrates of different base materials can be provided with electric and/or magnetic paths in fast, variable and inexpensive manner. Further objects of the invention are in providing a corresponding substrate with at !east one electric and/or magnetic path as well as a packing from such a substrate.

According to the invention, the objects are solved by a method according to daim 1, a substrate according to claim 10 as well as by a packing according to claim 13. Advantageous configurations with convenient developments of the invention are specified in the respective dependent claims, wherein advantageous configurations of the method are to be regarded as advantageous configurations of the substrate and the packing, respectively, and vice versa. A first aspect of the invention relates to a method for producing a substrate, in particular for a packing. Therein, according to the invention, the method includes the steps of providing a base material, generating at feast one recess in the base matériái by means of at least one separating method from the group of laser cutting and milling, and filling the at least one recess with an electrically conductive and/or magnetic material at least in certain areas, in other words, in contrast to the prior art, it is provided that at least one recess is introduced into the base material by laser cutting and/or milling, that is by thermally separating by means of a laser and/or by machining the provided base materia! by means of a milling tool, and this recess is subsequently filled with an electrically conductive and/or magnetic material at least in certain areas to produce a substrate with at least one electric and/or magnetic conducting path, in this manner, base materials of very different substances can be provided with geometrically nearly arbitrary electric and/or magnetic conducting paths in fast, precise and inexpensive manner. Within the scope of the invention, materials are in particular understood by an electrically conductive material, which have conductivity of at feast 0.1 S/m or more at 25 °C. Within the scope of the invention, ferro- and ferrimagnetic, that is permanent magnetic materials as well as permanent magnetic particles in a support matériái are understood by a magnetic material. Electrically insulating and non-permanent magnetic materials, respectively, are used as the base material. Therein, the base material is selected from a group including paper, cardboard, paperboard, wood, plastic, composite materials, in particular GFK, and laminates, in particular iaminated cardboard. Hereby , the characteristics of the substrate can be optimally adapted to its iater purpose of employment, in particular, the substrate according to the invention is thereby suitable for producing packings and blanks for packings, respectively. In addition, it is provided that the electrically conductive and/or magnetic material is filled into the at least one recess by means of a doctor blade and/or by means of a printing method, in particular a screen printing method, a flexographic printing method, an offset printing method or a gravure printing method. Hereby, large-area base materials can also be fast and precisely provided with the electrically conductive and/or magnetic material·

In an advantageous configuration of the invention, it is provided that the at least one recess is formed groove shaped at least in certain areas and/or is formed continuously passing through the base material at least in certain areas to form a passage channel extending between a front side and a rear side of the base material. Hereby, recesses can be produced, which optionally allow electric and magnetic contacts, respectively, on the same side of the base material or electric and magnetic connections, respectively, on the other side of the base material.

The passage channel or channels can additionally be used for inserting one or more electrical elements, whereby they can be positioned and optionally secured in position and contacted, respectively, on the substrate.

Further advantages arise by producing a through-contact between the front side and the rear side of the base material by filling the passage channel with the electrically conductive material and/or by filling the passage channel with the magnetic material. Thereby, the substrate can be provided with vertical electric and magnetic connections (vertical Interconnect access, VIA), respectively, between different sides or conducting path planes of the base material such that the substrate can be formed as a two-side circuit board or as a multi-layer plate with multiple layers. Therein, the passage channel basically does not have to be completely filled up as long as a through-contact is ensured. The through-contact can additionally serve as a land for wired components (through hole) or for improving the vertical thermal conduction (thermal vias).

Ih a further advantageous configuration of the invention, it is provided that at least one channel is formed at least in certain areas besides the recess. This additional channel serves as a type of non-conducting barrier, whereby false contacts and short circuits are for exampie particularly reliably avoided. In addition, the channel lateral to the recess can provide a type of "overflow pool" for excess or imprecisely applied electric and magnetic material, respectively, whereby false contacts and short circuits are in turn particularly reliably avoided, Preferably, channels are formed on both sides of the recess to form the non-conducting barrier or to trap "overflow" in both directions. The channel or the channels is or are preferably formed extending paraliei to the recess at ieast in certain areas. The at least one channel can basically have a lower cross-sectional area than the recess. Preferably* the at least one channel should be spaced from the recess only as far as It can reliably fulfill its function as a non-conducting barrier or as an "overflow pool" depending on the respective method parameters. Basically, the at least one channel can be generated together with the at ieast one recess and/or with the aid of the same separating processing method in the base material* However, it can basically aiso be provided that the at least one channel is introduced into the base material by another processing method, for exampie by punching or grooving.

