HK1246971A1 - 用於最小化蝕刻停止材料損壞的包括可變能量束的激光燒蝕系統 - Google Patents

用於最小化蝕刻停止材料損壞的包括可變能量束的激光燒蝕系統

Info

Publication number
HK1246971A1
HK1246971A1 HK18106182.5A HK18106182A HK1246971A1 HK 1246971 A1 HK1246971 A1 HK 1246971A1 HK 18106182 A HK18106182 A HK 18106182A HK 1246971 A1 HK1246971 A1 HK 1246971A1
Authority
HK
Hong Kong
Prior art keywords
system including
energy beam
laser ablation
ablation system
stop material
Prior art date
Application number
HK18106182.5A
Other languages
English (en)
Inventor
Brian M Erwin
Bouwe W Leenstra
Nicholas A Polomoff
Courtney T Sheets
Matthew E Souter
Christopher L Tessler
Original Assignee
Suss Microtech Photonic Systems Inc
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtech Photonic Systems Inc, Ibm filed Critical Suss Microtech Photonic Systems Inc
Publication of HK1246971A1 publication Critical patent/HK1246971A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
HK18106182.5A 2014-12-30 2018-05-11 用於最小化蝕刻停止材料損壞的包括可變能量束的激光燒蝕系統 HK1246971A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/585,404 US20160184926A1 (en) 2014-12-30 2014-12-30 Laser ablation system including variable energy beam to minimize etch-stop material damage
PCT/US2015/066978 WO2016109272A2 (en) 2014-12-30 2015-12-21 Laser ablation system including variable energy beam to minimize etch-stop material damage

Publications (1)

Publication Number Publication Date
HK1246971A1 true HK1246971A1 (zh) 2018-09-14

Family

ID=56163157

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18106182.5A HK1246971A1 (zh) 2014-12-30 2018-05-11 用於最小化蝕刻停止材料損壞的包括可變能量束的激光燒蝕系統

Country Status (8)

Country Link
US (1) US20160184926A1 (zh)
EP (1) EP3241233A4 (zh)
JP (1) JP2018500182A (zh)
KR (1) KR20170102317A (zh)
CN (1) CN107430997A (zh)
HK (1) HK1246971A1 (zh)
TW (1) TW201627782A (zh)
WO (1) WO2016109272A2 (zh)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3587884B2 (ja) * 1994-07-21 2004-11-10 富士通株式会社 多層回路基板の製造方法
US6313435B1 (en) * 1998-11-20 2001-11-06 3M Innovative Properties Company Mask orbiting for laser ablated feature formation
EP1166358B1 (de) * 1999-04-07 2012-03-14 Saint-Gobain Glass France S.A. Verfahren zum abtragen von dünnen schichten auf einem trägermaterial
EP1065023A3 (en) * 1999-06-30 2003-09-10 Canon Kabushiki Kaisha Laser processing method, method for manufacturing ink jet recording head using such method of manufacture, and ink jet recording head manufactured by such method of manufacture
US6756563B2 (en) * 2002-03-07 2004-06-29 Orbotech Ltd. System and method for forming holes in substrates containing glass
KR101037142B1 (ko) * 2002-04-19 2011-05-26 일렉트로 사이언티픽 인더스트리즈, 아이엔씨 펄스 레이저를 이용한 기판의 프로그램 제어 다이싱
JP2006041082A (ja) * 2004-07-26 2006-02-09 Sharp Corp 半導体薄膜の結晶化装置および半導体薄膜の結晶化方法
EP1622435A1 (en) * 2004-07-28 2006-02-01 ATOTECH Deutschland GmbH Method of manufacturing an electronic circuit assembly using direct write techniques
US20070000884A1 (en) * 2005-06-30 2007-01-04 Salama Islam A Pattern ablation using laser patterning
US7244906B2 (en) * 2005-08-30 2007-07-17 Electro Scientific Industries, Inc. Energy monitoring or control of individual vias formed during laser micromachining
US9214385B2 (en) * 2009-12-17 2015-12-15 Globalfoundries Inc. Semiconductor device including passivation layer encapsulant
US8383984B2 (en) * 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
CN102843987A (zh) * 2010-04-13 2012-12-26 国际商业机器公司 采用激光消融修饰和/或平滑组织的系统和方法
US8642448B2 (en) * 2010-06-22 2014-02-04 Applied Materials, Inc. Wafer dicing using femtosecond-based laser and plasma etch
CN102759863B (zh) * 2011-04-27 2015-12-02 瑞世达科技(厦门)有限公司 激光光刻机
US8557683B2 (en) * 2011-06-15 2013-10-15 Applied Materials, Inc. Multi-step and asymmetrically shaped laser beam scribing
GB2507542B (en) * 2012-11-02 2016-01-13 M Solv Ltd Apparatus and Method for forming fine scale structures in the surface of a substrate to different depths

Also Published As

Publication number Publication date
JP2018500182A (ja) 2018-01-11
WO2016109272A2 (en) 2016-07-07
CN107430997A (zh) 2017-12-01
TW201627782A (zh) 2016-08-01
EP3241233A2 (en) 2017-11-08
EP3241233A4 (en) 2018-09-05
WO2016109272A3 (en) 2016-08-25
US20160184926A1 (en) 2016-06-30
KR20170102317A (ko) 2017-09-08

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