HK1250530A1 - 封裝傳感器的封裝和方法 - Google Patents

封裝傳感器的封裝和方法

Info

Publication number
HK1250530A1
HK1250530A1 HK18109895.7A HK18109895A HK1250530A1 HK 1250530 A1 HK1250530 A1 HK 1250530A1 HK 18109895 A HK18109895 A HK 18109895A HK 1250530 A1 HK1250530 A1 HK 1250530A1
Authority
HK
Hong Kong
Prior art keywords
packages
methods
packaging sensors
packaging
sensors
Prior art date
Application number
HK18109895.7A
Other languages
English (en)
Inventor
Danny, (Duy) Do
Nguyen Tom
Cuong Nguyen Kevin
Martinez Claudio
Original Assignee
Dunan Sensing Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dunan Sensing Llc filed Critical Dunan Sensing Llc
Publication of HK1250530A1 publication Critical patent/HK1250530A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G01L19/0076—Electrical connection means from the sensor to its support using buried connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Fluid Pressure (AREA)
  • Micromachines (AREA)
HK18109895.7A 2016-07-26 2018-07-31 封裝傳感器的封裝和方法 HK1250530A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/220,048 US10246320B2 (en) 2016-07-26 2016-07-26 Packages and methods of packaging sensors

Publications (1)

Publication Number Publication Date
HK1250530A1 true HK1250530A1 (zh) 2018-12-21

Family

ID=59501219

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18109895.7A HK1250530A1 (zh) 2016-07-26 2018-07-31 封裝傳感器的封裝和方法

Country Status (4)

Country Link
US (1) US10246320B2 (zh)
EP (1) EP3276324A1 (zh)
CN (1) CN107655620A (zh)
HK (1) HK1250530A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11313748B2 (en) * 2019-01-18 2022-04-26 Mueller International, Llc Pressure monitor housing with cap-engaging projection

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09280987A (ja) * 1996-04-10 1997-10-31 Fuji Electric Co Ltd 静電容量型圧力センサ
JP3309808B2 (ja) * 1998-08-04 2002-07-29 株式会社デンソー 圧力検出装置
JP2005156307A (ja) * 2003-11-25 2005-06-16 Denso Corp 圧力センサ
ITTO20080484A1 (it) * 2008-06-19 2009-12-20 Eltek Spa Dispositivo sensore di pressione
ITTO20080485A1 (it) * 2008-06-19 2009-12-20 Eltek Spa Dispositivo sensore di pressione
EP2594917B1 (en) * 2010-07-13 2018-02-14 Mitsubishi Electric Corporation Pressure sensor unit and brake device
JP5877005B2 (ja) * 2011-07-29 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板保持装置、および、基板保持方法
DE102012025518B4 (de) * 2012-12-21 2022-08-18 I2S Intelligente Sensorsysteme Dresden Gmbh Drucksensorelement
ITTO20121130A1 (it) * 2012-12-21 2014-06-22 Metallux Sa Sensore di pressione
US9506829B2 (en) 2014-06-20 2016-11-29 Dunan Sensing Llc Pressure sensors having low cost, small, universal packaging
CN104048703B (zh) * 2014-06-25 2017-01-25 江门市泓科电子科技有限公司 多功能流量传感器
CN205228700U (zh) * 2015-12-23 2016-05-11 中国重汽集团济南动力有限公司 一种用于检测车用尿素溶液的压力传感器

Also Published As

Publication number Publication date
US20180029877A1 (en) 2018-02-01
EP3276324A1 (en) 2018-01-31
US10246320B2 (en) 2019-04-02
CN107655620A (zh) 2018-02-02

Similar Documents

Publication Publication Date Title
SG10201504476WA (en) Semiconductor packages and methods of packaging semiconductor devices
PL3318498T3 (pl) Sposób i urządzenie do pakowania grup obiektów
HK1252634A1 (zh) 袋式包裝物以及用於適配此類包裝物的相關聯方法
PL2977334T3 (pl) Opakowanie na papierosy i sposób i urządzenie do wytwarzania tego rodzaju opakowań
PL3050814T3 (pl) Urządzenie pakujące i sposób jego działania
HK1243040A1 (zh) 底部帶有撐板的包裝和熱封方法
SG10201607486YA (en) Improved packaging and method of manufacturing same
EP3440998A4 (en) MEASUREMENT SENSOR HOUSING AND MEASUREMENT SENSOR
GB2555659B (en) Package for MEMS device and process
EP3274292A4 (en) Methods of forming sensor integrated packages and structures formed thereby
PL3186162T3 (pl) Folia opakowaniowa i sposób jej wytwarzania
PL3183173T3 (pl) Opakowanie i sposób jego wytwarzania
EP3395242A4 (en) MEASUREMENT SENSOR MODULE AND MEASUREMENT SENSOR
SG11201707382UA (en) Packaging bag and packaged product
PT3470349T (pt) Recipiente e embalagem
HK1250530A1 (zh) 封裝傳感器的封裝和方法
TWI560816B (en) Embedded package and packaging method
PL3218286T3 (pl) Element opakowania i sposób pakownia
EP3239070A4 (en) Cigarette package and blank constituting outer packaging member thereof
GB2536842B (en) Method of making packages having re-closable zipper on one panel and package thereof
EP3410127A4 (en) MEASUREMENT SENSOR HOUSING, AND MEASUREMENT SENSOR
EP3385984A4 (en) SENSOR PACKAGING STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF
GB201402548D0 (en) Packaging web and package
PL3112283T3 (pl) Element wylewowy do opakowania oraz opakowanie kompozytowe z takim elementem wylewowym
GB201410937D0 (en) Packaging and packaging blank