In a further advantageous configuration of the invention, the base material is coated with a varnish at least in certain areas before and/or after generating the at least one recess. Hereby, a protective layer can be produced, by which the base matériái is locally protected from undesired damages or impairments during certain method steps. Furthermore, the varnish or protective layer can for example also function as a mask while performing further method steps. Therein, before generating the at least one recess, a so-called drip-off varnish is preferably applied to the base material, which ensures In later filling the at least one recess that the electric and magnetic material, respectively, drips off thus does not adhere, on the coated surface areas of the base material outside of the subsequently generated recess. Thereby, excess material or materia! applied outside of the at least one recess can be particularly simply removed from the substrate. Alternatively or additionally, it can be provided that a varnish is applied to the base material after generating the at least one recess or after tilling the at ieast one recess. Herein, in particular a protective varnish, for example baaed on epoxy resin, varnishes based on water, UV varnishes or oil print varnishes, can be provided: as the varnish to cover the recess and the conducting paths, respectively, and to protect them from environmental influences. However* alternatively or additionally, other varnishes such as for instance color varnishes are of course also conceivable. There is also the possibility that suitable laminate foils are applied. Therein, the varnish or the laminate foil can basically be applied to the entire surface or only to certain areas of the base material. However, the varnish or the laminate foil is preferably applied at least in the area of the recess to prevent adherence of the electric and magnetic material, respectively, outside of the recess to the surface of the base material in case of the drip-off varnish and to fulfill the desired protective function for the conducting path in case of the protective varnish, respectively. It is understood that multiple varnish layers or layers of different varnishes can optionally also be provided. In a further advantageous configuration of the invention, it is provided that at least the channel already described above is formed at least in certain areas besides the recess after application of the protective varnish or the laminate foi! and/or after filling the at least one recess with an electrically conductive and/or magnetic material at least in certain areas. This additional channel in turn serves as a type of non-conducting barrier, whereby false contacts and short circuits are for example particularly reliably avoided. Preferably, such channels are formed on both sides of the recess to form the non-conducting barrier. The channel or the channels are in turn preferably formed extending parallel to the recess at least in certain areas. The at least one channel can in turn basically have a lower cross-sectional area than the recess.

In a further advantageous configuration of the invention, the base material if provided with a contact surface, for example with a soldering surface, wherein the contact surface is preferably electrically conductively connected to the electrically conductive material. This allows connecting the contact surface to the electric conducting path in electrically conducting manner in the same method step or at a later point of time and providing terminal or contact points for further components in particularly simple manner.

Further advantages arise by fliling the at least one recess with a liquefied electrically conductive and/or magnetic material and subsequently curing the liquefied material. This represents a particularly fast, simple and inexpensive possibility of filling the at least one recess and of producing one or more electric and/or magnetic conducting paths.

