HK1249340A1 - 數據中心模塊化系統 - Google Patents
數據中心模塊化系統Info
- Publication number
- HK1249340A1 HK1249340A1 HK18108779.0A HK18108779A HK1249340A1 HK 1249340 A1 HK1249340 A1 HK 1249340A1 HK 18108779 A HK18108779 A HK 18108779A HK 1249340 A1 HK1249340 A1 HK 1249340A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- data center
- modular systems
- center modular
- systems
- data
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/26—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662364161P | 2016-07-19 | 2016-07-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1249340A1 true HK1249340A1 (zh) | 2018-10-26 |
Family
ID=59383976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK18108779.0A HK1249340A1 (zh) | 2016-07-19 | 2018-07-06 | 數據中心模塊化系統 |
Country Status (7)
Country | Link |
---|---|
US (2) | US10716242B2 (zh) |
EP (1) | EP3277067B1 (zh) |
CN (1) | CN207382766U (zh) |
DE (1) | DE202017104313U1 (zh) |
DK (1) | DK3277067T3 (zh) |
HK (1) | HK1249340A1 (zh) |
TW (1) | TWI640859B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10327359B1 (en) * | 2018-04-30 | 2019-06-18 | Baidu Usa Llc | Coupling designs for a data center building using indirect evaporative cooling (IDEC) units |
WO2021030757A1 (en) | 2019-08-15 | 2021-02-18 | Equinix, Inc. | Data center rack system |
CN111405817A (zh) * | 2020-03-24 | 2020-07-10 | 北京稳力科技有限公司 | 电机控制器一体化水冷/风冷散热系统 |
CA194364S (en) * | 2020-04-03 | 2022-05-18 | Nat Environmental Prod | Modular outdoor server rack and fan enclosure |
US11324146B2 (en) | 2020-07-02 | 2022-05-03 | Google Llc | Modular data center serverhall assembly |
US20220151114A1 (en) * | 2020-11-11 | 2022-05-12 | Nvidia Corporation | Intelligent above-platform push coupling for datacenter cooling systems |
US11758683B2 (en) * | 2020-11-16 | 2023-09-12 | Sebastian Sanchez | Modular switch rack |
JP2023552920A (ja) | 2020-11-25 | 2023-12-19 | デジタル ポーポイス エルエルシー | オフセット冷却技術を含むデータセンタのための冷却システム |
CN113141757B (zh) * | 2021-03-31 | 2022-05-17 | 浙江一舟电子科技股份有限公司 | 一种数据中心基于蒸发装置和通风装置的湿度补偿系统 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7114555B2 (en) * | 2002-05-31 | 2006-10-03 | Hewlett-Packard Development Company, L.P. | Controlled cooling of a data center |
GB2407709A (en) * | 2003-10-31 | 2005-05-04 | Hewlett Packard Development Co | Cooling a plurality of computers |
CN101501599B (zh) | 2006-06-01 | 2011-12-21 | 谷歌公司 | 模块化计算环境 |
US7430118B1 (en) | 2007-06-04 | 2008-09-30 | Yahoo! Inc. | Cold row encapsulation for server farm cooling system |
US8763414B2 (en) | 2008-03-31 | 2014-07-01 | Google Inc. | Warm floor data center |
US8031468B2 (en) | 2009-06-03 | 2011-10-04 | American Power Conversion Corporation | Hot aisle containment cooling unit and method for cooling |
US7944692B2 (en) * | 2009-06-12 | 2011-05-17 | American Power Conversion Corporation | Method and apparatus for installation and removal of overhead cooling equipment |
WO2012083166A2 (en) | 2010-12-16 | 2012-06-21 | Smartcube, Llc | Portable computer server enclosure |
US8355248B2 (en) | 2010-12-16 | 2013-01-15 | Intel Corporation | Apparatus and system for improved thermal radiation for a mobile computing device and case |
CN103477299B (zh) * | 2011-02-07 | 2017-10-17 | 戴尔产品有限公司 | 用一定的模式在模块化数据中心中模块化流体处理系统的系统和方法 |
CN202083990U (zh) | 2011-06-17 | 2011-12-21 | 北京中泰恒信电力技术有限公司 | 集装箱式高密度数据中心 |
US20130032310A1 (en) | 2011-08-02 | 2013-02-07 | Power Distribution Inc. | Transportable, environmentally-controlled equipment enclosure |
US9313929B1 (en) * | 2012-05-29 | 2016-04-12 | Google Inc. | Managing data center airflow |
US9572288B2 (en) * | 2013-10-03 | 2017-02-14 | Liebert Corporation | System and method for modular data center |
US9357681B2 (en) * | 2014-05-22 | 2016-05-31 | Amazon Technologies, Inc. | Modular data center row infrastructure |
-
2017
- 2017-07-19 DK DK17182176.2T patent/DK3277067T3/da active
- 2017-07-19 US US15/653,973 patent/US10716242B2/en active Active
- 2017-07-19 EP EP17182176.2A patent/EP3277067B1/en active Active
- 2017-07-19 DE DE202017104313.4U patent/DE202017104313U1/de active Active
- 2017-07-19 CN CN201720883888.7U patent/CN207382766U/zh active Active
- 2017-07-19 TW TW106124180A patent/TWI640859B/zh active
-
2018
- 2018-07-06 HK HK18108779.0A patent/HK1249340A1/zh unknown
-
2020
- 2020-07-10 US US16/925,626 patent/US11477917B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE202017104313U1 (de) | 2017-11-20 |
EP3277067A1 (en) | 2018-01-31 |
US11477917B2 (en) | 2022-10-18 |
DK3277067T3 (da) | 2020-07-27 |
CN207382766U (zh) | 2018-05-18 |
US10716242B2 (en) | 2020-07-14 |
EP3277067B1 (en) | 2020-05-06 |
US20180027701A1 (en) | 2018-01-25 |
TWI640859B (zh) | 2018-11-11 |
US20200344917A1 (en) | 2020-10-29 |
TW201805764A (zh) | 2018-02-16 |
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