HK89192A - Circuit block - Google Patents
Circuit blockInfo
- Publication number
- HK89192A HK89192A HK891/92A HK89192A HK89192A HK 89192 A HK89192 A HK 89192A HK 891/92 A HK891/92 A HK 891/92A HK 89192 A HK89192 A HK 89192A HK 89192 A HK89192 A HK 89192A
- Authority
- HK
- Hong Kong
- Prior art keywords
- circuit block
- wires
- integrated circuit
- lead
- lead frame
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
-
- H10W70/421—
-
- H10W70/475—
-
- H10W72/07554—
-
- H10W72/5445—
-
- H10W72/5449—
-
- H10W72/547—
-
- H10W72/5524—
-
- H10W90/756—
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986031016U JPS62142850U (enExample) | 1986-03-04 | 1986-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK89192A true HK89192A (en) | 1992-11-20 |
Family
ID=12319738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK891/92A HK89192A (en) | 1986-03-04 | 1992-11-12 | Circuit block |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS62142850U (enExample) |
| DE (1) | DE3706344A1 (enExample) |
| GB (1) | GB2189934B (enExample) |
| HK (1) | HK89192A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07211856A (ja) * | 1994-01-12 | 1995-08-11 | Fujitsu Ltd | 集積回路モジュール |
| GB2317990B (en) * | 1994-01-12 | 1998-08-12 | Fujitsu Ltd | Hybrid integrated circuit module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3760090A (en) * | 1971-08-19 | 1973-09-18 | Globe Union Inc | Electronic circuit package and method for making same |
| DE3106376A1 (de) * | 1981-02-20 | 1982-09-09 | Siemens AG, 1000 Berlin und 8000 München | Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern |
| US4567545A (en) * | 1983-05-18 | 1986-01-28 | Mettler Rollin W Jun | Integrated circuit module and method of making same |
| JPS60138931A (ja) * | 1983-12-27 | 1985-07-23 | Mitsubishi Electric Corp | 半導体集積回路装置 |
| DE3401286C2 (de) * | 1984-01-16 | 1986-02-20 | Deubzer-Eltec GmbH, 8000 München | Bondgerät |
-
1986
- 1986-03-04 JP JP1986031016U patent/JPS62142850U/ja active Pending
-
1987
- 1987-02-26 GB GB8704550A patent/GB2189934B/en not_active Expired
- 1987-02-27 DE DE19873706344 patent/DE3706344A1/de not_active Ceased
-
1992
- 1992-11-12 HK HK891/92A patent/HK89192A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62142850U (enExample) | 1987-09-09 |
| DE3706344A1 (de) | 1987-09-10 |
| GB2189934B (en) | 1989-11-08 |
| GB2189934A (en) | 1987-11-04 |
| GB8704550D0 (en) | 1987-04-01 |
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