In order to be able to supply the substrate not only with at least one conducting path, but also integrally with the energy required for operating an electric circuit at the same time, it has proven advantageous in further configuration of the invention if at least one haif ceil and/or at least one battery, in particular a film battery, is applied, in particular printed, to the base matériái and/or coated into the at ieast one recess. Within the scope of the present invention, not only a rechargeabie primary ceil, but also an accumulator, thus a rechargeable storage for electric energy on electrochemical basis, is understood by a battery. In particular, so-called thin-fiim or thin-layer batteries are suitable as printable batteries. Such batteries or the haif cells thereof are composed of different layers, which usually have the layer sequence of substrate ^ current collector - anode -eiectrolyte/separator - cathode - current collector - substrate. Therein, the base material preferably functions as the substrate. Due to the variable form factor, the low thickness, the resiliency and the flexibility with regard to construction and eiectrlc voilage of the half cell or battery, the possibilities of employment are diverse. In particular, printed batteries are suitable for producing substrates for intelligent packings in logistics and for packing materials with incorporated eiectric or electronic functions such as for instance optic, acoustic and/or haptic effects, sensor technology, cordless capture and forwarding of data etc. Therein, it can be provided that half cells associated with each other are generated on areas of the substrate spaced from each other such that they are disposed on corresponding flaps, folding surfaces or the like ín fater use of the substrate as a packing material. In completing a packing, the haif celis are then brought into contact with each other by folding the flaps onto each other and complement each other to the primary and secondary cell, respectively, whereby components of the packing can be integrally supplied with electric energy. ín a further advantageous configuration of the invention, it is provided that the method is performed inline on a printing machine and/or offline. The method can also be performed offline on a coating machine using a coating method. Hereby, the method can be particularly fast, simply and variably performed depending on the substrate respectively to be produced. A second aspect of the invention relates to a substrate, in particular for a packing. According to the invention, the substrate includes a base material, into which at least one recess is introduced by means of at ieast one separating method from the group of laser cutting and milling and is filled with an electrically conducive and/or magnetic material at least in certain areas. Hereby, substrates of different base materials with electric and/or magnetic paths can be fast, variably and inexpensively provided. Therein, the base material is selected from a group including paper, cardboard, paperboard, wood, plastic, composite materials, in particular GFK, and laminates, in particular laminated cardboard. Hereby, the characteristics of the substrate can be optimally adapted to its later purpose of employment. Thereby, the substrate according to the invention is in particular suitable for producing packings. In addition, it is provided that the electrically conductive and/or magnetic material is filled into the at least one recess by means of a doctor blade and/or by means of a printing method, in particular a screen printing method, a flexographic printing method, an offset printing method or a gravure printing method. Hereby, large-area base materials can also be fast and precisely provided with the electrically conductive and/or magnetic material,

Further resulting features and the advantages thereof are apparent from the descriptions of the first inventive aspect, wherein advantageous configurations of the first inventive aspect are to be regarded as advantageous configurations of the second inventive aspect and vice versa.

Further advantages arise if the at ieast one recess has a depth of at least 10 pm and/or of at most 650 pm and/or a width of at least 0,1 mm and/or of at most 30 cm at least in certain areas. Thereby, the at ieast one recess preferably has a depth of 10 pm, 20 pm, 30 pm, 40 pm, 50 pm, 60 pm, 70 pm, 80 pm, 90 pm, 100 pm, 110 pm, 120 pm, 130 pm, 140 pm, 150 pm, 160 pm, 170 pm, 180 pm, 190 pm, 200 pm, 210 pm, 220 pm, 230 pm, 240 pm, 250 pm, 260 pm, 270 pm, 280 pm, 290 pm, 300 pm, 310 pm, 320 pm, 330 pm, 340 pm, 350 pm, 360 pm, 370 pm, 380 pm, 390 pm, 400 pm, 410 pm, 420 pm, 430 pm, 440 pm, 450 pm, 460 pm, 470 pm, 480 pm, 490 pm, 000 pm, 510 pm, 520 pm, 530 pm, 540 pm, 550 pm, 560 pm, 570 pm, 580 pm, 590 pm, 600 pm, 610 pm, 620 pm, 630 pm, 640 pm or 650 pm at bast in certain areas or in continuous manner, wherein corresponding intermediate values such as for example 600 pm, 601 pm, 602 pm, 603 pm, 604 pm, 605 pm, 606 pm, 607 pm, 608 pm, 609 pm and 610 pm are to be regarded as also disclosed. Alternatively or additionally, the at least one recess has a width of 0.1 mm, 0.5 mm, 1 mm, 5 mm, 10 mm, 20 mm, 30 mm, 40 mm. 50 mm, 60 mm, 70 mm, 80 mm, 90 mm, 100 mm, 110 mm, 120 mm, 130 mm, 140 mm, 150 mm, 160 mm, 170 mm, 180 mm, 190 mm, 200 mm, 210 mm, 220 mm, 230 mm, 240 mm, 250 mm, 260 mm, 270 mm, 280 mm, 290 mm or 300 mm, wherein corresponding intermediate values such as for example 10 mm, 11 mill, 12 mm, 13 mm, 14 mm, 15 mm, 16 mm, 17 mm, 18 mm, 19 mm and 20 mm are to be regarded as also disclosed. Hereby, the required electric line cross-section and the desired magnetic field strength, respectively, can be optimally adapted to tie respective purpose of use of the substrate.

