HK57085A - Hermetically sealed package - Google Patents

Hermetically sealed package

Info

Publication number
HK57085A
HK57085A HK570/85A HK57085A HK57085A HK 57085 A HK57085 A HK 57085A HK 570/85 A HK570/85 A HK 570/85A HK 57085 A HK57085 A HK 57085A HK 57085 A HK57085 A HK 57085A
Authority
HK
Hong Kong
Prior art keywords
hermetically sealed
sealed package
package
hermetically
sealed
Prior art date
Application number
HK570/85A
Other languages
English (en)
Inventor
Hitoshi Ikeno
Original Assignee
Seikosha Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosha Kk filed Critical Seikosha Kk
Publication of HK57085A publication Critical patent/HK57085A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
HK570/85A 1980-09-02 1985-08-01 Hermetically sealed package HK57085A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55121624A JPS5745955A (en) 1980-09-02 1980-09-02 Sealing container

Publications (1)

Publication Number Publication Date
HK57085A true HK57085A (en) 1985-08-09

Family

ID=14815861

Family Applications (1)

Application Number Title Priority Date Filing Date
HK570/85A HK57085A (en) 1980-09-02 1985-08-01 Hermetically sealed package

Country Status (6)

Country Link
US (1) US4420652A (ja)
JP (1) JPS5745955A (ja)
DE (1) DE3134557A1 (ja)
GB (1) GB2086140B (ja)
HK (1) HK57085A (ja)
SG (1) SG33785G (ja)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1281810C (en) * 1984-02-20 1991-03-19 Stephen P. Rogerson Mounting of saw devices
US4577056A (en) * 1984-04-09 1986-03-18 Olin Corporation Hermetically sealed metal package
US4654472A (en) * 1984-12-17 1987-03-31 Samuel Goldfarb Electronic component package with multiconductive base forms for multichannel mounting
FR2587857B1 (fr) * 1985-09-24 1987-12-24 Centre Nat Rech Scient Oscillateur thermostate miniature
US4945399A (en) * 1986-09-30 1990-07-31 International Business Machines Corporation Electronic package with integrated distributed decoupling capacitors
JPS6386554A (ja) * 1986-09-30 1988-04-16 インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション 電子的パッケ−ジ
US4792880A (en) * 1986-10-03 1988-12-20 Westinghouse Electric Corp. Terminal module
US4744008A (en) * 1986-11-18 1988-05-10 International Business Machines Corporation Flexible film chip carrier with decoupling capacitors
US5032692A (en) * 1989-05-09 1991-07-16 Avx Corporation Process for manufactoring hermetic high temperature filter packages and the products produced thereby
DE4014918A1 (de) * 1990-05-10 1991-11-14 Grundfos Int Elektromotor
DE4217837B4 (de) * 1991-05-29 2006-04-27 Mitsubishi Denki K.K. Hermetisch abgeschlossenes Gehäuse
JP2667104B2 (ja) * 1993-08-04 1997-10-27 飯島精密工業株式会社 円筒の精度検査装置
JPH0718381U (ja) * 1993-09-06 1995-03-31 住友電装株式会社 コネクタ
DE4419439C2 (de) * 1994-06-03 1997-09-11 Philips Patentverwaltung Anordnung mit einem elektrische Bauelemente enthaltenden Behälter und einer weitere Bauelemente tragenden Leiterplatte
US5500628A (en) * 1995-01-24 1996-03-19 Motorola, Inc. Double-sided oscillator package and method of coupling components thereto
US5620476A (en) * 1995-11-13 1997-04-15 Pacesetter, Inc. Implantable medical device having shielded and filtered feedthrough assembly and methods for making such assembly
WO1998001297A1 (en) * 1996-07-09 1998-01-15 Panex Corporation Quartz construction
US6121678A (en) 1997-12-19 2000-09-19 Stmicroelectronics, Inc. Wrap-around interconnect for fine pitch ball grid array
US6349025B1 (en) 1999-11-30 2002-02-19 Medtronic, Inc. Leak testable capacitive filtered feedthrough for an implantable medical device
US6414835B1 (en) 2000-03-01 2002-07-02 Medtronic, Inc. Capacitive filtered feedthrough array for an implantable medical device
US6590158B1 (en) * 2002-03-15 2003-07-08 Alstom Schilling Robotics Pressure container with layered seal assembly
DE10236278A1 (de) * 2002-08-08 2004-02-26 Schott Glas Hermetisches TO-Gehäuse mit Keramikanschluss für erhöhte Datenraten
DE602004027420D1 (de) 2004-01-14 2010-07-08 Royce Mckim Modul zur automatischen bekämpfung von kochfeldbränden
US6992251B1 (en) * 2004-08-31 2006-01-31 Sung Jung Minute Industry Co., Ltd. Rectification chip terminal structure
US20110048770A1 (en) * 2009-08-31 2011-03-03 Medtronic Inc. Injection molded ferrule for cofired feedthroughs
US8644002B2 (en) 2011-05-31 2014-02-04 Medtronic, Inc. Capacitor including registration feature for aligning an insulator layer
US8844103B2 (en) 2011-09-01 2014-09-30 Medtronic, Inc. Methods for making feedthrough assemblies including a capacitive filter array
US8644936B2 (en) 2012-01-09 2014-02-04 Medtronic, Inc. Feedthrough assembly including electrical ground through feedthrough substrate
USD818512S1 (en) 2015-12-08 2018-05-22 Carl Zeiss Sports Optics Gmbh Spotting scope
USD817376S1 (en) 2015-12-08 2018-05-08 Carl Zeiss Sports Optics Gmbh Spotting scope
US10765428B2 (en) 2016-08-15 2020-09-08 Covidien Lp Hermetic force sensors for surgical devices
US10345165B2 (en) 2016-09-08 2019-07-09 Covidien Lp Force sensor for surgical devices
US10857368B2 (en) 2017-03-27 2020-12-08 Greatbatch Ltd. Flexible hermetic membranes with electrically conducting vias
US10973142B2 (en) 2017-05-18 2021-04-06 Covidien Lp Hermetically sealed printed circuit boards
US10588231B2 (en) 2017-05-18 2020-03-10 Covidien Lp Hermetically sealed printed circuit boards
US10667408B2 (en) 2017-05-18 2020-05-26 Covidien Lp Fully encapsulated electronics and printed circuit boards

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3339117A (en) * 1965-03-18 1967-08-29 Cons Electronics Ind Printed circuit board forming closure for electrical relay
US3828210A (en) * 1973-01-22 1974-08-06 Motorola Inc Temperature compensated mounting structure for coupled resonator crystals
US4152671A (en) * 1977-07-25 1979-05-01 Atari, Inc. Oscillator-modulator apparatus and method therefor
DE2936715C2 (de) * 1979-09-11 1983-11-24 Siemens AG, 1000 Berlin und 8000 München Geschirmte Baugruppe

Also Published As

Publication number Publication date
JPS5745955A (en) 1982-03-16
US4420652A (en) 1983-12-13
JPS6119116B2 (ja) 1986-05-15
GB2086140B (en) 1984-05-10
SG33785G (en) 1986-05-02
DE3134557A1 (de) 1982-06-24
GB2086140A (en) 1982-05-06
DE3134557C2 (ja) 1987-10-15

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