HU188716B - Process for preliminary pulverization of targets in plasmatron-pulverizers - Google Patents

Process for preliminary pulverization of targets in plasmatron-pulverizers Download PDF

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Publication number
HU188716B
HU188716B HU356481A HU356481A HU188716B HU 188716 B HU188716 B HU 188716B HU 356481 A HU356481 A HU 356481A HU 356481 A HU356481 A HU 356481A HU 188716 B HU188716 B HU 188716B
Authority
HU
Hungary
Prior art keywords
discharge
value
discharge power
power
arc
Prior art date
Application number
HU356481A
Other languages
English (en)
Hungarian (hu)
Inventor
Karl Bader
Peter Vetters
Klaus Goedicke
Johannes Hartung
Original Assignee
Kombinat Veb Keramische Werke,Dd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kombinat Veb Keramische Werke,Dd filed Critical Kombinat Veb Keramische Werke,Dd
Publication of HU188716B publication Critical patent/HU188716B/hu

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
HU356481A 1980-12-03 1981-11-27 Process for preliminary pulverization of targets in plasmatron-pulverizers HU188716B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD22567180 1980-12-03

Publications (1)

Publication Number Publication Date
HU188716B true HU188716B (en) 1986-05-28

Family

ID=5527592

Family Applications (1)

Application Number Title Priority Date Filing Date
HU356481A HU188716B (en) 1980-12-03 1981-11-27 Process for preliminary pulverization of targets in plasmatron-pulverizers

Country Status (3)

Country Link
DE (1) DE3121389A1 (de)
HU (1) HU188716B (de)
PL (1) PL133187B1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4943325A (en) * 1988-10-19 1990-07-24 Black & Veatch, Engineers-Architects Reflector assembly
US5009764A (en) * 1989-01-13 1991-04-23 Advanced Energy Industries, Inc. Apparatus for removal of electrical shorts in a sputtering system
US4963238A (en) * 1989-01-13 1990-10-16 Siefkes Jerry D Method for removal of electrical shorts in a sputtering system
EP0636285B1 (de) * 1992-04-16 1996-09-04 Advanced Energy Industries, Inc. Stabilisator fuer schalt-mode geleistet radio-frequenz plasma einrichtung
JP3631246B2 (ja) * 1992-09-30 2005-03-23 アドバンスド エナージィ インダストリーズ，インコーポレイテッド 形状的に精密な薄膜フィルムコーティングシステム
US6217717B1 (en) 1992-12-30 2001-04-17 Advanced Energy Industries, Inc. Periodically clearing thin film plasma processing system
US5718813A (en) * 1992-12-30 1998-02-17 Advanced Energy Industries, Inc. Enhanced reactive DC sputtering system
US5427669A (en) * 1992-12-30 1995-06-27 Advanced Energy Industries, Inc. Thin film DC plasma processing system
DE4441206C2 (de) * 1994-11-19 1996-09-26 Leybold Ag Einrichtung für die Unterdrückung von Überschlägen in Kathoden-Zerstäubungseinrichtungen
WO1996031899A1 (en) 1995-04-07 1996-10-10 Advanced Energy Industries, Inc. Adjustable energy quantum thin film plasma processing system
US5576939A (en) * 1995-05-05 1996-11-19 Drummond; Geoffrey N. Enhanced thin film DC plasma power supply
US5584974A (en) * 1995-10-20 1996-12-17 Eni Arc control and switching element protection for pulsed dc cathode sputtering power supply
US5682067A (en) * 1996-06-21 1997-10-28 Sierra Applied Sciences, Inc. Circuit for reversing polarity on electrodes
US5990668A (en) * 1997-11-07 1999-11-23 Sierra Applied Sciences, Inc. A.C. power supply having combined regulator and pulsing circuits
US6011704A (en) * 1997-11-07 2000-01-04 Sierra Applied Sciences, Inc. Auto-ranging power supply
US5889391A (en) * 1997-11-07 1999-03-30 Sierra Applied Sciences, Inc. Power supply having combined regulator and pulsing circuits
US5910886A (en) * 1997-11-07 1999-06-08 Sierra Applied Sciences, Inc. Phase-shift power supply
US5993613A (en) * 1997-11-07 1999-11-30 Sierra Applied Sciences, Inc. Method and apparatus for periodic polarity reversal during an active state
US6139701A (en) * 1997-11-26 2000-10-31 Applied Materials, Inc. Copper target for sputter deposition
US6315872B1 (en) 1997-11-26 2001-11-13 Applied Materials, Inc. Coil for sputter deposition
US6001227A (en) * 1997-11-26 1999-12-14 Applied Materials, Inc. Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target

Also Published As

Publication number Publication date
DE3121389A1 (de) 1982-08-19
PL234006A1 (de) 1982-07-19
PL133187B1 (en) 1985-05-31

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