Further advantages arise in that at least one active and/or passive electric component is disposed on the base material and/or that at least two half cells of a battery are applied to areas of the base material spaced from each other, In other words, it is provided that the substrate is fitted with one or more active components, which exhibit an amplifier effect of the useful signal or allow control. Examples for this are diodes, transistors, opto-couplers or relays. Alternatively or additionally, the substrate Is fitted with one or more passive components, that is with components, which do not exhibit an amplifier effect and do not have a control function. Examples for this are resistors, capacitors, inductances and memristors, An electric component as a unit can be composed of multiple electric components in the individual case. An example is solar panels and solar modules, respectively, or electronic data storage elements like EPROMs, EEPROMs or flash EEPROMs or the like. Further electric components, with which the substrate can be fitted individuaily and in any combination, include electron tubes, SMDs and integrated circuits (SC). A third aspect of the invention relates to a packing, including at least one substrate, which is obtainable and/or obtained by means of a method according to the first inventive aspect and/or formed according to the second inventive aspect. Hereby, packings can be provided in simple, variable and inexpensive manner, which include substrates or are composed of substrates, which comprise different base materials with electric and/or magnetic paths. Further resulting features and the advantages thereof are apparent from the descriptions of the first inventive aspect, wherein advantageous configurations of the first inventive aspect are to be regarded as advantageous configurations of the second inventive aspect and vice versa,

Further features of the invention are apparent from the claims, the embodiment as well as based on the drawings. The features and feature combinations mentioned above in the description as weil as the features and feature combinations mentioned below in the embodiment are usable not only in the respectively specified combination, but aiso in other combinations, without departing from the scope of the invention. There shows;

Fig 1 a schematically illustiâted side view of an embodiment of a peeking according to the invention;

Fig. 2 a schematically illustrated side view of the packing according to Fig, I lh opened state;

Fig. 3 a schematic representation of a substrate used for producing the packing; and

Fig. 4 a schematic detailed view of a wall element of the packing.

The figure 1 shows a schematically illustrated side view of a packing 10 for storing goods in the closed state. Therein, the packing 10 shown in the embodiment in particular serves for storing rod-shaped goods like cigarettes and the like.

However, it is to be emphasized that the principle according to the invention is also applicable to other packings 10. The packing 10 and the substrate 60 used for its production and explained in more detaii in connection with Fig, 3 comprises a base matériái of cardboard, paper or plastic, wherein other suitable materiais are basically aiso conceivable.

One recognizes that the packing 10 comprises a front wall 12 and a rear waif 14, side walls 16, 16 connecting the front and rear walls 12, 14 as well as a bottom wail 20 for forming a container-iike receiving area 24. In addition, the packing 10 includes a closure 22 for closing the receiving area 24, wherein the closure 22 is composed of two closure caps 26, 28. Therein, the first closure cap 26 is hinged to the front wail 12 and the second closure cap 28 is hinged to the rear wall 14 via corresponding bending lines 30, 32 in an upper end of the receiving area 24 open to the top (aiso compare to Fig. 2). in addition, one recognizes that the packing 10 is formed in the shape of a prismatic body along its longitudinal axis. In the illustrated embodiment, the packing 10 is cuboid-shaped formed. However, other-shapes are also conceivable.

