HK1254632A1 - 柔性聚合物片材的金屬化 - Google Patents

柔性聚合物片材的金屬化

Info

Publication number
HK1254632A1
HK1254632A1 HK18113599.8A HK18113599A HK1254632A1 HK 1254632 A1 HK1254632 A1 HK 1254632A1 HK 18113599 A HK18113599 A HK 18113599A HK 1254632 A1 HK1254632 A1 HK 1254632A1
Authority
HK
Hong Kong
Prior art keywords
metalization
flexible polymer
polymer sheets
sheets
flexible
Prior art date
Application number
HK18113599.8A
Other languages
English (en)
Inventor
斯科特‧維德曼
Original Assignee
環球太陽能公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 環球太陽能公司 filed Critical 環球太陽能公司
Publication of HK1254632A1 publication Critical patent/HK1254632A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Energy (AREA)
  • Sustainable Development (AREA)
  • Laminated Bodies (AREA)
  • Photovoltaic Devices (AREA)
HK18113599.8A 2015-10-02 2018-10-24 柔性聚合物片材的金屬化 HK1254632A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/873,602 US10131998B2 (en) 2015-10-02 2015-10-02 Metalization of flexible polymer sheets
PCT/US2016/054814 WO2017059265A1 (en) 2015-10-02 2016-09-30 Metalization of flexible polymer sheets

Publications (1)

Publication Number Publication Date
HK1254632A1 true HK1254632A1 (zh) 2019-07-26

Family

ID=58427888

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18113599.8A HK1254632A1 (zh) 2015-10-02 2018-10-24 柔性聚合物片材的金屬化

Country Status (5)

Country Link
US (2) US10131998B2 (zh)
EP (1) EP3357095A4 (zh)
CN (1) CN108307663A (zh)
HK (1) HK1254632A1 (zh)
WO (1) WO2017059265A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1956492B1 (en) 1999-09-21 2018-09-05 Wyse Technology L.L.C. Displaying windowing application programs on a terminal
US11129906B1 (en) 2016-12-07 2021-09-28 David Gordon Bermudes Chimeric protein toxins for expression by therapeutic bacteria
TW201942418A (zh) * 2018-04-02 2019-11-01 美商全球太陽能公司 可撓性聚合物片材之金屬化
AU2019299000B2 (en) * 2018-07-06 2023-01-19 Merlin Solar Technologies, Inc. Method for blackening a metallic article

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3414487A (en) * 1965-06-30 1968-12-03 Texas Instruments Inc Method of manufacturing printed circuits
GB1282565A (en) * 1968-10-18 1972-07-19 Emi Ltd Improvements relating to the formation of metallic patterns on insulating surfaces involving electroplating
US3969199A (en) 1975-07-07 1976-07-13 Gould Inc. Coating aluminum with a strippable copper deposit
US4169018A (en) 1978-01-16 1979-09-25 Gould Inc. Process for electroforming copper foil
US5233157A (en) 1990-09-11 1993-08-03 Hughes Aircraft Company Laser pattern ablation of fine line circuitry masters
US5221458A (en) 1990-12-24 1993-06-22 Xerox Corporation Electroforming process for endless metal belt assembly with belts that are increasingly compressively stressed
US5283121A (en) * 1991-11-08 1994-02-01 Bordner Barry A Corrosion and abrasion resistant industrial roll coating with non-sticking properties
US5322975A (en) 1992-09-18 1994-06-21 Gould Electronics Inc. Universal carrier supported thin copper line
US5863666A (en) 1997-08-07 1999-01-26 Gould Electronics Inc. High performance flexible laminate
US6303193B1 (en) * 1998-11-05 2001-10-16 General Electric Company Process for fabricating a tool used in electrochemical machining
US7194197B1 (en) 2000-03-16 2007-03-20 Global Solar Energy, Inc. Nozzle-based, vapor-phase, plume delivery structure for use in production of thin-film deposition layer
US6372538B1 (en) 2000-03-16 2002-04-16 University Of Delaware Fabrication of thin-film, flexible photovoltaic module
US6310281B1 (en) 2000-03-16 2001-10-30 Global Solar Energy, Inc. Thin-film, flexible photovoltaic module
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
US20050133375A1 (en) * 2002-06-28 2005-06-23 Gunter Schmid Method of producing electrodeposited antennas for RF ID tags by means of selectively introduced adhesive
US20060163073A1 (en) * 2003-06-27 2006-07-27 Nobuhiro Higashihara Process for producing metal plating film, process for producing electronic part and plating film forming apparatus
US8435373B2 (en) * 2005-06-20 2013-05-07 Microcontinumm, Inc. Systems and methods for roll-to-roll patterning
GB0620955D0 (en) * 2006-10-20 2006-11-29 Speakman Stuart P Methods and apparatus for the manufacture of microstructures
US8062922B2 (en) 2008-03-05 2011-11-22 Global Solar Energy, Inc. Buffer layer deposition for thin-film solar cells
US8759664B2 (en) 2009-12-28 2014-06-24 Hanergy Hi-Tech Power (Hk) Limited Thin film solar cell strings
WO2013158796A1 (en) 2012-04-17 2013-10-24 Global Solar Energy, Inc. Integrated thin film solar cell interconnection
CN103789806B (zh) * 2013-12-12 2016-08-17 深圳首创新能源股份有限公司 电镀槽

Also Published As

Publication number Publication date
EP3357095A1 (en) 2018-08-08
US10131998B2 (en) 2018-11-20
WO2017059265A1 (en) 2017-04-06
US20170096743A1 (en) 2017-04-06
CN108307663A (zh) 2018-07-20
EP3357095A4 (en) 2019-03-13
US20180355495A1 (en) 2018-12-13

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