HU168090B - - Google Patents

Info

Publication number
HU168090B
HU168090B HUOI000165A HU168090B HU 168090 B HU168090 B HU 168090B HU OI000165 A HUOI000165 A HU OI000165A HU 168090 B HU168090 B HU 168090B
Authority
HU
Hungary
Application number
Other languages
Hungarian (hu)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to HUOI000165 priority Critical patent/HU168090B/hu
Priority to DD18219774A priority patent/DD115159A5/xx
Priority to DE19742452888 priority patent/DE2452888B2/en
Priority to FR7437558A priority patent/FR2251983A1/fr
Priority to GB4924774A priority patent/GB1452563A/en
Priority to NL7414957A priority patent/NL7414957A/en
Publication of HU168090B publication Critical patent/HU168090B/hu

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
HUOI000165 1973-11-15 1973-11-15 HU168090B (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
HUOI000165 HU168090B (en) 1973-11-15 1973-11-15
DD18219774A DD115159A5 (en) 1973-11-15 1974-11-06
DE19742452888 DE2452888B2 (en) 1973-11-15 1974-11-07 PRE-TREATMENT PROCESS OF CARRIER PLATES FOR THE PRODUCTION OF PRINTED CIRCUITS
FR7437558A FR2251983A1 (en) 1973-11-15 1974-11-14
GB4924774A GB1452563A (en) 1973-11-15 1974-11-14 Additive process for the production of printed circuit boards
NL7414957A NL7414957A (en) 1973-11-15 1974-11-15 PROCEDURE FOR CREATING PRINTED LINKS ACCORDING TO THE ADDITIVE METHOD.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
HUOI000165 HU168090B (en) 1973-11-15 1973-11-15

Publications (1)

Publication Number Publication Date
HU168090B true HU168090B (en) 1976-02-28

Family

ID=11000251

Family Applications (1)

Application Number Title Priority Date Filing Date
HUOI000165 HU168090B (en) 1973-11-15 1973-11-15

Country Status (6)

Country Link
DD (1) DD115159A5 (en)
DE (1) DE2452888B2 (en)
FR (1) FR2251983A1 (en)
GB (1) GB1452563A (en)
HU (1) HU168090B (en)
NL (1) NL7414957A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3021896A1 (en) * 1980-06-06 1982-03-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen METHOD FOR PRODUCING PRINTED CIRCUITS
FR2498873A1 (en) * 1981-01-23 1982-07-30 Sev Alternateurs Printed circuit mfr. using thick film track - subsequently thickened by chemical-and electro-deposition
CN109327974A (en) * 2018-11-06 2019-02-12 江苏博敏电子有限公司 Ultralow copper tooth copper foil promotes peel strength laminates method

Also Published As

Publication number Publication date
NL7414957A (en) 1975-05-20
DD115159A5 (en) 1975-09-12
DE2452888B2 (en) 1976-11-04
FR2251983A1 (en) 1975-06-13
DE2452888A1 (en) 1975-05-22
GB1452563A (en) 1976-10-13

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