On the inner side of the closure caps 28, 28, the packing 10 includes grooveshaped recesses 190, which are symbolized by dashed lines in Fig, 1, The recesses 190 are introduced into the base matériái by laser cutting. Alternatively, the recesses 190 can also be generated by milling. The recesses 190 are filled with a magnetic material and thereby form a type of magnetic conducting paths. One recognizes that the filled recesses 190 are disposed adjacent to each other with closed packing 10 and thereby function as a magnetic closure. By the attraction of the two magnetic conducting paths, the packing 10 reliably remains closed.

Figure 2 shows a schematically illustrated side view of the packing 10 according to figure 1 in opened state. One recognizes that the two closure caps 26, 28 can be individually or collectively opened, wherein the magnetic force of the filled recesses 190 or of the magnetic conducting paths has to he overcome, in the illustrated embodiment of the packing 10, the side walls 16.18 are formed conically in the end of the receiving area 24 open to the top. The two closure caps 28, 28 comprise corresponding bevels in this area, in addition, it becomes clear that the side walis 18,18 of the receiving area 24 with the corresponding wall elements of the first and the second closure cap 26. 28 are separated from each other via corresponding cutting lines. However, it is aiso possible that perforation lines are formed in this area. in addition, the packing 10 comprises a basically optional inner collar 138 capable of being introduced into the receiving area 24 with overa!! four locking means 138, 140 (locking means 142, 144 not visible in figure 2} for locking the first and the second closure cap 26, 28 to the inner collar 136. One recognizes that the inner collar 136 is formed circumferentially in the receiving area 24, In the illustrated embodiment, the inner collar 136 is additionally integrally formed. However, due to the closure effect of the two magnetic conducting paths, this locking can also be omitted. In the area of the front wall 12 and the rear wail 14, an engaging trough 146 is additionally respectively formed.

Figure 3 shows a schematic representation of the substrate 80 used for producing the packing 10 according to figures 1 and 2. The substrate 60 can basicaily aiso be referred to as blank, in addition, a basically optional blank of the inner collar 136 is illustrated.

Therein, the substrate 60 includes wall and bottom elements 20, 34, 36, 60, 52, 54, 58 connected via bending lines 102, 104,106, 108,. 110, 112 for forming the container-like receiving area 24 in the folded state of the substrate 60. Therein, the front wail element 34 of the receiving area 24 is connected to a front wall element 38 of the first closure cap 28, the rear wall 36 of the receiving area 24 is connected to a rear wall 40 of the second closure cap 28 via bending lines 30, 32, The rear wall 36 includes multiple recesses 190 filled with electrically conductive material in an area indicated by the reference character IV as well as a film battery 192 and will be explained in more detail in connection with Fig. 4.

The front wail element 38 is connected to side walls 72. 74,78 via further bending lines 114, 122, 124 for forming the closure cap 26 in the folded state of the substrate 80 and the rear wail 40 is connected to side wails 58, 60, 70 via further bending lines 118,130,132 for forming the second closure cap 28 in the folded state of the substrate 60.

The side walls 54, 58, which are connected to the rear wall 36 via the bending lines 110, 112, additionally comprise adhesive fiaps 90, 52 for connection to the bottom waii 20 and for forming the container-like receiving area 24 in the foided state of the substrate 60.

The side walls 72, 74 of the first closure cap 28 and the side walls 58, 60 of the second closure cap 28 also comprise corresponding adhesive fiaps 94, 98, 88, 100 for adhering to the upper lid wails 70, 78. The lid walls 70, 76 are additionally connected to reinforcing elements 78, 84 via bending lines 116, 120, which abut on the respective inner sides of the iid wails 70, 78 in the foided state of the substrate 80. One recognizes that the recesses 190 filled with the magnetic material are introduced into the reinforcing elements 78, 84 by laser cutting or laser grooving. However, alternative arrangements are also conceivable as long as the magnetic conducting paths can function as a magnetic closure in the closed state of the packing 10.

The side walls 72, 74, 56, 80 of the first and the second closure cap 28, 28 also abut on the respective inner sides of the iid walls 70, 78 in the folded state of the substrate 80. Here, reinforcing elements 86, 88, 80, 82 are respectiveiy disposed via bending lines 126, 128,134, 136, which abut on the respective inner sides of the side walls 72, 74, 58, 80 in the folded state of the closure caps 28, 28.

Furthermore, one recognizes that the side walls 50, 52, 54, 56 of the receiving area 24 with the corresponding waii elements 58, 60, 72, 74 of the first and the second closure cap 26, 28 are separated from each other via corresponding cutting lines. However, it is also possible that perforation lines are formed in this area instead of cutting lines. In addition, it becomes clear that the side wails 50, 52, 54, 56 of the receiving area 24 are formed conically in areas abutting on the wall elements 58, 80, 72, 74 of the first and the second closure cap 28, 28, wherein the corresponding areas of the wall elements 58, 60, 72, 74 adjoining to the conical areas comprise a corresponding bevel.

The optional inner collar 136 is integrally formed and comprises two engaging flaps 148 for engaging with the container-like receiving area 24 of the foided packing 10. Engaging troughs 146 are formed opposing the engaging flaps 148. The engaging flaps 148 are connected to side walls 150, 152 as well as an adhesive flap 158 via bending lines 154, In the földed state of the inner collar 138, the adhesive flap 158 abuts on the inner side of the side wali 152, Furthermore, one recognizes that four locking means 138,140,142,144 in total are formed in the inner collar 136 by means of corresponding cutting lines.

Fig. 4 shows a schematic detailed view of the wall element 38 of the packing. One recognizes that numerous recesses 190 of different geometry are introduced into the base material by laser cutting and filled with electrically conductive material, whereby corresponding electric conducting paths are formed. Therein, the laser used for generating the recesses 190 can basically be the same or different than that used for producing the contour of the substrate 80 and for producing the groove or bending lines 116. 114, 30,102, 104, 32, 118,120 of the blank, respectively. Thus, the wall element 38 allows the mechanical attachment and electrical connection of active and/or passive electronic components, Therefore, the substrate 80 functions as a type of conductor or cardboard board in the area of its wail element 36, whereby the packing 10 can be provided with different additional functions. For example, the packing 10 can be formed as a so-called intelligent packing for logistic purposes. Similarly, it can be provided that the packing 10 is provided with optic, acoustic and/or haptic effects. The integration of sensors as well as the cordless capture and forwarding of data is also conceivable. For example, the packing 10 can communicate with a mobile phone, tablet or the like via Bluetooth or another suitable transmission path to be able to provide information about the packing t Ö, the content of the packing 10, the manufacturer etc. to a consumer.

Basically, conventional electronic components can be passed through the passage channels illustrated in Fig. 4, oniy some of which are exempiarily provided with the reference character 194, and connected to the conducting paths (so-cal!ed through-contact). However, alternatively or additionally, so-called surface-mounted components (surface-mounted device, SMDs) can also be used, in which through-contacts and passage channels, respectively, 194 are not required. The passage channels are formed together with the groove-shaped recesses 190 by generating corresponding passage openings in the base material by means of the laser beam or by milling and subsequently at least partially filling them with the electrically conductive material. Basically, it can also be provided that a passage channel 194 is first completely filled with electrically and/or magnetically conductive material and subsequently a passage opening is again introduced into the material to form a new passage channei 194 with iower diameter. Alternatively, ail or some of the passage channels 194 can be formed as so-called "thermal vias" to improve the thermal transport perpendicular to the substrate 60.

Before introducing the recesses 190, the base material can be coated with a so-called drip-off varnish at least in the area of the wail element 38, After generating the recesses 190 by laser cutting, the electrically conductive material can then be introduced into the recesses 190 by a doctor blade or by a screen printing method, a flexographic printing method, an offset printing method or a gravure printing method. Excess material does not adhere to the surface of the base material due to the drip-off varnish and can be simply removed again. The production and filling of the recesses 190 can thereby be advantageously performed Inline on a printing machine. Alternatively or additionally, channels preferably extending parallel can be formed lateral to the recesses 190, which function as a type of non-conducting barrier or as a type of '’overflow poo!" for excess material, whereby false contacts and short circuits are also avoided. The channei or channels can basically have a lower cross-sectional area than the associated recess(es) 190.

Furthermore, one recognizes in Fig. 4 that a film battery 192 is printed onto the base materia! and connected to the electric conducting paths, In the shown example, the film battery 192 comprises the layer sequence of base material current collector, Zn anode, electrolyte/separaior, MnQ? cathode, current collector, cover layer. However, other layer sequences can basically also be provided. Similarly, it can be provided that the two half ceils of the battery 192 are applied to spatially separated areas of the substrate 80 and are disposed on each other only in folding the substrate 60 or in producing the packing 10 from the biank and complement each other to the battery 1S2.

The parameter values indicated in the documents for the definition of process and measurement conditions for the characterization of specific characteristics of the inventive subject matter are to be considered as encompassed by the scope of the invention also within the scope of deviations -for example due to measurement errors, system errors, weighing errors, DIN tolerances and the like.

Claims (13)

PROCEDURE FOR PURCHASING MANUFACTURER AND PURPOSE OF PARTICULAR PACKAGING; L A method for producing a carrier (60), in particular for packaging <1θ, comprising the steps of: - providing a base material wherein the base material is selected from a group; containing paper, cardboard, paper, wood, plastic, composite material, in particular glass fiber reinforced plastic and laminated material, in particular laminated cardboard; providing at least one recess (190) in the base material by at least one material separation process, from the laser cutting and milling group; and filling the at least one recess (190) at least partially with an electrically conductive and / or magnetic material, wherein the electrically conductive and / or magnetic material is applied to the at least one recess by means of crimping and / or printing, in particular by screen printing, flexo printing, printing of a set or printing. (190). A method according to claim L, characterized in that the at least one recess (190) is formed as a groove at least at intervals and / or at least one section is formed on the base material in its sleeves, and thus a passage channel extending between the front side and the back side of the base material ( 194). Method according to claim 2, characterized in that a passage between the front side and the rear side of the base material is created by filling the passage channel (194) with an electrically conductive material and / or filled with magnetic material through the passage channels Π94. Method according to one of Claims 1 to 3, characterized in that at least one channel is formed at least in intervals along the recess (190). 5. The 1-4. Method according to one of Claims 1 to 3, characterized in that the base material is coated with lacquer at least one before and / or after the formation of the at least one recess (190), in particular dripA) ß4acryl / or, ^ 6. Method according to one of Claims 1 to 3, characterized in that the home material is provided with a contact surface, in particular a solder surface, where the contact is contacted, preferably electrically conductive to the electrically conductive material. 7. Λζ 1 - 6. Method according to one of Claims 1 to 3, characterized in that the at least one recess (190) is filled with a liquefied electrically conductive and / or magnetic material and the liquefied material is then solidified. 8. Acts 1-7. Method according to one of Claims 1 to 3, characterized in that at least one cell and / or at least one element (192), in particular a filament element, is applied to the base material, in particular, is printed and / or embedded in the at least one recess. 9. A method according to any one of claims 1 to 5, characterized in that the method is carried out in a single pass on a printing machine and / or in an offline operation; A carrier (60) especially for packaging (10), comprising a base material in which at least one recess (190) is formed by at least one material separation process, a laser cut and milling group, and at least at intervals with electrically conductive and / or magnetic material. , wherein the electrically conductive and / or magnetic material is truncated by a knife and / or printing process, in particular by screen printing, exo printing 11, offset printing, or gravure loading into the at least one recess (190) and the base material is selected from the group of cgv which is paper, cardboard paperboard, wood, plastic, composite material - in particular glass fiber reinforced plastic - and laminated material, in particular laminated cardboard, Carrier (60) according to Claim 9 or 10, characterized in that the at least one recess (190) is at least 10 µm deep and / or 650 µm deep and / or at least 0.1 mm wide at least in sections. / or up to 30 cm wide A carrier (60) according to claim 10 or claim 11. characterized in that at least one active and / or passive electrical component is disposed on the base material and / or at least two halves of the element are mounted on areas of the base material spaced apart. A package (10) comprising at least one carrier. (60.}), which can be produced and / or produced by a method according to one of claims 1 to 9 and / or according to one of the claims 2 to 2 of the KM.